Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Pyramid Semiconductor Corporation |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP24,.3 |
| 针数 | 24 |
| Reach Compliance Code | unknown |
| 其他特性 | MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V |
| 系列 | FCT |
| JESD-30 代码 | R-PDIP-T24 |
| JESD-609代码 | e0 |
| 长度 | 31.9405 mm |
| 负载电容（CL） | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER |
| 最大I（ol） | 0.048 A |
| 位数 | 8 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 24 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出特性 | 3-STATE |
| 输出极性 | TRUE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP24,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 3.3 V |
| Prop。Delay @ Nom-Sup | 5.2 ns |
| 传播延迟（tpd） | 5.2 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.318 mm |
| 最大供电电压 (Vsup) | 3.5 V |
| 最小供电电压 (Vsup) | 3.1 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE |
| 宽度 | 7.62 mm |
| P74FCT3374CP | P54FCT3374DDM | P54FCT3374CDM | P74FCT3374CSO | P74FCT3374DSO | P74FCT3374DP | P74FCT3374DD | P74FCT3374CD | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDSO24, 0.300 INCH, PLASTIC, SOIC-24 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 | Bus Driver, FCT Series, 1-Func, 8-Bit, True Output, CMOS, CDIP24, 0.300 INCH, HERMETIC SEALED, CERDIP-24 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation | Pyramid Semiconductor Corporation |
| 零件包装代码 | DIP | DIP | DIP | SOIC | SOIC | DIP | DIP | DIP |
| 包装说明 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 | SOP, SOP24,.4 | SOP, SOP24,.4 | DIP, DIP24,.3 | DIP, DIP24,.3 | DIP, DIP24,.3 |
| 针数 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| 其他特性 | MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V | MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V | MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V | MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V | MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V | MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V | MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V | MULTIPLE CENTER PIN VCC AND GND; IOH = 0.3MA @ VOH = 2.9V; IOL = 0.3MA @ VOL = 0.2V |
| 系列 | FCT | FCT | FCT | FCT | FCT | FCT | FCT | FCT |
| JESD-30 代码 | R-PDIP-T24 | R-GDIP-T24 | R-GDIP-T24 | R-PDSO-G24 | R-PDSO-G24 | R-PDIP-T24 | R-GDIP-T24 | R-GDIP-T24 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 31.9405 mm | 31.75 mm | 31.75 mm | 15.4 mm | 15.4 mm | 31.9405 mm | 31.75 mm | 31.75 mm |
| 负载电容（CL） | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF | 50 pF |
| 逻辑集成电路类型 | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER | BUS DRIVER |
| 最大I（ol） | 0.048 A | 0.032 A | 0.032 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A | 0.048 A |
| 位数 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 24 | 24 | 24 | 24 | 24 | 24 | 24 | 24 |
| 最高工作温度 | 70 °C | 125 °C | 125 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 输出极性 | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE | TRUE |
| 封装主体材料 | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
| 封装代码 | DIP | DIP | DIP | SOP | SOP | DIP | DIP | DIP |
| 封装等效代码 | DIP24,.3 | DIP24,.3 | DIP24,.3 | SOP24,.4 | SOP24,.4 | DIP24,.3 | DIP24,.3 | DIP24,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| Prop。Delay @ Nom-Sup | 5.2 ns | 5.2 ns | 6.2 ns | 5.2 ns | 4.5 ns | 4.5 ns | 4.5 ns | 5.2 ns |
| 传播延迟（tpd） | 5.2 ns | 5.2 ns | 6.2 ns | 5.2 ns | 4.5 ns | 4.5 ns | 4.5 ns | 5.2 ns |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.318 mm | 5.08 mm | 5.08 mm | 2.65 mm | 2.65 mm | 4.318 mm | 5.08 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 3.5 V | 3.5 V | 3.5 V | 3.5 V | 3.5 V | 3.5 V | 3.5 V | 3.5 V |
| 最小供电电压 (Vsup) | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V | 3.1 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | YES | YES | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 触发器类型 | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE | POSITIVE EDGE |
| 宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.5 mm | 7.62 mm | 7.62 mm | 7.62 mm |
单片机
嵌入式系统
医疗电子
模拟电子
stm32/stm8
DSP 与 ARM 处理器
电子工程世界版权所有
京B2-20211791
京ICP备10001474号-1
电信业务审批[2006]字第258号函
京公网安备 11010802033920号
Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
