Multi-Quantum Well (MQW) Laser Diode
Specification
Model: ELD83NPT5
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Catalog
1.Scope………………………………………………………………………………………………………..3
2.Outline
Dimensions and Terminal Connections
…………………………………… ………………3
3.
Ratings and Characteristics
…………………………………………………………………………..4
4.
Reliability
………………………………………………………………………………………………..5
5.Incoming
inspection
…………………………………………… ………………………………………..6
6.
Supplements………………………………………………………………………………………………..7
7.
Operation note
………………………………………………………………………………………..7
8.
Quality assurance
……………………………………………………………………………………….. 8
9.
Security
………………………………………………………………………………………………….9
10.
Note
…… ……………………………………………………………………………………………….9
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1 Scope:
The specification covers the appearance and characteristics of 830nm Laser Diode used as light
source, It’s model is ELD83NPT5.This product is packaged with an ALGaAs multiple quantum well
invisible laser diode chip and a silicon photodiode for monitoring optical power output. Oscillation
transverse mode of this model is TE.
2. Outline Dimensions and Terminal Connections
Average single quality0.31g
General tolerance:
±0.2
Unit: mm
No.
a
b
c
d
e
f
Component
Laser diode chip
Photodiode chip
Stem
Cap
Window glass
Lead pins
Material
AlGaAs
Si
Fe
Kovar
Glass
Kovar
finish
Gold-plated
Nickel-plated
n = 1.49
Gold-plated
3. Ratings and Characteristics
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3－1 Absolute Maximum Ratings
(Tc=25℃ (case temperature))
Parameter
Optical power output (CW)
Reverse voltage
Operating
temperature）
Storage temperature（case
temperature）
Laser diode
Photodiode
temperature（case
Symbol
Po
Vrl
Vrd
Tc
Tstg
Value
7
2
30
-10 ~ +55
-40 ~ +85
Unit
mW
V
V
℃
℃
3-2 Electro-optical Characteristics（Note 1）
（Tc＝25°）
Parameter
Threshold current
Operating current
Operating voltage
Wavelength
Lateral Beam Angle
（Note
2、3）
Vertical Beam Angle
（Note
2、3）
Monitor current
Slope efficiency
（Note
1) Initial value, Continuous Work.
（Note
2) Angle of 50% peak intensity（Full angle at half-maximum）
（Note
3) Parallel to the junction plane（X-Z plane）
perpendicular to the junction plane
（Y-Z
plane）
CW
cw
Po=5mW
Condition
CW
Symbol
Ith
Iop
Vop
λp
θ∥
θ⊥
Im
η
d
0.4
Min.
-
-
-
820
8
20
Typ.
20
30
2.0
830
12
30
250
0.5
Max
30
45
2.3
840
16
35
500
0.8
Unit
mA
mA
V
nm
Degree
Degree
μA
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4. Reliability
4-1 The reliability of product satisfy all the items listed below.
Reliability：90％
No.
1
Test
Solder ability
Test Conditions
Soldering temperature：250±5℃
Immersion
time：5±0.5
brand iron should be grounded
second GJB-128A
GB-4937
GB-4937
11
0
20
Reference Sampler Defective LTPD
Standard : n
C
(%)
Terminal strength
（Tensile
test）
Terminal strength
3
（Bending
test）
2
4
Mechanical
shock
Load：5N Duration：10±1s
Once for each terminal
Load：2.5N 0°~ 90°~ 0°~ 90°~0°
Once for each terminal
Acceleration：14,700m/s
2
Pulse
width：0.5ms Direction: X,Y,Z
Five times for each direction
Acceleration：196m/s
2
Frequency：20½2000½20Hz 4min
reciprocation：X,Y and Z
times for each direction
Four
11
11
0
0
20
20
GJB-548A
11
0
20
5
Variable
frequency
vibration
GJB-548A
11
0
20
Lower temperature：－40℃
6
Temperature
cycling
Higher temperature：＋85℃
Duration：5 times，stay for 3h，
switch time:3min
Helium gas to detect fine leaks:
5×10
－
3
Pa·cm
2
/s、
In fluorocarbon liquid 125±5℃ no bubble
8
High
temperature
Storage temperature：85℃
t＝96 H
Storage temperature：－40℃
GB-2423.2
11
11
0
0
20
20
GB-2423.22
11
0
20
7
Sealing
GJB-128A
11
0
20
9 Low temperature
10
GB-2423.1
t＝96 H
Duration: From normal temperature up
Moisture
to 55℃ in 3h,stay for 9h,down to 25℃ in
resistance
GB-2423.4
(temperature 3h stay for 9h.
humidity cycle)
Repeat 6 times.（humidity is 95%）
11
0
20
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