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KM23C4000DETY-8: 产品描述MASK ROM, 512KX8, 80ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32; 产品类别存储存储; 文件大小69KB，共4页; 制造商SAMSUNG(三星); 官网地址http://www.samsung.com/Products/Semiconductor/

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KM23C4000DETY-8概述

MASK ROM, 512KX8, 80ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32

KM23C4000DETY-8规格参数

参数名称	属性值
是否Rohs认证	不符合
厂商名称	SAMSUNG(三星)
零件包装代码	TSOP1
包装说明	TSOP1, TSSOP32,.8,20
针数	32
Reach Compliance Code	unknown
ECCN代码	EAR99
最长访问时间	80 ns
JESD-30 代码	R-PDSO-G32
JESD-609代码	e0
长度	18.4 mm
内存密度	4194304 bit
内存集成电路类型	MASK ROM
内存宽度	8
功能数量	1
端子数量	32
字数	524288 words
字数代码	512000
工作模式	ASYNCHRONOUS
最高工作温度	85 °C
最低工作温度	-20 °C
组织	512KX8
封装主体材料	PLASTIC/EPOXY
封装代码	TSOP1
封装等效代码	TSSOP32,.8,20
封装形状	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED
电源	5 V
认证状态	Not Qualified
座面最大高度	1.2 mm
最大待机电流	0.00005 A
最大压摆率	0.05 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	OTHER
端子面层	Tin/Lead (Sn/Pb)
端子形式	GULL WING
端子节距	0.5 mm
端子位置	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED
宽度	8 mm

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KM23C4000D(E)TY

4M-Bit (512Kx8) CMOS MASK ROM

FEATURES

•

524,288 x 8 bit organization

Access time : 80ns(Max.)

Supply voltage : single +5V

Current consumption

Operating : 50mA(Max.)

Standby : 50µA(Max.)

•

Fully static operation

•

All inputs and outputs TTL compatible

•

Three state outputs

•

Package

-. KM23C4000D(E)TY : 32-TSOP1-0820

CMOS MASK ROM

GENERAL DESCRIPTION

The KM23C4000D(E)TY is a fully static mask programmable

ROM organized 524,288 x 8bit. It is fabricated using silicon

gate CMOS process technology.

This device operates with a 5V single power supply, and all

inputs and outputs are TTL compatible.

Because of its asynchronous operation, it requires no external

clock assuring extremely easy operation.

It is suitable for use in program memory of microprocessor, and

data memory, character generator.

The KM23C4000D(E)TY is packaged in a 32-TSOP1.

FUNCTIONAL BLOCK DIAGRAM

BUFFERS

AND

DECODER

MEMORY CELL

MATRIX

(524,288x8)

PRODUCT INFORMATION

Product

KM23C4000DTY

KM23C4000DETY

Operating

Temp Range

0°C~70°C

-20°C~85°C

Vcc Range

(Typical)

5.0V

Speed

(ns)

BUFFERS

AND

DECODER

SENSE AMP.

BUFFERS

PIN CONFIGURATION

. . .

N.C

#32

CONTROL

LOGIC

32-TSOP1

Pin Name

- A

- Q

N.C

Pin Function

Address Inputs

Data Outputs

Chip Enable

Output Enable

Power(+5V)

Ground

No Connection

#16

#17

KM23C4000D(E)TY

KM23C4000DETY-8相似产品对比

	KM23C4000DETY-8	KM23C4000DTY-10	KM23C4000DTY-12	KM23C4000DETY-10	KM23C4000DETY-12	KM23C4000DTY-8
描述	MASK ROM, 512KX8, 80ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	MASK ROM, 512KX8, 100ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	MASK ROM, 512KX8, 120ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32	MASK ROM, 512KX8, 80ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合
厂商名称	SAMSUNG(三星)	SAMSUNG(三星)	SAMSUNG(三星)	SAMSUNG(三星)	SAMSUNG(三星)	SAMSUNG(三星)
零件包装代码	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1
包装说明	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20	TSOP1, TSSOP32,.8,20
针数	32	32	32	32	32	32
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	80 ns	100 ns	120 ns	100 ns	120 ns	80 ns
JESD-30 代码	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32	R-PDSO-G32
JESD-609代码	e0	e0	e0	e0	e0	e0
长度	18.4 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm	18.4 mm
内存密度	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit	4194304 bit
内存集成电路类型	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM	MASK ROM
内存宽度	8	8	8	8	8	8
功能数量	1	1	1	1	1	1
端子数量	32	32	32	32	32	32
字数	524288 words	524288 words	524288 words	524288 words	524288 words	524288 words
字数代码	512000	512000	512000	512000	512000	512000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	85 °C	70 °C	70 °C	85 °C	85 °C	70 °C
组织	512KX8	512KX8	512KX8	512KX8	512KX8	512KX8
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1	TSOP1
封装等效代码	TSSOP32,.8,20	TSSOP32,.8,20	TSSOP32,.8,20	TSSOP32,.8,20	TSSOP32,.8,20	TSSOP32,.8,20
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE	SMALL OUTLINE, THIN PROFILE
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
电源	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm	1.2 mm
最大待机电流	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A	0.00005 A
最大压摆率	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA	0.05 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	OTHER	COMMERCIAL	COMMERCIAL	OTHER	OTHER	COMMERCIAL
端子面层	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)
端子形式	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING	GULL WING
端子节距	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm	0.5 mm
端子位置	DUAL	DUAL	DUAL	DUAL	DUAL	DUAL
处于峰值回流温度下的最长时间	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED
宽度	8 mm	8 mm	8 mm	8 mm	8 mm	8 mm

KM23C4000DETY-8

KM23C4000DETY-8概述

KM23C4000DETY-8规格参数

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KM23C4000DETY-8相似产品对比

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