EEPROM, 256X16, Serial, CMOS, DIE
| 参数名称 | 属性值 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | DIE |
| 包装说明 | DIE, |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | IT CAN ALSO CONFIGURABLE AS 256 X 8 |
| 备用内存宽度 | 8 |
| 最大时钟频率 (fCLK) | 0.25 MHz |
| JESD-30 代码 | X-XUUC-N |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X16 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIE |
| 封装形状 | UNSPECIFIED |
| 封装形式 | UNCASED CHIP |
| 并行/串行 | SERIAL |
| 认证状态 | Not Qualified |
| 串行总线类型 | MICROWIRE |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V |
| 标称供电电压 (Vsup) | 2.7 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | NO LEAD |
| 端子位置 | UPPER |
| 最长写入周期时间 (tWC) | 10 ms |
| AT93C66A-W1.8-11 | AT93C66A-10TQ-2.7 | AT93C56AY1-10YU-2.7 | AT93C56A-10TQ-2.7 | |
|---|---|---|---|---|
| 描述 | EEPROM, 256X16, Serial, CMOS, DIE | EEPROM, 256X16, Serial, CMOS, PDSO8, 4.40 MM, LEAD FREE AND HALOGEN FREE, MO-153AA, TSSOP-8 | EEPROM, 128X16, Serial, CMOS, 4.90 X 3 MM, LEAD AND HALOGEN FREE, MSOP-8 | EEPROM, 128X16, Serial, CMOS, PDSO8, 4.40 MM, LEAD FREE AND HALOGEN FREE, MO-153AA, TSSOP-8 |
| 零件包装代码 | DIE | TSSOP | MSOP | TSSOP |
| 包装说明 | DIE, | TSSOP, TSSOP8,.25 | HVSON, | TSSOP, TSSOP8,.25 |
| Reach Compliance Code | unknown | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 备用内存宽度 | 8 | 8 | 8 | 8 |
| 最大时钟频率 (fCLK) | 0.25 MHz | 1 MHz | 1 MHz | 1 MHz |
| JESD-30 代码 | X-XUUC-N | R-PDSO-G8 | R-XDSO-N8 | R-PDSO-G8 |
| 内存密度 | 4096 bit | 4096 bit | 2048 bit | 2048 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 字数 | 256 words | 256 words | 128 words | 128 words |
| 字数代码 | 256 | 256 | 128 | 128 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 125 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256X16 | 256X16 | 128X16 | 128X16 |
| 封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY |
| 封装代码 | DIE | TSSOP | HVSON | TSSOP |
| 封装形状 | UNSPECIFIED | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | UNCASED CHIP | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 串行总线类型 | MICROWIRE | MICROWIRE | MICROWIRE | MICROWIRE |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 1.8 V | 2.7 V | 2.7 V | 2.7 V |
| 标称供电电压 (Vsup) | 2.7 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | AUTOMOTIVE |
| 端子形式 | NO LEAD | GULL WING | NO LEAD | GULL WING |
| 端子位置 | UPPER | DUAL | DUAL | DUAL |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms |
| 厂商名称 | Atmel (Microchip) | - | Atmel (Microchip) | Atmel (Microchip) |
| 其他特性 | IT CAN ALSO CONFIGURABLE AS 256 X 8 | ALSO OPERATES AT 4.5V TO 5.5V SUPPLY | - | ALSO OPERATES AT 4.5V TO 5.5V SUPPLY |
| 是否Rohs认证 | - | 符合 | 符合 | 符合 |
| 针数 | - | 8 | 8 | 8 |
| JESD-609代码 | - | e3 | e3 | e3 |
| 长度 | - | 4.4 mm | 4.9 mm | 4.4 mm |
| 湿度敏感等级 | - | 1 | 1 | 1 |
| 端子数量 | - | 8 | 8 | 8 |
| 峰值回流温度（摄氏度） | - | 260 | 260 | 260 |
| 座面最大高度 | - | 1.2 mm | 0.9 mm | 1.2 mm |
| 端子面层 | - | Matte Tin (Sn) | MATTE TIN | Matte Tin (Sn) |
| 端子节距 | - | 0.65 mm | 0.65 mm | 0.65 mm |
| 处于峰值回流温度下的最长时间 | - | 40 | 40 | 40 |
| 宽度 | - | 3 mm | 3 mm | 3 mm |
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