D ts e t
aa h e
R c e t r lc r nc
o h se Ee to is
Ma u a t r dCo o e t
n fc u e
mp n n s
R c e tr b a d d c mp n ns ae
o h se rn e
o oet r
ma ua trd u ig ete dewaes
n fcue sn i r i/ fr
h
p rh s d f m te oiia s p l r
uc a e r
o h r n l u pi s
g
e
o R c e tr waes rce td f m
r o h se
fr e rae r
o
te oiia I. Al rce t n ae
h
r nl P
g
l e rai s r
o
d n wi tea p o a o teOC
o e t h p rv l f h
h
M.
P r aetse u igoiia fcoy
at r e td sn r n la tr
s
g
ts p o rmso R c e tr e eo e
e t rga
r o h se d v lp d
ts s lt n t g aa te p o u t
e t oui s o u rne
o
rd c
me t o e c e teOC d t s e t
es r x e d h
M aa h e.
Qu l yOv riw
ai
t
e ve
• IO- 0 1
S 90
•A 92 cr ct n
S 1 0 et ai
i
o
• Qu l e Ma ua trr Ls (
ai d
n fcues it QML MI- R -
) LP F
385
53
•C a sQ Mitr
ls
lay
i
•C a sVS a eL v l
ls
p c ee
• Qu l e S p l r Ls o D sr uos( L )
ai d u pi s it f it b tr QS D
e
i
•R c e trsacic l u pir oD A a d
o h se i
r ia s p l t L n
t
e
me t aln u t a dD A sa d r s
es lid sr n L tn ad .
y
R c e tr lcrnc , L i c mmi e t
o h se Ee t is L C s o
o
tdo
t
s p ligp o u t ta s t f c so r x e t-
u pyn rd cs h t ai y u tme e p ca
s
t n fr u lya daee u loto eoiial
i s o q ai n r q a t h s r n l
o
t
g
y
s p l db id sr ma ua trr.
u pi
e yn ut
y n fcues
T eoiia ma ua trr d ts e t c o a yn ti d c me t e e t tep r r n e
h r n l n fcue’ aa h e a c mp n ig hs o u n r cs h ef ma c
g
s
o
a ds e ic t n o teR c e tr n fcue v rino ti d vc . o h se Ee t n
n p c ai s f h o h se ma ua trd eso f hs e ie R c e tr lcr -
o
o
isg aa te tep r r n eo i s mio d co p o u t t teoiia OE s e ic -
c u rne s h ef ma c ft e c n u tr rd cs o h r n l M p c a
o
s
g
t n .T pc lv le aefr eee c p r o e o l. eti mii m o ma i m rt g
i s ‘y ia’ au s r o rfrn e up s s ny C r n nmu
o
a
r xmu ai s
n
ma b b s do p o u t h rceiain d sg , i lt n o s mpetsig
y e a e n rd c c aa tr t , e in smuai , r a l e t .
z o
o
n
© 2 1 R cetr l t n s LC Al i t R sre 0 1 2 1
0 3 ohs E cr i , L . lRg s eevd 7 1 0 3
e e oc
h
T l r m r, l s v iw wrcl . m
o e n oe p ae it w . e c o
a
e
s
o ec
TLE206x, TLE206xA, TLE206xB
EXCALIBUR JFET INPUT HIGH OUTPUT DRIVE
µPOWER
OPERATIONAL AMPLIFIERS
SLOS193B − FEBRUARY 1997 − REVISED MAY 2004
D
2× Bandwidth (2 MHz) of the TL06x and
D
D
TL03x Operational Amplifiers
Low Supply Current . . . 290
µA/Ch
Typ
On-chip Offset Voltage Trimming for
Improved DC Performance
D
High Output Drive, Specified into 100-Ω
D
Loads
Lower Noise Floor Than Earlier
Generations of Low-Power BiFETs
description
The TLE206x series of low-power JFET-input operational amplifiers doubles the bandwidth of the earlier
generation TL06x and TL03x BiFET families without significantly increasing power consumption. Texas
Instruments Excalibur process also delivers a lower noise floor than the TL06x and TL03x. On-chip zener
trimming of offset voltage yields precision grades for dc-coupled applications. The TL206x devices are
pin-compatible with other Texas Instruments BiFETs; they can be used to double the bandwidth of TL06x and
TL03x circuits or to reduce power consumption of TL05x, TL07x, and TL08x circuits by nearly 90%.
BiFET operational amplifiers offer the inherently-higher input impedance of the JFET-input transistors, without
sacrificing the output drive associated with bipolar amplifiers. This makes them better suited for interfacing with
high-impedance sensors or low-level ac signals. They also feature inherently better ac response than bipolar
or CMOS devices having comparable power consumption. The TLE206x family features a high-output-drive
circuit capable of driving 100-Ω loads at supplies as low as
±
5 V. This makes them uniquely suited for driving
transformer loads in modems and other applications requiring good ac characteristics, low power, and high
output drive.
Because BiFET operational amplifiers are designed for use with dual power supplies, care must be taken to
observe common-mode input voltage limits and output swing when operating from a single supply. DC biasing
of the input signal is required and loads should be terminated to a virtual ground node at mid-supply. Texas
Instruments TLE2426 integrated virtual ground generator is useful when operating BiFET amplifiers from single
supplies.
The TLE206x are fully specified at
±15
V and
±
5 V. For operation in low-voltage and/or single-supply systems,
Texas Instruments LinCMOS families of operational amplifiers (TLC- and TLV-prefixes) are recommended.
When moving from BiFET to CMOS amplifiers, particular attention should be paid to slew rate and bandwidth
requirements and output loading. The Texas Instruments TLV2432 and TLV2442 CMOS operational amplifiers
are excellent choices to consider.
Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of
Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.
PRODUCTION DATA information is current as of publication date.
Products conform to specifications per the terms of Texas Instruments
standard warranty. Production processing does not necessarily include
testing of all parameters.
Copyright
2004, Texas Instruments Incorporated
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
1
TLE206x, TLE206xA, TLE206xB
EXCALIBUR JFET INPUT HIGH OUTPUT DRIVE
µPOWER
OPERATIONAL AMPLIFIERS
SLOS193B − FEBRUARY 1997 − REVISED MAY 2004
TLE2061 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
VIOmax
AT 25°C
500
µV
0 C 70°C
0°C to 70 C
1.5 mV
3 mV
500
µV
−40 C 85 C
−40°C to 85°C
1.5 mV
3 mV
500
µV
−55 C 125 C
−55°C to 125°C
1.5 mV
3 mV
SMALL
OUTLINE†
(D)
—
TLE2061ACD
TLE2061CD
—
TLE2061AID
TLE2061ID
—
TLE2061AMD
TLE2061MD
CHIP
CARRIER
(FK)
—
—
—
—
—
—
—
TLE2061AMFK
TLE2061MFK
CERAMIC
DIP
(JG)
—
—
—
—
—
—
TLE2061BMJG
TLE2061AMJG
TLE2061MJG
PLASTIC
DIP
(P)
—
TLE2061ACP
TLE2061CP
—
TLE2061AIP
TLE2061IP
—
—
—
TSSOP‡
(PW)
—
—
TLE2061CPWLE
—
—
—
—
—
—
CERAMIC
FLAT PACK
(U)
—
—
—
—
—
—
—
TLE2061AMU
TLE2061MU
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2061ACDR).Chips are tested at 25°C.
‡ The PW package is available left-end taped and reeled (indicated by the LE suffix on the device type (e.g., TLE2061CPWLE).
TLE2062 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
0°C
to
70°C
−40°C
to
85°C
−55°C
to
125°C
VIOmax
AT 25°C
1 mV
2 mV
4 mV
1 mV
2 mV
4 mV
1 mV
2 mV
4 mV
SMALL OUTLINE†
(D)
TLE2062BCD
TLE2062ACD
TLE2062CD
TLE2062BID
TLE2062AID
TLE2062ID
TLE2062BMD
TLE2062AMD
TLE2062MD
CHIP CARRIER
(FK)
—
—
—
—
—
—
—
TLE2062AMFK
TLE2062MFK
CERAMIC DIP
(JG)
—
—
—
—
—
—
TLE2062BMJG
TLE2062AMJG
TLE2062MJG
PLASTIC DIP
(P)
TLE2062BCP
TLE2062ACP
TLE2062CP
TLE2062BIP
TLE2062AIP
TLE2062IP
—
—
—
CERAMIC
FLAT PACK
(U)
—
—
—
—
—
—
—
TLE2062AMU
TLE2062MU
† The D packages are available taped and reeled. Add R suffix to device type (e.g., TLE2062ACDR).
TLE2064 AVAILABLE OPTIONS
PACKAGED DEVICES
TA
0°C
to
70°C
−40°C
to
85°C
−55°C
to
125°C
VIOmax
AT 25°C
2 mV
4 mV
6 mV
2 mV
4 mV
6 mV
2 mV
4 mV
6 mV
SMALL OUTLINE†
(D)
—
TLE2064ACD
TLE2064CD
—
TLE2064AID
TLE2064ID
—
TLE2064AMD
TLE2064MD
CHIP CARRIER
(FK)
CERAMIC DIP
(J)
PLASTIC DIP
(N)
TLE2064BCN
TLE2064ACN
TLE2064CN
TLE2064BIN
TLE2064AIN
TLE2064IN
—
CERAMIC
FLAT PACK
(W)
—
—
—
—
TLE2064BMFK
TLE2064AMFK
TLE2064MFK
—
TLE2064BMJ
TLE2064AMJ
TLE2064MJ
—
—
TLE2064AMW
TLE2064MW
† The D packages are available taped and reeled. Add R suffix to device type, (e.g., TLE2064ACDR).
2
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
TLE206x, TLE206xA, TLE206xB
EXCALIBUR JFET INPUT HIGH OUTPUT DRIVE
µPOWER
OPERATIONAL AMPLIFIERS
SLOS193B − FEBRUARY 1997 − REVISED MAY 2004
TLE2061, TLE2061A, AND TLE2061B
D, DB, JG, P, OR PW PACKAGE
(TOP VIEW)
TLE2062, TLE2062A, TLE2062B
D, JG, OR P PACKAGE
(TOP VIEW)
TLE2064, TLE2064A, TLE2064B
D, J, N, OR W PACKAGE
(TOP VIEW)
OFFSET N1
IN −
IN +
V
CC −
1
2
3
4
8
7
6
5
NC
V
CC +
OUT
OFFSET N2
1OUT
1IN −
1IN +
V
CC −
1
2
3
4
8
7
6
5
V
CC +
2OUT
2IN −
2IN +
1OUT
1IN −
1IN +
V
CC +
2IN +
2IN −
2OUT
1
2
3
4
5
6
7
14
13
12
11
10
9
8
4OUT
4IN −
4IN +
V
CC −
3IN +
3IN −
3OUT
TLE2061M, TLE2061AM, TLE2061BM
FK PACKAGE
(TOP VIEW)
TLE2062M, TLE2062AM, TLE2062BM
FK PACKAGE
(TOP VIEW)
TLE2064M, TLE2064AM, TLE2064BM
FK PACKAGE
(TOP VIEW)
NC
OFFSET N1
NC
NC
NC
NC
1OUT
NC
V
CC +
NC
TLE2061 AND TLE2061A
U PACKAGE
(TOP VIEW)
VCC −
NC
OFFSET N2
NC
NC
TLE2062 AND TLE2062A
U PACKAGE
(TOP VIEW)
NC
OFFSET N1
IN−
IN+
V
CC−
1
2
3
4
5
10
9
8
7
6
NC
NC
V
CC+
OUT
OFFSET N2
NC
1OUT
1IN−
1IN+
V
CC−
1
2
3
4
5
NC − No internal connection
V
CC −
NC
2IN+
NC
10
9
8
7
6
NC
V
CC+
2OUT
2IN−
2IN+
POST OFFICE BOX 655303
•
DALLAS, TEXAS 75265
2IN −
2OUT
NC
3OUT
3IN −
NC
NC
IN −
NC
IN +
NC
3 2 1 20 19
18
4
5
6
7
8
17
16
15
14
9 10 11 12 13
NC
V
CC +
NC
OUT
NC
NC
1IN −
NC
1IN+
NC
3 2 1 20 19
18
4
5
6
7
8
17
16
15
14
9 10 11 12 13
NC
2OUT
NC
2IN −
NC
1IN +
NC
V
CC +
NC
2IN +
4
5
6
7
8
3 2 1 20 19
18
17
16
15
14
9 10 11 12 13
1IN −
1OUT
NC
4OUT
4IN −
4IN +
NC
V
CC −
NC
3IN +
3
TLE206x, TLE206xA, TLE206xB
EXCALIBUR JFET INPUT HIGH OUTPUT DRIVE
µ
POWER OPERATIONAL
APRIL 2004
AMPLIFIERS
SLOS193B − FEBRUARY 1997 − REVISED
4
VCC +
Q9
Q32
Q13
Q14
Q18
Q29
Q33
Q35
Q16
Q19
Q25
Q34
Q27
Q23
Q5
Q17
Q11
2.7 kΩ
Q10
Q20
Q24
Q38
Q31
Q15
Q21
Q12
R4
55 kΩ
R2
1.1 kΩ
R5
60 kΩ
Q22
Q26
R7
600
Ω
Q8
C2
15 pF
Q6
C1
R3
2.4 kΩ
C3
5.3 pF
Q28
Q30
D1
Q37
Q41
Q40
R6
Q7
D2
Q36
Q39
R8
20
Ω
R9
100
Ω
OUT
Q42
Q4
See Note A
VCC −
ACTUAL DEVICE COMPONENT COUNT
COMPONENT
Transistors
Resistors
Diodes
Capacitors
TLE2061
43
9
1
3
TLE2062
42
9
2
3
TLE2064
42
9
2
3
equivalent schematic (each channel)
IN +
IN −
Template Release Date: 7−11−94
Q1
Q3
POST OFFICE BOX 655303
15 pF
Q2
•
DALLAS, TEXAS 75265
R1
1.1 kΩ
OFFSET N2
OFFSET N1
NOTES: A. OFFSET N1 AND OFFSET N2 are only availiable on the TLE2061x devices.
B. Component values are nominal.
微控制器 MCU
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
