SPECIALTY MEMORY CIRCUIT, PDSO20
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 厂商名称 | Rochester Electronics |
| Reach Compliance Code | unknown |
| 其他特性 | DRAM IS CONFIGURED AS 4 K X 1 |
| JESD-30 代码 | R-PDSO-G20 |
| JESD-609代码 | e0 |
| 长度 | 12.8 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | MEMORY CIRCUIT |
| 内存宽度 | 1 |
| 湿度敏感等级 | NOT SPECIFIED |
| 功能数量 | 1 |
| 端子数量 | 20 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 16KX1 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 认证状态 | COMMERCIAL |
| 座面最大高度 | 2.65 mm |
| 最大供电电压 (Vsup) | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | TTL |
| 温度等级 | COMMERCIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.5 mm |

| SN74LS600ADW | SN74LS603AN | SN74LS600AN | SN74LS600ADWR | SN74LS601AN | SN74LS601ADW | SN74LS601ADWR | |
|---|---|---|---|---|---|---|---|
| 描述 | SPECIALTY MEMORY CIRCUIT, PDSO20 | DRAM CONTROLLER, PDIP20 | DRAM CONTROLLER, PDIP20 | SPECIALTY MEMORY CIRCUIT, PDSO20 | DRAM CONTROLLER, PDIP20 | SPECIALTY MEMORY CIRCUIT, PDSO20 | SPECIALTY MEMORY CIRCUIT, PDSO20 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| JESD-30 代码 | R-PDSO-G20 | R-PDIP-T20 | R-PDIP-T20 | R-PDSO-G20 | R-PDIP-T20 | R-PDSO-G20 | R-PDSO-G20 |
| 长度 | 12.8 mm | 24.325 mm | 24.325 mm | 12.8 mm | 24.325 mm | 12.8 mm | 12.8 mm |
| 端子数量 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | SOP | DIP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | SMALL OUTLINE |
| 认证状态 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 座面最大高度 | 2.65 mm | 5.08 mm | 5.08 mm | 2.65 mm | 5.08 mm | 2.65 mm | 2.65 mm |
| 表面贴装 | YES | NO | NO | YES | NO | YES | YES |
| 技术 | TTL | TTL | TTL | TTL | TTL | TTL | TTL |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.5 mm | 7.62 mm | 7.62 mm | 7.5 mm | 7.62 mm | 7.5 mm | 7.5 mm |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | - | 含铅 | 含铅 | - |
| 厂商名称 | Rochester Electronics | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| JESD-609代码 | e0 | e0 | e0 | - | e0 | e0 | - |
| 内存密度 | 16384 bit | - | - | 16384 bit | - | 65536 bit | 65536 bit |
| 内存集成电路类型 | MEMORY CIRCUIT | - | - | MEMORY CIRCUIT | - | MEMORY CIRCUIT | MEMORY CIRCUIT |
| 内存宽度 | 1 | - | - | 1 | - | 1 | 1 |
| 湿度敏感等级 | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 功能数量 | 1 | - | - | 1 | - | 1 | 1 |
| 字数 | 16384 words | - | - | 16384 words | - | 65536 words | 65536 words |
| 字数代码 | 16000 | - | - | 16000 | - | 64000 | 64000 |
| 工作模式 | ASYNCHRONOUS | - | - | ASYNCHRONOUS | - | ASYNCHRONOUS | ASYNCHRONOUS |
| 组织 | 16KX1 | - | - | 16KX1 | - | 64KX1 | 64KX1 |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
| 最大供电电压 (Vsup) | 5.25 V | - | - | 5.25 V | - | 5.25 V | 5.25 V |
| 最小供电电压 (Vsup) | 4.75 V | - | - | 4.75 V | - | 4.75 V | 4.75 V |
| 标称供电电压 (Vsup) | 5 V | - | - | 5 V | - | 5 V | 5 V |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | - | TIN LEAD | TIN LEAD | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | NOT SPECIFIED | NOT SPECIFIED | - |
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