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MLK1005S12NJT

产品描述1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD
产品类别无源元件    电感器   
文件大小49KB,共3页
制造商TDK(株式会社)
官网地址http://www.tdk.com
标准
相似器件已查找到1个与MLK1005S12NJT功能相似器件
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MLK1005S12NJT概述

1 ELEMENT, 0.012 uH, CERAMIC-CORE, GENERAL PURPOSE INDUCTOR, SMD

MLK1005S12NJT规格参数

参数名称属性值
是否无铅不含铅
是否Rohs认证符合
厂商名称TDK(株式会社)
包装说明1005
Reach Compliance Codecompli
ECCN代码EAR99
大小写代码1005
型芯材料CERAMIC
直流电阻0.47 Ω
标称电感 (L)0.012 µH
电感器应用RF INDUCTOR
电感器类型GENERAL PURPOSE INDUCTOR
功能数量1
端子数量2
最高工作温度125 °C
最低工作温度-55 °C
最小质量因数(标称电感时)7
最大额定电流0.35 A
自谐振频率4300 MHz
形状/尺寸说明RECTANGULAR PACKAGE
屏蔽NO
表面贴装YES
端子位置DUAL ENDED
端子形状WRAPAROUND
测试频率100 MHz
容差5%

文档预览

下载PDF文档
(1/3)
SMD Inductors(Coils)
For High Frequency(Multilayer)
MLK Series MLK1005
FEATURES
• Supports operating frequency bands of up to 12GHz with
nominal inductance values from 1 to 100nH.
• Provides high Q characteristics.
• Advanced monolithic structure is formed using a multilayering
and sintering process with ceramic and conductive materials for
high-frequency.
• Because the part is non-polarized, it can be used in bulk
cassette loaders.
• It is a product conforming to RoHS directive.
APPLICATIONS
For high-frequency applications including mobile phones, high
frequency modules (PA, VCO, FEM etc.), Bluetooth, W-LAN, UWB
and tuners.
SHAPES AND DIMENSIONS
1±0.1
Conformity to RoHS Directive
PRODUCT IDENTIFICATION
MLK 1005 S 2N2 S T
(1) (2) (3) (4) (5) (6)
(1) Series name
(2) Dimensions
1005
1.0× 0.5mm (L× W)
(3) Material code
(4) Inductance value
2N2
12N
R10
2.2nH
12nH
100nH
(5) Inductance tolerance
S
D
J
±0.3nH
±0.5nH
±5%
0.5±0.1
(6) Packaging style
0.1min.
T
Taping (reel)
0.5±0.1
SPECIFICATIONS
Operating temperature range
Storage temperature range
–55 to +125°C
–55 to +125°C [Unit of product]
Weight: 1.0mg
RECOMMENDED PC BOARD PATTERN
1.4
0.4
PACKAGING STYLE AND QUANTITIES
Packaging style
Taping
Quantity
10000 pieces/reel
Dimensions in mm
RECOMMENDED SOLDERING CONDITION
REFLOW SOLDERING
10s max.
250 to 260˚C
230˚C
Natural
cooling
HANDLING AND PRECAUTIONS
• Before soldering, be sure to preheat components.
The preheating temperature should be set so that the
temperature difference between the solder temperature and
product temperature does not exceed 150°C.
• After mounting components onto the printed circuit board, do not
apply stress through board bending or mishandling.
• When hand soldering, apply the soldering iron to the printed
circuit board only. Temperature of the iron tip should not exceed
350°C. Soldering time should not exceed 3 seconds.
180˚C
150˚C
Preheating
60 to 120s
Time(s)
Soldering
30 to 60s
• Conformity to RoHS Directive: This means that, in conformity with EU Directive 2002/95/EC, lead, cadmium, mercury, hexavalent chromium, and specific
bromine-based flame retardants, PBB and PBDE, have not been used, except for exempted applications.
• Please contact our Sales office when your application are considered the following:
The device’s failure or malfunction may directly endanger human life (e.g. application for automobile/aircraft/medical/nuclear power devices, etc.)
• All specifications are subject to change without notice.
006-01 / 20080407 / e521_mlk1005.fm
0.5

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