EEPROM, 2KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Catalyst |
| 零件包装代码 | DIP |
| 包装说明 | DIP, DIP8,.3 |
| 针数 | 8 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | 2 WIRE INTERFACE; PAGE WRITE |
| 最大时钟频率 (fCLK) | 0.1 MHz |
| 数据保留时间-最小值 | 100 |
| I2C控制字节 | 1010MMMR |
| JESD-30 代码 | R-PDIP-T8 |
| JESD-609代码 | e0 |
| 长度 | 9.27 mm |
| 内存密度 | 16384 bit |
| 内存集成电路类型 | EEPROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 2048 words |
| 字数代码 | 2000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 2KX8 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | DIP |
| 封装等效代码 | DIP8,.3 |
| 封装形状 | RECTANGULAR |
| 封装形式 | IN-LINE |
| 并行/串行 | SERIAL |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 4.57 mm |
| 串行总线类型 | I2C |
| 最大待机电流 | 9e-7 A |
| 最大压摆率 | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | THROUGH-HOLE |
| 端子节距 | 2.54 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 7.62 mm |
| 最长写入周期时间 (tWC) | 10 ms |
| CAT24C16ZP | CAT24C16ZJ14I | CAT24C16ZJI | CAT24C16ZJ | CAT24C16J14 | CAT24C16ZJ14 | CAT24C16J14I | CAT24C16J | CAT24C16JI | CAT24C16ZPI | |
|---|---|---|---|---|---|---|---|---|---|---|
| 描述 | EEPROM, 2KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 | EEPROM, 2KX8, Serial, CMOS, PDSO14, 0.150 INCH, SOIC-14 | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 2KX8, Serial, CMOS, PDSO14, 0.150 INCH, SOIC-14 | EEPROM, 2KX8, Serial, CMOS, PDSO14, 0.150 INCH, SOIC-14 | EEPROM, 2KX8, Serial, CMOS, PDSO14, 0.150 INCH, SOIC-14 | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 2KX8, Serial, CMOS, PDSO8, 0.150 INCH, SOIC-8 | EEPROM, 2KX8, Serial, CMOS, PDIP8, 0.300 INCH, PLASTIC, DIP-8 |
| 厂商名称 | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst | Catalyst |
| 零件包装代码 | DIP | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | DIP |
| 包装说明 | DIP, DIP8,.3 | SOP, SOP14,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP14,.25 | SOP, SOP8,.25 | SOP, SOP8,.25 | DIP, DIP8,.3 |
| 针数 | 8 | 14 | 8 | 8 | 14 | 14 | 14 | 8 | 8 | 8 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE | 2 WIRE INTERFACE; PAGE WRITE |
| 最大时钟频率 (fCLK) | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz | 0.1 MHz |
| 数据保留时间-最小值 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 | 100 |
| I2C控制字节 | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR | 1010MMMR |
| JESD-30 代码 | R-PDIP-T8 | R-PDSO-G14 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G14 | R-PDSO-G8 | R-PDSO-G8 | R-PDIP-T8 |
| 长度 | 9.27 mm | 8.65 mm | 4.9 mm | 4.9 mm | 8.65 mm | 8.65 mm | 8.65 mm | 4.9 mm | 4.9 mm | 9.27 mm |
| 内存密度 | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit | 16384 bit |
| 内存集成电路类型 | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM | EEPROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 14 | 8 | 8 | 14 | 14 | 14 | 8 | 8 | 8 |
| 字数 | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words | 2048 words |
| 字数代码 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 | 2000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C |
| 组织 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 | 2KX8 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | DIP | SOP | SOP | SOP | SOP | SOP | SOP | SOP | SOP | DIP |
| 封装等效代码 | DIP8,.3 | SOP14,.25 | SOP8,.25 | SOP8,.25 | SOP14,.25 | SOP14,.25 | SOP14,.25 | SOP8,.25 | SOP8,.25 | DIP8,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | IN-LINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.57 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 1.75 mm | 4.57 mm |
| 串行总线类型 | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C | I2C |
| 最大待机电流 | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A | 9e-7 A |
| 最大压摆率 | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA | 0.003 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | YES | YES | YES | YES | YES | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | THROUGH-HOLE | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | THROUGH-HOLE |
| 端子节距 | 2.54 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 7.62 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 3.9 mm | 7.62 mm |
| 最长写入周期时间 (tWC) | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms | 10 ms |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | - | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | 不符合 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | - | - | e0 |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - | NOT SPECIFIED |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - | - | - |
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