电子工程世界电子工程世界电子工程世界

关键词

搜索

型号

搜索
 PDF数据手册

MCP607T-I/SL

产品描述OP-AMP, PDSO14, 3.90 MM, PLASTIC, SOIC-14
产品类别模拟混合信号IC    放大器电路   
文件大小561KB,共32页
制造商Microchip(微芯科技)
官网地址https://www.microchip.com
下载文档 详细参数 选型对比 全文预览

MCP607T-I/SL概述

OP-AMP, PDSO14, 3.90 MM, PLASTIC, SOIC-14

MCP607T-I/SL规格参数

参数名称属性值
厂商名称Microchip(微芯科技)
零件包装代码SOIC
包装说明,
针数14
Reach Compliance Codecompliant
ECCN代码EAR99
放大器类型OPERATIONAL AMPLIFIER
JESD-30 代码R-PDSO-G14
端子数量14
封装主体材料PLASTIC/EPOXY
封装形状RECTANGULAR
封装形式SMALL OUTLINE
认证状态Not Qualified
表面贴装YES
端子形式GULL WING
端子位置DUAL

MCP607T-I/SL相似产品对比

MCP607T-I/SL MCP609T-I/P MCP608T-I/P MCP609T-I/OT MCP609T-I/SN MCP609-I/OT MCP609-I/SN MCP607T-I/P MCP608-I/SL MCP608T-I/SL
描述 OP-AMP, PDSO14, 3.90 MM, PLASTIC, SOIC-14 QUAD OP-AMP, 250 uV OFFSET-MAX, 0.155 MHz BAND WIDTH, PDIP14, PLASTIC, DIP-14 OP-AMP, 250 uV OFFSET-MAX, 0.155 MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8 OP-AMP, PDSO5, PLASTIC, SOT-23, 5 PIN OP-AMP, PDSO8, 3.90 MM, PLASTIC, SOIC-8 OP-AMP, PDSO5, PLASTIC, SOT-23, 5 PIN OP-AMP, PDSO8, 3.90 MM, PLASTIC, SOIC-8 DUAL OP-AMP, 250 uV OFFSET-MAX, 0.155 MHz BAND WIDTH, PDIP8, PLASTIC, DIP-8 OP-AMP, PDSO14, 3.90 MM, PLASTIC, SOIC-14 OP-AMP, PDSO14, 3.90 MM, PLASTIC, SOIC-14
厂商名称 Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技) Microchip(微芯科技)
零件包装代码 SOIC DIP DIP SOT-23 SOIC SOT-23 SOIC DIP SOIC SOIC
针数 14 14 8 5 8 5 8 8 14 14
Reach Compliance Code compliant compliant compliant compliant compliant compliant compliant compliant compliant compliant
ECCN代码 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99 EAR99
放大器类型 OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER OPERATIONAL AMPLIFIER
JESD-30 代码 R-PDSO-G14 R-PDIP-T14 R-PDIP-T8 R-PDSO-G5 R-PDSO-G8 R-PDSO-G5 R-PDSO-G8 R-PDIP-T8 R-PDSO-G14 R-PDSO-G14
端子数量 14 14 8 5 8 5 8 8 14 14
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE IN-LINE IN-LINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE SMALL OUTLINE IN-LINE SMALL OUTLINE SMALL OUTLINE
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
表面贴装 YES NO NO YES YES YES YES NO YES YES
端子形式 GULL WING THROUGH-HOLE THROUGH-HOLE GULL WING GULL WING GULL WING GULL WING THROUGH-HOLE GULL WING GULL WING
端子位置 DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL DUAL

技术资料推荐更多

 
EEWorld订阅号

 
EEWorld服务号

 
汽车开发圈

About Us 关于我们 客户服务 联系方式 器件索引 网站地图 最新更新 手机版

站点相关: 国产芯 大学堂 TI培训 Datasheet 电子工程 索引文件: 35  142  816  1377  1472 

器件索引   0 1 2 3 4 5 6 7 8 9 A B C D E F G H I J K L M N O P Q R S T U V W X Y Z

北京市海淀区中关村大街18号B座15层1530室 电话:(010)82350740 邮编:100190

电子工程世界版权所有 京B2-20211791 京ICP备10001474号-1 电信业务审批[2006]字第258号函 京公网安备 11010802033920号 Copyright © 2005-2024 EEWORLD.com.cn, Inc. All rights reserved