Support Circuit, PDSO24, SSOP-24
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | ROHM(罗姆半导体) |
| 零件包装代码 | SSOP |
| 包装说明 | SSOP, |
| 针数 | 24 |
| Reach Compliance Code | compliant |
| JESD-30 代码 | R-PDSO-G24 |
| JESD-609代码 | e3/e2 |
| 长度 | 10 mm |
| 功能数量 | 1 |
| 端子数量 | 24 |
| 最高工作温度 | 75 °C |
| 最低工作温度 | -25 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SSOP |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 260 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.9 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 电信集成电路类型 | CORDLESS TELEPHONE SUPPORT CIRCUIT |
| 温度等级 | COMMERCIAL EXTENDED |
| 端子面层 | TIN/TIN COPPER |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 10 |
| 宽度 | 5.4 mm |
| BU8241FS-E2 | BU8244FE2 | BU8242FE2 | BU8241FSE2 | BU8241FE2 | BU8241F-E2 | |
|---|---|---|---|---|---|---|
| 描述 | Support Circuit, PDSO24, SSOP-24 | TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO16, SOP-16 | TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO20, SOP-20 | TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO24, SSOP-24 | TELECOM, CORDLESS, SUPPORT CIRCUIT, PDSO24, SOP-24 | Support Circuit, PDSO24, SOP-24 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) | ROHM(罗姆半导体) |
| 零件包装代码 | SSOP | SOIC | SOIC | SSOP | SOIC | SOIC |
| 包装说明 | SSOP, | LSOP, | SOP, | SSOP, | SOP, | SOP-24 |
| 针数 | 24 | 16 | 20 | 24 | 24 | 24 |
| Reach Compliance Code | compliant | unknown | unknown | unknown | unknown | compliant |
| JESD-30 代码 | R-PDSO-G24 | R-PDSO-G16 | R-PDSO-G20 | R-PDSO-G24 | R-PDSO-G24 | R-PDSO-G24 |
| JESD-609代码 | e3/e2 | e3/e2 | e3/e2 | e3/e2 | e3/e2 | e3/e2 |
| 长度 | 10 mm | 10 mm | 12.5 mm | 10 mm | 15 mm | 15 mm |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 24 | 16 | 20 | 24 | 24 | 24 |
| 最高工作温度 | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C | 75 °C |
| 最低工作温度 | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C | -25 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SSOP | LSOP | SOP | SSOP | SOP | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE, LOW PROFILE | SMALL OUTLINE | SMALL OUTLINE, SHRINK PITCH | SMALL OUTLINE | SMALL OUTLINE |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.9 mm | 1.6 mm | 1.9 mm | 2.01 mm | 2.01 mm | 1.9 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 电信集成电路类型 | CORDLESS TELEPHONE SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | SUPPORT CIRCUIT | CORDLESS TELEPHONE SUPPORT CIRCUIT |
| 温度等级 | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED |
| 端子面层 | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER | TIN/TIN COPPER |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 10 | 10 | 10 | 10 | 10 | 10 |
| 宽度 | 5.4 mm | 4.4 mm | 5.4 mm | 5.4 mm | 5.4 mm | 5.4 mm |
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