AMPMODU Interconnection System
Mod IV Receptacle Assemblies, Single-Row, Outrigger Design
.100 x .100 [2.54 x 2.54] Centerline, End To End Stackable
Dual Entry, End Stackable,
Low Profile, .100 x .100
[2.54 x 2.54] Centerline,
.200 [5.08] Tine Spacing
.125±.010
[3.17±0.25]
Typ.
.020
[0.51]
(Standoffs)
.245
[6.22]
A
.148
[3.77]
Typ.
.107
[2.72]
(Localized Gold
Plate Area)
Point of
Contact
.200±.003
[5.08±0.08]
Typ.
Material and Finish
Housing
— Glass-filled thermoplastic,
black, 94V-0 rated
Plating A
— Duplex .000030 [0.00076]
gold on contact area, .000150-0.000300
[0.00381-0.00762] matte tin on solder
area all over .000050 [0.00127] nickel
Plating B
— Duplex .000010
[0.000254] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating C
— .000150-.000300
[0.00381-0.00762] matte tin on solder
leads, all over .000050 [0.00127] nickel
.140
[3.56]
.100
[2.54]
Typ.
.053
[1.34]
Typ.
B
.075 +.005
-.000
1.90 +0.13
-.000
Vertical Mount,
Receptacle Assemblies
[
.140
[3.56]
]
.200
[5.08]
.035±.003
Dia.
[0.89±0.08]
.100
[2.54]
Typ.
Recommended PC Board Hole Layout
No. of
Pos.
3
4
5
6
7
8
9
10
11
12
13
14
15
16
17
18
19
20
30
40
Dimensions
A
.300
[7.62]
.400
[10.16]
.500
[12.70]
.600
[15.24]
.700
[17.78]
.800
[20.32]
.900
[22.86]
1.000
[25.40]
1.100
[27.94]
1.200
[30.48]
1.300
[33.02]
1.400
[35.56]
1.500
[38.10]
1.600
[40.64]
1.700
[43.18]
1.800
[45.72]
1.900
[48.26]
2.000
[50.80]
3.000
[76.20]
4.000
[101.60]
B
.200
[5.08]
.300
[7.62]
.400
[10.16]
.500
[12.70]
.600
[15.24]
.700
[17.78]
.800
[20.32]
.900
[22.86]
1.000
[25.40]
1.100
[27.94]
1.200
[30.48]
1.300
[33.02]
1.400
[35.56]
1.500
[38.10]
1.600
[40.64]
1.700
[43.18]
1.800
[45.72]
1.900
[48.26]
2.900
[73.66]
3.900
[99.06]
Plating A
5-147720-2
5-147720-3
5-147720-4
5-147720-5
5-147720-6
5-147720-7
5-147720-8
5-147720-9
6-147720-0
6-147720-1
6-147720-2
6-147720-3
6-147720-4
6-147720-5
6-147720-6
6-147720-7
6-147720-8
7-147720-8
8-147720-8
8-147720-9
Contact Plating/Part Nos.
Plating B
5-147726-2
5-147726-3
5-147726-4
5-147726-5
5-147726-6
5-147726-7
5-147726-8
5-147726-9
6-147726-0
6-147726-1
6-147726-2
6-147726-3
6-147726-4
6-147726-5
6-147726-6
6-147726-7
6-147726-8
7-147726-8
8-147726-8
8-147726-9
5
Plating C
5-147727-2
5-147727-3
5-147727-4
5-147727-5
5-147727-6
5-147727-7
5-147727-8
5-147727-9
6-147727-0
6-147727-1
6-147727-2
6-147727-3
6-147727-4
6-147727-5
6-147727-6
6-147727-7
6-147727-8
7-147727-8
8-147727-8
8-147727-9
Note:
All part numbers are RoHS
compliant.
Notes:
1. Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle
assemblies.
2. To obtain the minimum mating post length, add .020 [0.51] (not including the post lead in chamfer) to
the maximum point-of-contact dimension and add .062 [1.57] for recommended board thickness if used in
bottom entry application.
181
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
AMPMODU Interconnection System
Mod IV Receptacle Assemblies, Double-Row, Outrigger Design,
.100 x .100 [2.54 x 2.54] Centerline, End to End Stackable
Dual Entry, End Stackable,
Low Profile, .100 x .100
[2.54 x 2.54] Centerline,
.300 [7.62] Tine Spacing
.020
[0.51]
(Standoffs)
.245
[6.22]
Typ.
A
.050
[1.27]
Max.
Typ.
.148
[3.77]
Typ.
.107
[2.72]
Typ.
(Localized Gold
Plate Area)
Point of
Contact
Material and Finish
Housing
— Glass-filled thermoplastic,
black, 94V-0 rated
Contacts
— Phosphor bronze,
plated as follows:
Plating A
— Duplex .000030 [0.00076]
gold on contact area, .000150-.000300
[0.00381-0.00762] matte tin on solder
area all over .000050 [0.00127] nickel
Plating B
— Duplex .000010
[0.000254] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating C
— .000150-.000300
[0.00381-0.00762] matte tin on solder
leads, all over .000050 [0.00127] nickel
.198
[5.03]
.100±.003
[2.54±0.08]
.300
[7.62]
Typ.
Vertical Mount,
Receptacle Assemblies
.100
[2.54]
Typ.
.125±.010
[3.17±0.25]
.100
[2.54]
Typ.
.100
[2.54]
Typ.
B
.100
[2.54]
Typ.
5
Related Product Data
Mateable Headers
—
Refer to the Mating Post Selection
Guide — page 90
Performance Characteristics
—
page 174
.035
±.003
Dia.
[0.89
±0.08
] Typ.
+.005
-0.00
Dia.
.060
+0.13
Typ.
[
1.90
-0.00
]
.075
.100
[2.54]
Typ.
Recommended PC Board Hole Layout
No. of
Pos.
2
4
6
8
14
18
20
24
30
36
40
48
50
60
76
80
Dimensions
A
B
.100
[2.54]
—
.200
[5.08]
.100
[2.54]
.300
[7.62]
.200
[5.08]
.400
[10.16]
.300
[7.62]
.700
[17.78]
.600
[15.24]
.900
[22.86]
.800
[20.32]
1.000
[25.40]
.900
[22.86]
1.200
[30.48]
1.100
[27.94]
1.500
[38.10]
1.400
[35.56]
1.800
[45.72]
1.700
[43.18]
2.000
[50.80]
1.900
[48.26]
2.400
[60.96]
2.300
[58.42]
2.500
[63.50]
2.400
[60.96]
3.000
[76.20]
2.900
[73.66]
3.800
[96.52]
3.700
[93.98]
4.000
[101.60]
3.900
[99.06]
Plating A
6-534267-3
6-534267-7
6-534267-4
5-534267-5
5-534267-1
6-534267-0
5-534267-2
5-534267-9
6-534267-2
6-534267-5
5-534267-7
6-534267-1
6-534267-8
5-534267-8
6-534267-6
5-534267-4
Contact Plating/Part Nos.
Plating B
5-147099-1
5-147099-2
5-147099-3
5-147099-4
5-147099-7
5-147099-9
6-147099-0
6-147099-2
6-147099-5
6-147099-8
7-147099-0
7-147099-4
7-147099-5
8-147099-0
8-147099-8
9-147099-0
Plating C
8-147100-9
9-147100-0
5-147100-1
5-147100-2
5-147100-5
5-147100-7
5-147100-8
6-147100-0
6-147100-3
6-147100-6
6-147100-8
7-147100-2
7-147100-3
7-147100-8
8-147100-6
8-147100-8
Technical Documents
— page 276
Product Specification
108-25022
Application Specification
114-25018
Additional receptacle assembly
sizes are available; minimum
order quantities may apply.
Consult Tyco Electronics.
Keying Plug
Part No. 86286-1
(Plugs into receptacle contact)
Material
— Natural color nylon
Notes:
1. Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle assemblies.
2. To obtain the minimum mating post length, add .020 [0.51] (not including the post lead in chamfer) to the
maximum point-of-contact dimension and .062 for recommended board thickness if used in bottom entry
application.
Note:
All part numbers are RoHS compliant.
182
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
AMPMODU Interconnection System
Mod. IV Receptacle Assemblies, Double-Row,
.100 x .100 [2.54 x 2.54] Centerline
Closed Dual Entry, Side and
End Stackable Low Profile,
.100 x .100 [2.54 x 2.54]
Centerline, .150 [3.81] Tine
Spacing
.020
[0.51]
Typ.
(Standoffs)
.245
[6.22]
Typ.
A
.050
[1.27]
Max.
Typ.
Material and Finish
Housing
— Glass-filled thermoplastic,
black, 94V-0 rated
Contacts
— Phosphor bronze,
plated as follows:
Plating A
— Duplex .000030 [0.00076]
gold on contact area, .000150-.000300
[0.00381-0.00762] matte tin on solder
area all over .000050 [0.00127] nickel
Plating B
— Duplex .000010
[0.000254] gold on contact area,
.000150-.000300 [0.00381-0.00762]
matte tin on solder area all over .000050
[0.00127] nickel
Plating C
— .000150-.000300
[0.00381-0.00762] matte tin on solder
leads, all over .000050 [0.00127] nickel
.198
[5.03]
.100±.003
[2.54±0.08]
.148
[3.77]
Typ.
Point of
Contact
.150
[3.81]
Typ.
.100
[2.54]
B
.075
+.005
-.000
.060
+0.13
1.90
-0.00
Dia.
.100*
[2.54]
Typ.
.107
[2.72]
Typ.
(Localized Gold
Plate Area)
B
.100
[2.54]
Typ.
.100
[2.54]
Typ.
.130±.010
[3.30±0.25]
Typ.
Vertical Mount,
Receptacle Assemblies
[
]
Typ.
Related Product Data
Mateable Headers
—
Refer to the Mating Post Selection
Guide — page 90
Performance Characteristics
—
page 174
Recommended PC Board Hole Layout
for Bottom Entry or Pass Through Applications
*±.003 [±0.08] tolerances not to accumulate
within one connector pattern.
No. of
Pos.
2
4
6
8
10
12
14
16
18
20
22
24
26
28
30
32
34
36
38
40
Dimensions
A
B
.100
[2.54]
—
.200
[5.08]
.100
[2.54]
.300
[7.62]
.200
[5.08]
.400
[10.16]
.300
[7.62]
.500
[12.70]
.400
[10.16]
.600
[15.24]
.500
[12.70]
.700
[17.78]
.600
[15.24]
.800
[20.32]
.700
[17.78]
.900
[22.86]
.800
[20.32]
1.000
[25.40]
.900
[22.86]
1.100
[27.94]
1.000
[25.40]
1.200
[30.48]
1.100
[27.94]
1.300
[33.02]
1.200
[30.48]
1.400
[35.56]
1.300
[33.02]
1.500
[38.10]
1.400
[35.56]
1.600
[40.64]
1.500
[38.10]
1.700
[43.18]
1.600
[40.64]
1.800
[45.72]
1.700
[43.18]
1.900
[48.26]
1.800
[45.72]
2.000
[50.80]
1.900
[48.26]
.035±.003
Dia. Typ.
[0.89±0.08]
.150
[3.81]
Typ.
Recommended PC Board Hole Layout
for Top Entry
Contact Plating/Part Nos.
Plating B
5-147095-1
5-147095-2
5-147095-3
5-147095-4
5-147095-5
5-147095-6
5-147095-7
5-147095-8
5-147095-9
6-147095-0
6-147095-1
6-147095-2
6-147095-3
6-147095-4
6-147095-5
6-147095-6
6-147095-7
6-147095-8
6-147095-9
7-147095-0
5
Technical Documents
— page 276
Product Specification
108-25022
Application Specification
114-25018
Plating A
5-535542-1
5-535542-2
5-535542-3
5-535542-4
5-535542-5
5-535542-6
5-535542-7
5-535542-8
5-535542-9
6-535542-0
6-535542-1
6-535542-2
6-535542-3
6-535542-4
6-535542-5
6-535542-6
6-535542-7
6-535542-8
6-535542-9
7-535542-0
Plating C
5-147096-1
5-147096-2
5-147096-3
5-147096-4
5-147096-5
5-147096-6
5-147096-7
5-147096-8
5-147096-9
6-147096-0
6-147096-1
6-147096-2
6-147096-3
6-147096-4
6-147096-5
6-147096-6
6-147096-7
6-147096-8
6-147096-9
7-147096-0
Note:
All part numbers are RoHS
compliant.
Notes:
1. Tyco Electronics recommends mating gold or duplex plated headers with duplex plated receptacle assemblies.
2. To obtain the minimum mating post length, add .020 [0.51] (not including the post lead in chamfer) to
the maximum point-of-contact dimension, and .062 [1.57] for recommended board thickness if used in bot-
tom entry application.
183
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
AMPMODU Interconnection System
Mod. IV Receptacle Assemblies, Double-Row,
.100 x .100 [2.54 x 2.54] Centerline
(Continued)
No. of
Pos.
42
44
46
48
50
52
54
56
58
60
62
64
66
68
70
72
74
76
78
80
Dimensions
A
B
2.100
[53.34]
2.000
[50.80]
2.200
[55.88]
2.100
[53.34]
2.300
[58.42]
2.200
[55.88]
2.400
[60.96]
2.300
[58.42]
2.500
[63.50]
2.400
[60.96]
2.600
[66.04]
2.500
[63.50]
2.700
[68.58]
2.600
[66.04]
2.800
[71.12]
2.700
[68.58]
2.900
[73.66]
2.800
[71.12]
3.000
[76.20]
2.900
[73.66]
3.100
[78.74]
3.000
[76.20]
3.200
[81.28]
3.100
[78.74]
3.300
[83.82]
3.200
[81.28]
3.400
[86.36]
3.300
[83.82]
3.500
[88.90]
3.400
[86.36]
3.600
[91.44]
3.500
[88.90]
3.700
[93.98]
3.600
[91.44]
3.800
[96.52]
3.700
[93.98]
3.900
[99.06]
3.800
[96.52]
4.000
[101.60]
3.900
[99.06]
Plating A
7-535542-1
7-535542-2
7-535542-3
7-535542-4
7-535542-5
7-535542-6
7-535542-7
7-535542-8
7-535542-9
8-535542-0
8-535542-1
8-535542-2
8-535542-3
8-535542-4
8-535542-5
8-535542-6
8-535542-7
8-535542-8
8-535542-9
9-535542-0
Contact Plating/Part Nos.
Plating B
7-147095-1
7-147095-2
7-147095-3
7-147095-4
7-147095-5
7-147095-6
7-147095-7
7-147095-8
7-147095-9
8-147095-0
8-147095-1
8-147095-2
8-147095-3
8-147095-4
8-147095-5
8-147095-6
8-147095-7
8-147095-8
8-147095-9
9-147095-0
Plating C
7-147096-1
7-147096-2
7-147096-3
7-147096-4
7-147096-5
7-147096-6
7-147096-7
7-147096-8
7-147096-9
8-147096-0
8-147096-1
8-147096-2
8-147096-3
8-147096-4
8-147096-5
8-147096-6
8-147096-7
8-147096-8
8-147096-9
9-147096-0
5
Vertical Mount,
Receptacle Assemblies
Note:
All part numbers are RoHS compliant.
184
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
AMPMODU Interconnection System
Mod IV Surface Mount Vertical Receptacle Assemblies,
.100 x .100 [2.54 x 2.54] Centerline
Product Facts
■
■
■
Surface Mount Leads
Contact Material:
phosphor bronze
High temperature, black
thermoplastic housings,
94V-0 rated, capable of
withstanding IR or vapor-
phase reflow
Gold/tin duplex plating
for reliable mating
interconnection and solder
interface
Metallic hold downs provide
retention in the PC board
prior to and during the
reflow process … and strain
relief after soldering
Hold downs provide for
proper lead-to-pad
registration
Closed-entry receptacle
housings provide lead-in
ramp for positive mating
Receptacle contacts employ
dual cantilever beams for
reliable connections
Recognized under the
Component Program
of Underwriters
Laboratories Inc.
File No. E28476
Certified by
Canadian Standards
Association,
File No. LR 7189
The AMPMODU 0.025 [0.64]
square interconnection
system is an industry
standard that has provided
level III and IV thru-hole
interconnections to almost
every industry and
marketplace for years.
As technology advances,
so has the AMPMODU
product line.
Surface mount vertical
receptacle assemblies are
available to meet your level
II packaging needs as
process technologies
evolve from wave soldering
to surface mount reflow
(infrared and vapor-phase)
processes. AMPMODU
surface mount receptacle
assemblies are offered in
vertical dual entry
configurations. These
receptacles are available in
single-row and double-row
configurations with a
contact centerline spacing
of .100 x .100 [2.54 x 2.54].
AMPMODU surface mount
vertical receptacle
assemblies continue to
provide the proven features
and benefits of their
thru-hole counterparts in the
AMPMODU product family.
Closed-entry style housing
design provides a lead-in
ramp for positive mating of
contacts, virtually eliminating
the possibility of stubbing.
The dual-beam receptacle
contact design, coupled with
gold plating in the contact
area, provides a reliable
interface. Tin plating on the
solder tails also enhances
solderability.
The incorporation of
compliant metallic hold
downs on receptacle
assemblies offers multiple
benefits. The hold downs
provide for proper lead-to-
pad registration and provide
retention to the PC board
prior to and during
processing. Used with a
plated thru-hole, the hold
downs are soldered during
the reflow process and
serve as a strain relief for
the solder joints during
mating/unmating.
The design of the hold
downs results in an
excellent ratio of
insertion/extraction forces
(into the PC board); 20 lb.
[89 N] maximum insertion
force per pair and 10 lb.
[44.5 N] minimum extraction
force per pair (unsoldered).
No tools are required for
insertion.
■
■
■
Surface Mount Receptacle
Assemblies
■
■
■
R
■
5
R
185
Catalog 1307819
Revised 8-08
www.tycoelectronics.com
Dimensions are in inches and
millimeters unless otherwise
specified. Values in brackets
are metric equivalents.
Dimensions are shown for
reference purposes only.
Specifications subject
to change.
USA: 1-800-522-6752
Canada: 1-905-470-4425
Mexico: 01-800-733-8926
C. America: 52-55-1106-0803
South America: 55-11-2103-6000
Hong Kong: 852-2735-1628
Japan: 81-44-844-8013
UK: 44-8706-080-208
FPGA/CPLD
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
