Telephone Circuit, CMOS, PDIP22
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Holtek(合泰) |
Reach Compliance Code | unknown |
晶体频率 | 3.58 MHz |
JESD-30 代码 | R-PDIP-T22 |
JESD-609代码 | e0 |
端子数量 | 22 |
最高工作温度 | 70 °C |
最低工作温度 | -20 °C |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SDIP |
封装等效代码 | SDIP22,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE, SHRINK PITCH |
电源 | 2.5/5 V |
认证状态 | Not Qualified |
最大压摆率 | 2 mA |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 1.78 mm |
端子位置 | DUAL |
HT9302FBT | HT9302FC | HT9302FCT | HT9302FAT | HT9302FD | HT9302FB | HT9302FDT | HT9302FA | |
---|---|---|---|---|---|---|---|---|
描述 | Telephone Circuit, CMOS, PDIP22 | Telephone Circuit, CMOS, PDIP20 | Telephone Circuit, CMOS, PDIP20 | Telephone Circuit, CMOS, PDIP18 | Telephone Circuit, CMOS, PDIP24 | Telephone Circuit, CMOS, PDIP22 | Telephone Circuit, CMOS, PDIP24 | Telephone Circuit, CMOS, PDIP18 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) | Holtek(合泰) |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknow |
晶体频率 | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz | 3.58 MHz |
JESD-30 代码 | R-PDIP-T22 | R-PDIP-T20 | R-PDIP-T20 | R-PDIP-T18 | R-PDIP-T24 | R-PDIP-T22 | R-PDIP-T24 | R-PDIP-T18 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
端子数量 | 22 | 20 | 20 | 18 | 24 | 22 | 24 | 18 |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
最低工作温度 | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C | -20 °C |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SDIP | DIP | DIP | DIP | SDIP | SDIP | SDIP | DIP |
封装等效代码 | SDIP22,.3 | DIP20(UNSPEC) | DIP20(UNSPEC) | DIP18(UNSPEC) | SDIP24(UNSPEC) | SDIP22,.3 | SDIP24(UNSPEC) | DIP18(UNSPEC) |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE, SHRINK PITCH | IN-LINE | IN-LINE | IN-LINE | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE, SHRINK PITCH | IN-LINE |
电源 | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V | 2.5/5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大压摆率 | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA | 2 mA |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
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