IC SERIAL INPUT LOADING, 8 us SETTLING TIME, 14-BIT DAC, PQFP32, MO-026-ABA, TQFP-32, Digital to Analog Converter
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | ADI(亚德诺半导体) |
零件包装代码 | QFP |
包装说明 | MO-026-ABA, TQFP-32 |
针数 | 32 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最大模拟输出电压 | 10 V |
最小模拟输出电压 | -10 V |
转换器类型 | D/A CONVERTER |
输入位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
输入格式 | SERIAL |
JESD-30 代码 | S-PQFP-G32 |
JESD-609代码 | e0 |
长度 | 7 mm |
最大线性误差 (EL) | 0.0244% |
标称负供电电压 | -15 V |
位数 | 14 |
功能数量 | 1 |
端子数量 | 32 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | TQFP |
封装等效代码 | QFP32,.35SQ,32 |
封装形状 | SQUARE |
封装形式 | FLATPACK, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED |
电源 | 3/5,+-12/+-15 V |
认证状态 | Not Qualified |
座面最大高度 | 1.2 mm |
最大稳定时间 | 10 µs |
标称安定时间 (tstl) | 8 µs |
最大压摆率 | 3.75 mA |
标称供电电压 | 15 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7 mm |
AD5744ASU | AD5744BSUZ | AD5744BSUZ-REEL7 | AD5744CSUZ-REEL7 | AD5744BSU | AD5744CSUZ | AD5744CSU | |
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描述 | IC SERIAL INPUT LOADING, 8 us SETTLING TIME, 14-BIT DAC, PQFP32, MO-026-ABA, TQFP-32, Digital to Analog Converter | IC SERIAL INPUT LOADING, 8 us SETTLING TIME, 14-BIT DAC, PQFP32, LEAD FREE, PLASTIC, MS-026ABA, TQFP-32, Digital to Analog Converter | IC SERIAL INPUT LOADING, 8 us SETTLING TIME, 14-BIT DAC, PQFP32, LEAD FREE, PLASTIC, MS-026ABA, TQFP-32, Digital to Analog Converter | IC SERIAL INPUT LOADING, 8 us SETTLING TIME, 14-BIT DAC, PQFP32, LEAD FREE, PLASTIC, MS-026ABA, TQFP-32, Digital to Analog Converter | IC SERIAL INPUT LOADING, 8 us SETTLING TIME, 14-BIT DAC, PQFP32, MO-026-ABA, TQFP-32, Digital to Analog Converter | IC SERIAL INPUT LOADING, 8 us SETTLING TIME, 14-BIT DAC, PQFP32, LEAD FREE, PLASTIC, MS-026ABA, TQFP-32, Digital to Analog Converter | IC SERIAL INPUT LOADING, 8 us SETTLING TIME, 14-BIT DAC, PQFP32, MO-026-ABA, TQFP-32, Digital to Analog Converter |
是否Rohs认证 | 不符合 | 符合 | 符合 | 符合 | 不符合 | 符合 | 不符合 |
零件包装代码 | QFP | QFP | QFP | QFP | QFP | QFP | QFP |
包装说明 | MO-026-ABA, TQFP-32 | MS-026ABA, TQFP-32 | MS-026ABA, TQFP-32 | MS-026ABA, TQFP-32 | MO-026-ABA, TQFP-32 | MS-026ABA, TQFP-32 | MO-026-ABA, TQFP-32 |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | not_compliant | unknown | unknown | unknown | not_compliant | unknown | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最大模拟输出电压 | 10 V | 10.5263 V | 10.5263 V | 10.5263 V | 10 V | 10.5263 V | 10 V |
最小模拟输出电压 | -10 V | -10.5263 V | -10.5263 V | -10.5263 V | -10 V | -10.5263 V | -10 V |
转换器类型 | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY | OFFSET BINARY, 2\'S COMPLEMENT BINARY |
输入格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
JESD-30 代码 | S-PQFP-G32 | S-PQFP-G32 | S-PQFP-G32 | S-PQFP-G32 | S-PQFP-G32 | S-PQFP-G32 | S-PQFP-G32 |
JESD-609代码 | e0 | e3 | e3 | e3 | e0 | e3 | e0 |
长度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
最大线性误差 (EL) | 0.0244% | 0.0122% | 0.0122% | 0.0061% | 0.0122% | 0.0061% | 0.0061% |
标称负供电电压 | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V | -15 V |
位数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | TQFP | TQFP | TQFP | TQFP | TQFP | TQFP | TQFP |
封装等效代码 | QFP32,.35SQ,32 | TQFP32,.35SQ,32 | TQFP32,.35SQ,32 | TQFP32,.35SQ,32 | QFP32,.35SQ,32 | TQFP32,.35SQ,32 | QFP32,.35SQ,32 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE | FLATPACK, THIN PROFILE |
峰值回流温度(摄氏度) | NOT SPECIFIED | 225 | 225 | 225 | NOT SPECIFIED | 225 | 220 |
电源 | 3/5,+-12/+-15 V | 3/5,+-12/+-15 V | 3/5,+-12/+-15 V | 3/5,+-12/+-15 V | 3/5,+-12/+-15 V | 3/5,+-12/+-15 V | 3/5,+-12/+-15 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
最大稳定时间 | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs | 10 µs |
标称安定时间 (tstl) | 8 µs | 8 µs | 8 µs | 8 µs | 8 µs | 8 µs | 8 µs |
最大压摆率 | 3.75 mA | 14 mA | 14 mA | 14 mA | 3.75 mA | 14 mA | 3.75 mA |
标称供电电压 | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V | 15 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Matte Tin (Sn) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) | Matte Tin (Sn) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
端子节距 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | 30 |
宽度 | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm | 7 mm |
厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | - | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
是否无铅 | - | 不含铅 | 不含铅 | 不含铅 | - | 不含铅 | - |
湿度敏感等级 | - | 1 | 1 | 1 | - | 1 | - |
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