Quad 2-input multiplexer; inverting
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
厂商名称 | Harris |
包装说明 | DIP, DIP16,.3 |
Reach Compliance Code | unknow |
系列 | HC/UH |
JESD-30 代码 | R-PDIP-T16 |
JESD-609代码 | e0 |
负载电容(CL) | 50 pF |
逻辑集成电路类型 | MULTIPLEXER |
最大I(ol) | 0.004 A |
功能数量 | 4 |
输入次数 | 2 |
输出次数 | 1 |
端子数量 | 16 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出极性 | INVERTED |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP16,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
电源 | 2/6 V |
Prop。Delay @ Nom-Su | 35 ns |
传播延迟(tpd) | 190 ns |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 6 V |
最小供电电压 (Vsup) | 2 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
CD74HC158E | 74HC158 | CD74HC157M | CD74HCT157E | CD74HCT157M | CD74HCT158E | |
---|---|---|---|---|---|---|
描述 | Quad 2-input multiplexer; inverting | Quad 2-input multiplexer; inverting | HC/UH SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, TRUE OUTPUT, PDSO16 | Quad 2-input multiplexer; inverting | Quad 2-input multiplexer; inverting | HCT SERIES, QUAD 2 LINE TO 1 LINE MULTIPLEXER, INVERTED OUTPUT, PDIP16 |
是否Rohs认证 | 不符合 | - | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Harris | - | Harris | - | Harris | Harris |
包装说明 | DIP, DIP16,.3 | - | SOP, SOP16,.25 | DIP, DIP16,.3 | SOP, SOP16,.25 | DIP, DIP16,.3 |
Reach Compliance Code | unknow | - | unknow | unknow | unknow | unknow |
系列 | HC/UH | - | HC/UH | HCT | HCT | HCT |
JESD-30 代码 | R-PDIP-T16 | - | R-PDSO-G16 | R-PDIP-T16 | R-PDSO-G16 | R-PDIP-T16 |
JESD-609代码 | e0 | - | e0 | e0 | e0 | e0 |
负载电容(CL) | 50 pF | - | 50 pF | 50 pF | 50 pF | 50 pF |
逻辑集成电路类型 | MULTIPLEXER | - | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER | MULTIPLEXER |
最大I(ol) | 0.004 A | - | 0.004 A | 0.004 A | 0.004 A | 0.004 A |
功能数量 | 4 | - | 4 | 4 | 4 | 4 |
输入次数 | 2 | - | 2 | 2 | 2 | 2 |
输出次数 | 1 | - | 1 | 1 | 1 | 1 |
端子数量 | 16 | - | 16 | 16 | 16 | 16 |
最高工作温度 | 125 °C | - | 125 °C | 125 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | - | -55 °C | -55 °C | -55 °C | -55 °C |
输出极性 | INVERTED | - | TRUE | TRUE | TRUE | INVERTED |
封装主体材料 | PLASTIC/EPOXY | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | - | SOP | DIP | SOP | DIP |
封装等效代码 | DIP16,.3 | - | SOP16,.25 | DIP16,.3 | SOP16,.25 | DIP16,.3 |
封装形状 | RECTANGULAR | - | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | - | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE |
电源 | 2/6 V | - | 2/6 V | 5 V | 5 V | 5 V |
Prop。Delay @ Nom-Su | 35 ns | - | 31 ns | 38 ns | 38 ns | 40 ns |
传播延迟(tpd) | 190 ns | - | 180 ns | 46 ns | 46 ns | 44 ns |
认证状态 | Not Qualified | - | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 6 V | - | 6 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 2 V | - | 2 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | - | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | - | YES | NO | YES | NO |
技术 | CMOS | - | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | - | MILITARY | MILITARY | MILITARY | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | THROUGH-HOLE | - | GULL WING | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
端子节距 | 2.54 mm | - | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
端子位置 | DUAL | - | DUAL | DUAL | DUAL | DUAL |
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