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P74FCT3374DD

产品描述Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24
产品类别逻辑    逻辑   
文件大小143KB,共4页
制造商Pyramid Semiconductor Corporation
官网地址http://www.pyramidsemiconductor.com/
下载文档 详细参数 选型对比 全文预览

P74FCT3374DD概述

Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24

P74FCT3374DD规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Pyramid Semiconductor Corporation
Objectid1401474888
零件包装代码DIP
包装说明DIP, DIP24,.3
针数24
Reach Compliance Codeunknown
compound_id10092633
其他特性MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V
系列FCT
JESD-30 代码R-GDIP-T24
JESD-609代码e0
长度31.75 mm
负载电容(CL)50 pF
逻辑集成电路类型BUS DRIVER
最大I(ol)0.048 A
位数8
功能数量1
端口数量2
端子数量24
最高工作温度70 °C
最低工作温度
输出特性3-STATE
输出极性TRUE
封装主体材料CERAMIC, GLASS-SEALED
封装代码DIP
封装等效代码DIP24,.3
封装形状RECTANGULAR
封装形式IN-LINE
峰值回流温度(摄氏度)NOT SPECIFIED
电源3.3 V
Prop。Delay @ Nom-Sup4.5 ns
传播延迟(tpd)4.5 ns
认证状态Not Qualified
座面最大高度5.08 mm
最大供电电压 (Vsup)3.5 V
最小供电电压 (Vsup)3.1 V
标称供电电压 (Vsup)3.3 V
表面贴装NO
技术CMOS
温度等级COMMERCIAL
端子面层Tin/Lead (Sn/Pb)
端子形式THROUGH-HOLE
端子节距2.54 mm
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
触发器类型POSITIVE EDGE
宽度7.62 mm

P74FCT3374DD相似产品对比

P74FCT3374DD P54FCT3374DDM P54FCT3374CDM P74FCT3374CP P74FCT3374CSO P74FCT3374DSO P74FCT3374DP P74FCT3374CD
描述 Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24
是否Rohs认证 不符合 不符合 不符合 不符合 不符合 不符合 不符合 不符合
厂商名称 Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation Pyramid Semiconductor Corporation
零件包装代码 DIP DIP DIP DIP SOIC SOIC DIP DIP
包装说明 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 DIP, DIP24,.3 SOP, SOP24,.4 SOP, SOP24,.4 DIP, DIP24,.3 DIP, DIP24,.3
针数 24 24 24 24 24 24 24 24
Reach Compliance Code unknown unknown unknown unknown unknown unknown unknown unknown
其他特性 MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V
系列 FCT FCT FCT FCT FCT FCT FCT FCT
JESD-30 代码 R-GDIP-T24 R-GDIP-T24 R-GDIP-T24 R-PDIP-T24 R-PDSO-G24 R-PDSO-G24 R-PDIP-T24 R-GDIP-T24
JESD-609代码 e0 e0 e0 e0 e0 e0 e0 e0
长度 31.75 mm 31.75 mm 31.75 mm 31.9405 mm 15.4 mm 15.4 mm 31.9405 mm 31.75 mm
负载电容(CL) 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF 50 pF
逻辑集成电路类型 BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER BUS DRIVER
最大I(ol) 0.048 A 0.032 A 0.032 A 0.048 A 0.048 A 0.048 A 0.048 A 0.048 A
位数 8 8 8 8 8 8 8 8
功能数量 1 1 1 1 1 1 1 1
端口数量 2 2 2 2 2 2 2 2
端子数量 24 24 24 24 24 24 24 24
最高工作温度 70 °C 125 °C 125 °C 70 °C 70 °C 70 °C 70 °C 70 °C
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
输出极性 TRUE TRUE TRUE TRUE TRUE TRUE TRUE TRUE
封装主体材料 CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED CERAMIC, GLASS-SEALED PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY CERAMIC, GLASS-SEALED
封装代码 DIP DIP DIP DIP SOP SOP DIP DIP
封装等效代码 DIP24,.3 DIP24,.3 DIP24,.3 DIP24,.3 SOP24,.4 SOP24,.4 DIP24,.3 DIP24,.3
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 IN-LINE IN-LINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE IN-LINE IN-LINE
峰值回流温度(摄氏度) NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
Prop。Delay @ Nom-Sup 4.5 ns 5.2 ns 6.2 ns 5.2 ns 5.2 ns 4.5 ns 4.5 ns 5.2 ns
传播延迟(tpd) 4.5 ns 5.2 ns 6.2 ns 5.2 ns 5.2 ns 4.5 ns 4.5 ns 5.2 ns
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
座面最大高度 5.08 mm 5.08 mm 5.08 mm 4.318 mm 2.65 mm 2.65 mm 4.318 mm 5.08 mm
最大供电电压 (Vsup) 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V 3.5 V
最小供电电压 (Vsup) 3.1 V 3.1 V 3.1 V 3.1 V 3.1 V 3.1 V 3.1 V 3.1 V
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 NO NO NO NO YES YES NO NO
技术 CMOS CMOS CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL MILITARY MILITARY COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING THROUGH-HOLE THROUGH-HOLE
端子节距 2.54 mm 2.54 mm 2.54 mm 2.54 mm 1.27 mm 1.27 mm 2.54 mm 2.54 mm
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL
处于峰值回流温度下的最长时间 NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED NOT SPECIFIED
触发器类型 POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE POSITIVE EDGE
宽度 7.62 mm 7.62 mm 7.62 mm 7.62 mm 7.5 mm 7.5 mm 7.62 mm 7.62 mm

 
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