DATA SHEET
µ
PC2757TB,
µ
PC2758TB
SILICON MMIC 1st FREQUENCY DOWN-CONVERTER
FOR CELLULAR/CORDLESS TELEPHONE
BIPOLAR ANALOG INTEGRATED CIRCUITS
DESCRIPTION
The
µ
PC2757TB and
µ
PC2758TB are silicon monolithic integrated circuit designed as 1st frequency down-
converter for cellular/cordless telephone receiver stage.
The ICs consist of mixer and local amplifier.
The
µ
PC2757TB features low current consumption and the
µ
PC2758TB features improved intermodulation. From these
two version, you can chose either IC corresponding to your system design. These TB suffix ICs which are smaller
package than conventional T suffix ICs contribute to reduce your system size.
The
µ
PC2757TB and
µ
PC2758TB are manufactured using NEC’s 20 GHz f
T
NESAT™||| silicon bipolar process.
This process uses silicon nitride passivation film and gold electrodes. These materials can protect chip surface from
external pollution and prevent corrosion/migration. Thus, this IC has excellent performance, uniformity and reliability.
FEATURES
• Wideband operation
• High-density surface mounting
• Low current consumption
• Supply voltage
• Minimized carrier leakage
• Equable output impedance
• Built-in power save function
: f
RFin
= 0.1 to 2.0 GHz, f
IFin
= 20 to 300 MHz
: 6-pin super minimold package
: I
CC
= 5.6 mA TYP. @
µ
PC2757TB
I
CC
= 11 mA TYP. @
µ
PC2758TB
: V
CC
= 2.7 to 3.3 V
: Due to double balanced mixer
: Single-end push-pull IF amplifier
APPLICATIONS
• Cellular/cordless telephone up to 2.0 GHz MAX. (example: GSM, PDC800M, PDC1.5G and so on):
µ
PC2758TB
• Cellular/cordless telephone up to 2.0 GHz MAX. (example: CT1, CT2 and so on):
µ
PC2757TB
ORDERING INFORMATION
Part Number
Package
6-pin
super
minimold
Markings
C1X
C1Y
Supplying Form
Embossed tape 8 mm wide.
Pin 1, 2, 3 face the tape perforation side.
Qty 3kpcs/reel.
Product Type
Low current consumption
High OIP
3
µ
PC2757TB-E3
µ
PC2758TB-E3
Remark
To order evaluation samples, please contact your local NEC sales office.
(Part number for sample order:
µ
PC2757TB,
µ
PC2758TB)
Caution Electro-static sensitive devices
The information in this document is subject to change without notice. Before using this document, please
confirm that this is the latest version.
Not all devices/types available in every country. Please check with local NEC representative for
availability and additional information.
Document No. P12771EJ2V0DS00 (2nd edition)
Date Published June 2000 N CP(K)
Printed in Japan
The mark
shows major revised points.
©
1997, 2000
µ
PC2757TB,
µ
PC2758TB
PIN CONNECTIONS
µ
PC2757TB,
µ
PC2758TB in common
(Top View)
3
2
1
(Bottom View)
4
5
6
4
5
6
3
2
1
Pin No.
1
2
3
4
Pin Name
RFinput
GND
LOinput
PS
V
CC
IFoutput
Example marking is for
µ
PC2757TB
C1X
5
6
PRODUCT LINE-UP (T
A
= +25°C, V
CC
= 3.0 V, Z
S
= Z
L
= 50
Ω
)
Items
Part No.
No RF
I
CC
(mA)
5.6
900 MHz 1.5 GHz 1.9 GHz 900 MHz
CG
SSB · NF SSB · NF SSB · NF
(dB)
(dB)
(dB)
(dB)
10
10
13
15
1.5 GHz
CG
(dB)
15
1.9 GHz
CG
(dB)
13
900 MHz
IIP
3
(dBm)
−14
1.5 GHz
IIP
3
(dBm)
−14
1.9 GHz
IIP
3
(dBm)
−12
µ
PC2757T
µ
PC2757TB
µ
PC2758T
µ
PC2758TB
µ
PC8112T
µ
PC8112TB
8.5
9
11
11
15
13
13
11
9
10
13
19
18
17
−13
−12
−11
−10
−9
−7
Items
Part No.
900 MHz
P
O(sat)
(dBm)
−3
1.5 GHz
P
O(sat)
(dBm)
−
1.9 GHz
P
O(sat)
(dBm)
−8
900 MHz
RF
LO
(dB)
−
1.5 GHz
RF
LO
(dB)
−
1.9 GHz
RF
LO
(dB)
−
IF Output
Configuration
Packages
µ
PC2757T
µ
PC2757TB
µ
PC2758T
µ
PC2758TB
µ
PC8112T
µ
PC8112TB
6-pin minimold
6-pin super minimold
Emitter follower
+1
−
−4
−
−
−
6-pin minimold
6-pin super minimold
−2.5
−3
−3
−80
−57
−55
6-pin minimold
Open collector
6-pin super minimold
Remark
Typical performance. Please refer to ELECTRICAL CHARACTERISTICS in detail.
To know the associated product, please refer to each latest data sheet.
Caution The
µ
PC2757 and
µ
PC2758’s IIP
3
are calculated with
∆
IM
3
= 3 which is the same IM
3
inclination as
µ
PC8112. On the other hand, OIP
3
of Standard characteristics in page 6 is cross point IP.
2
Data Sheet P12771EJ2V0DS00
µ
PC2757TB,
µ
PC2758TB
INTERNAL BLOCK DIAGRAM (
µ
PC2757TB,
µ
PC2758TB in common)
RF
input
IF
output
POWER
SAVE
LO
input
V
CC
GND
SYSTEM APPLICATION EXAMPLE
DIGITAL CELLULAR TELEPHONE
µ
PC2758TB
Low noise Tr.
RX
DEMOD.
I
Q
VCO
SW
÷
N
PLL
PLL
I
0˚
TX
PA
φ
90˚
Q
To know the associated products, please refer to each latest data sheet.
Data Sheet P12771EJ2V0DS00
3
µ
PC2757TB,
µ
PC2758TB
PIN EXPLANATION (Both
µ
PC2757TB, 2758TB)
Pin
No.
1
Pin
Name
RFinput
Applied
Voltage (V)
−
Pin Voltage
Note
(V)
1.2
Function and Application
This pin is RF input for mixer
designed as double balance type.
This circuit contributes to suppress
spurious signal with minimum LO
and bias power consumption.
Also this symmetrical circuit can
keep specified performance insensi-
tive to process-condition
distribution.
Internal Equivalent Circuit
V
CC
To IF
Amp.
From
LO
1
2
GND
GND
–
This pin is ground of IC.
Must be connected to the system
ground with minimum inductance.
Ground pattern on the board should
be formed as wide as possible.
(Track length should be kept as
short as possible.)
This pin is LO input for local buffer
designed as differential amplifier.
Recommendable input level is –15
to 0 dBm. Also this symmetrical
circuit can keep specified
performance insensitive to process-
condition distribution.
−
3
LOinput
–
1.3
V
CC
Mixer
3
4
PS
V
CC
or GND
–
This pin is for power-save function.
This pin can control ON/OFF
operation with bias as follows;
Bias: V
V
PS
≥
2.5
0 to 0.5
Operation
ON
OFF
V
CC
4
Rise time/fall time using this pin are
approximately 10
µ
s.
5
V
CC
2.7 to 3.3
–
Supply voltage 3.0
±0.3
V for
operation. Must be connected
bypass capacitor. (example: 1 000
pF) to minimize ground impedance.
This pin is output from IF buffer
amplifier designed as single-ended
push-pull type. This pin is assigned
for emitter follower output with low-
impedance. In the case of
connecting to high-impedance
stage, please attach external
matching circuit.
−
6
IFoutput
–
1.7
V
CC
6
Note
Each pin voltage is measured with V
CC
= 3.0 V
4
Data Sheet P12771EJ2V0DS00
µ
PC2757TB,
µ
PC2758TB
ABSOLUTE MAXIMUM RATINGS
Parameter
Supply Voltage
Power Dissipation of Package Allowance
Symbol
V
CC
P
D
T
A
= +25°C
Mounted on 50
×
50
×
1.6 mm
double sided copper clad epoxy
glass board at T
A
= +85°C
Conditions
Ratings
5.5
200
Unit
V
mW
Operating Ambient Temperature
Storage Temperature
PS Pin Voltage
T
A
T
stg
V
PS
T
A
= +25°C
–40 to +85
–55 to +150
5.5
°C
°C
V
RECOMMENDED OPERATING CONDITIONS
Parameter
Supply Voltage
Operating Ambient Temperature
LO Input Level
Symbol
V
CC
T
A
P
LOin
MIN.
2.7
–40
–15
TYP.
3.0
+25
–10
MAX.
3.3
+85
0
Unit
V
°C
dBm
ELECTRICAL CHARACTERISTICS (T
A
= +25°C, V
CC
= V
PS
= 3.0 V, P
LOin
= –10 dBm, Z
S
= Z
L
= 50
Ω
)
µ
PC2757TB
Parameter
Circuit Current
RF Frequency
Response
IF Frequency
Response
Conversion Gain 1
Symbol
I
CC
f
RF
Conditions
MIN.
No input signal
CG
≥
(CG1 –3 dB)
f
IFout
= 130 MHz constant
CG
≥
(CG1 –3 dB)
f
RFin
= 0.8 GHz constant
f
RFin
= 0.8 GHz, f
IFout
= 130 MHz
P
RFin
= –40 dBm, Upper local
f
RFin
= 2.0 GHz, f
IFout
= 250 MHz
P
RFin
= –40 dBm, Lower local
3.7
0.1
TYP.
5.6
−
−
MAX.
7.7
2.0
MIN.
6.6
0.1
TYP.
11
−
−
MAX.
14.8
2.0
mA
GHz
µ
PC2758TB
Unit
f
IF
20
300
20
300
MHz
CG1
12
15
18
16
19
22
dB
Conversion Gain 2
CG2
10
−
−
13
16
14
−
−
17
20
dB
Single Sideband
Noise Figure 1
Single Sideband
Noise Figure 2
Saturated Output
Power 1
Saturated Output
Power 2
SSB • NF1 f
RFin
= 0.8 GHz, f
IFout
= 130 MHz,
SSB mode, Upper local
SSB • NF2 f
RFin
= 2.0 GHz, f
IFout
= 250 MHz,
SSB mode, Lower local
P
O(sat)
1
f
RFin
= 0.8 GHz, f
IFout
= 130 MHz
P
RFin
= –10 dBm, Upper local
f
RFin
= 2.0 GHz, f
IFout
= 250 MHz
P
RFin
= –10 dBm, Lower local
10
13
9
12
dB
13
16
−
−
13
15
−
−
dB
–11
–3
–7
+1
dBm
P
O(sat)
2
–11
–8
–7
–4
dBm
Data Sheet P12771EJ2V0DS00
5
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