HIP6602B
NOT RECOMMENDED FOR NEW DESIGNS
INTERSIL RECOMMENDS:
ISL6612, ISL6612A, ISL6613, ISL6613A,
ISL6614, ISL6614A, ISL6622, ISL6625A
DATASHEET
FN9076
Rev 6.00
December 3, 2015
Dual Channel Synchronous Rectified Buck MOSFET Driver
The HIP6602B is a high frequency, two power channel
MOSFET driver specifically designed to drive four power
N-Channel MOSFETs in a synchronous rectified buck
converter topology. This device is available in either a
14-lead SOIC or a 16-lead QFN package with a PAD to
thermally enhance the package. These drivers combined
with a HIP63xx or ISL65xx series of Multi-Phase Buck PWM
controllers and MOSFETs form a complete core voltage
regulator solution for advanced microprocessors.
The HIP6602B drives both upper and lower gates over a
range of 5V to 12V. This drive-voltage flexibility provides the
advantage of optimizing applications involving trade-offs
between switching losses and conduction losses.
The output drivers in the HIP6602B have the capacity to
efficiently switch power MOSFETs at high frequencies. Each
driver is capable of driving a 3000pF load with a 30ns
propagation delay and 50ns transition time. This device
implements bootstrapping on the upper gates with a single
external capacitor and resistor required for each power
channel. This reduces implementation complexity and allows
the use of higher performance, cost effective, N-Channel
MOSFETs. Adaptive shoot-through protection is integrated
to prevent both MOSFETs from conducting simultaneously.
Features
• Drives Four N-Channel MOSFETs
• Adaptive Shoot-Through Protection
• Internal Bootstrap Devices
• Supports High Switching Frequency
- Fast Output Rise Time
- Propagation Delay 30ns
• Small 14-Lead SOIC Package
• Smaller 16-Lead QFN Thermally Enhanced Package
• 5V to 12V Gate-Drive Voltages for Optimal Efficiency
• Three-State Input for Bridge Shutdown
• Supply Undervoltage Protection
• Pb-Free Plus Anneal Available (RoHS Compliant)
• QFN Package:
- Compliant to JEDEC PUB95 MO-220
QFN - Quad Flat No Leads - Package Outline
- Near Chip Scale Package footprint, which improves
PCB efficiency and has a thinner profile
Ordering Information
PART NUMBER
HIP6602BCB
HIP6602BCB-T
HIP6602BCBZ (Note 1)
HIP6602BCBZ-T (Note 1)
HIP6602BCR
HIP6602BCR-T
HIP6602BCRZ (Note 1)
HIP6602BCRZ-T (Note 1)
HIP6602BCRZA (Note 1)
TEMP.
RANGE (°C)
0 to 85
PACKAGE
14 Ld SOIC
PKG.
DWG. #
M14.15
Applications
• Core Voltage Supplies for Intel Pentium® III and AMD®
Athlon
TM
Microprocessors.
• High-Frequency, Low-Profile DC/DC Converters
• High-Current, Low-Voltage DC/DC Converters
14 Ld SOIC Tape and Reel
0 to 85
14 Ld SOIC
(Pb-Free)
M14.15
14 Ld SOIC Tape and Reel (Pb-Free)
0 to 85
16 Ld 5x5 QFN
L16.5x5
16 Ld 5x5 QFN Tape and Reel
0 to 85
16 Ld 5x5 QFN
(Pb-Free)
L16.5x5
16 Ld 5x5 QFN Tape and Reel (Pb-Free)
0 to 85
16 Ld 5x5 QFN
(Pb-Free)
L16.5x5
HIP6602BCRZA-T (Note 1) 16 Ld 5x5 QFN Tape and Reel (Pb-Free)
NOTE:
1. Intersil Pb-free plus anneal products employ special Pb-free
material sets; molding compounds/die attach materials and 100%
matte tin plate termination finish, which are RoHS compliant and
compatible with both SnPb and Pb-free soldering operations.
Intersil Pb-free products are MSL classified at Pb-free peak reflow
temperatures that meet or exceed the Pb-free requirements of
IPC/JEDEC J STD-020.
FN9076 Rev 6.00
December 3, 2015
Page 1 of 12
HIP6602B
Absolute Maximum Ratings
Supply Voltage (VCC) . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .15V
Supply Voltage (PVCC) . . . . . . . . . . . . . . . . . . . . . . . . . VCC + 0.3V
BOOT Voltage (V
BOOT
- V
PHASE
) . . . . . . . . . . . . . . . . . . . . . . .15V
Input Voltage (V
PWM
) . . . . . . . . . . . . . . . . . . . . . . GND - 0.3V to 7V
UGATE. . . . . . .V
PHASE
- 5V(<400ns pulse width) to V
BOOT
+ 0.3V
V
PHASE
-0.3V(>400ns pulse width) to V
BOOT
+ 0.3V
LGATE . . . . . . . . . GND - 5V(<400ns pulse width) to V
PVCC
+ 0.3V
GND -0.3V(>400ns pulse width) to V
PVCC
+ 0.3V
PHASE. . . . . . . . . . . . . . . . . . GND -5V(<400ns pulse width) to 15V
GND -0.3V(>400ns pulse width) to 15V
ESD Rating
Human Body Model (Per MIL-STD-883 Method 3015.7) . . . . .3kV
Machine Model (Per EIAJ ED-4701 Method C-111) . . . . . . . .200V
Operating Conditions
Ambient Temperature Range. . . . . . . . . . . . . . . . . . . . . 0°C to 85°C
Maximum Operating Junction Temperature. . . . . . . . . . . . . . . 125°C
Supply Voltage, VCC . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12V
10%
Supply Voltage Range PVCC . . . . . . . . . . . . . . . . . . . . . 5V to 12V
Thermal Information
Thermal Resistance
JA
(°C/W)
JC
(°C/W)
SOIC Package (Note 2) . . . . . . . . . . . .
68
N/A
QFN Package (Note 3). . . . . . . . . . . . .
36
6
Maximum Junction Temperature (Plastic Package) . . . . . . . . 150°C
Maximum Storage Temperature Range . . . . . . . . . . . -65°C to 150°C
Maximum Lead Temperature (Soldering 10s) . . . . . . . . . . . . . 300°C
(SOIC - Lead Tips Only)
For Recommended soldering conditions see Tech Brief TB389.
CAUTION: Stresses above those listed in “Absolute Maximum Ratings” may cause permanent damage to the device. This is a stress only rating and operation of the
device at these or any other conditions above those indicated in the operational sections of this specification is not implied.
NOTES:
2.
JA
is measured with the component mounted on a high effective thermal conductivity test board in free air. See Tech Brief TB379 for details.
3.
JA
is measured in free air with the component mounted on a high effective thermal conductivity test board with “direct attach” features.
JC,
the
“case temp” is measured at the center of the exposed metal pad on the package underside. See Tech Brief TB379.
Electrical Specifications
PARAMETER
VCC SUPPLY CURRENT
Bias Supply Current
Power Supply Current
POWER-ON RESET
VCC Rising Threshold
VCC Falling Threshold
PWM INPUT
Input Current
PWM Rising Threshold
PWM Falling Threshold
UGATE Rise Time
LGATE Rise Time
UGATE Fall Time
LGATE Fall Time
Recommended Operating Conditions, unless otherwise specified.
SYMBOL
TEST CONDITIONS
MIN
TYP
MAX
UNITS
I
VCC
I
PVCC
f
PWM
= 500kHz, V
PVCC
= 12V
f
PWM
= 500kHz, V
PVCC
= 12V
-
-
3.7
2.0
5.0
4.0
mA
mA
9.7
7.3
9.95
7.6
10.4
8.0
V
V
I
PWM
V
PWM
= 0 or 5V (See Block Diagram)
V
PVCC
= 12V
V
PVCC
= 12V
-
-
-
-
-
-
-
-
-
1.4
-
500
3.6
1.45
20
50
20
20
30
20
-
230
-
-
-
-
-
-
-
-
-
3.6
-
µA
V
V
ns
ns
ns
ns
ns
ns
V
ns
mA
mA
TR
UGATE
TR
LGATE
TF
UGATE
TF
LGATE
V
PVCC
= V
VCC
= 12V, 3nF Load
V
PVCC
= V
VCC
= 12V, 3nF Load
V
PVCC
= V
VCC
= 12V, 3nF Load
V
PVCC
= V
VCC
= 12V, 3nF Load
UGATE Turn-Off Propagation Delay
LGATE Turn-Off Propagation Delay
Shutdown Window
Shutdown Holdoff Time
OUTPUT
Upper Drive Source Impedance
TPDL
UGATE
V
PVCC
= V
VCC
= 12V, 3nF Load
TPDL
LGATE
V
PVCC
= V
VCC
= 12V, 3nF Load
R
UGATE
R
UGATE
I
LGATE
R
LGATE
V
VCC
= 12V, V
PVCC
= 5V
V
VCC
= V
PVCC
= 12V
V
VCC
= 12V, V
PVCC
= 5V
V
VCC
= V
PVCC
= 12V
V
VCC
= 12V, V
PVCC
= 5V
V
VCC
= V
PVCC
= 12V
V
VCC
= 12V, V
PVCC
= 5V or 12V
-
-
-
-
400
500
-
1.7
3.0
2.3
1.1
580
730
1.6
3.0
5.0
4.0
2.0
-
-
4.0
Upper Drive Sink Impedance
Lower Drive Source Current
Lower Drive Sink Impedance
FN9076 Rev 6.00
December 3, 2015
Page 5 of 12
PCB设计
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