
Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44, CERAMIC, LCC-44
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | LCC |
| 包装说明 | QCCN, LCC44,.65SQ |
| 针数 | 44 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 具有ADC | NO |
| 地址总线宽度 | 16 |
| 位大小 | 8 |
| CPU系列 | 8051 |
| 最大时钟频率 | 12 MHz |
| DAC 通道 | NO |
| DMA 通道 | NO |
| 外部数据总线宽度 | 8 |
| JESD-30 代码 | S-CQCC-N44 |
| JESD-609代码 | e0 |
| 长度 | 16.535 mm |
| I/O 线路数量 | 32 |
| 端子数量 | 44 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| PWM 通道 | YES |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装等效代码 | LCC44,.65SQ |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 峰值回流温度(摄氏度) | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM(字节) | 256 |
| ROM(单词) | 32768 |
| ROM可编程性 | UVPROM |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 3.63 mm |
| 速度 | 12 MHz |
| 最大压摆率 | 40 mA |
| 最大供电电压 | 6 V |
| 最小供电电压 | 4 V |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 16.535 mm |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER |

| MR87C51FC | 5962-9169702MXA | 5962-9169701MXA | 5962-9169701MUA | 5962-9169702MUA | MD87C51FC | MD87C51FC-16 | RCWP1206208KDNET1C | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CQCC44, CERAMIC, LCC-44 | Microcontroller, 8-Bit, UVPROM, CMOS, CDIP40, CERDIP-40 | Microcontroller, 8-Bit, UVPROM, CMOS, CDIP40, CERDIP-40 | Microcontroller, 8-Bit, UVPROM, CMOS, CQCC44, CERAMIC, LCC-44 | 8-BIT, UVPROM, MICROCONTROLLER, CQCC44, CERAMIC, LCC-44 | Microcontroller, 8-Bit, UVPROM, 8051 CPU, 12MHz, CMOS, CDIP40, CERDIP-40 | Microcontroller, 8-Bit, UVPROM, 16MHz, CMOS, CDIP40, CERDIP-40 | Fixed Resistor, Thick Film, 0.25W, 208000ohm, 100V, 0.5% +/-Tol, -200,200ppm/Cel, Surface Mount, 1206, CHIP |
| 包装说明 | QCCN, LCC44,.65SQ | DIP, | DIP, | QCCN, | CERAMIC, LCC-44 | DIP, DIP40,.6 | DIP, | CHIP |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown | unknown | unknown |
| 端子数量 | 44 | 40 | 40 | 44 | 44 | 40 | 40 | 2 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C | 155 °C |
| 最低工作温度 | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -55 °C | -65 °C |
| 封装形式 | CHIP CARRIER | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | IN-LINE | SMT |
| 表面贴装 | YES | NO | NO | YES | YES | NO | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | THICK FILM |
| 是否无铅 | 不含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | - | - |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | - | 符合 |
| 零件包装代码 | LCC | DIP | DIP | LCC | LCC | DIP | DIP | - |
| 针数 | 44 | 40 | 40 | 44 | 44 | 40 | 40 | - |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | 3A001.A.2.C | - | 3A001.A.2.C | 3A001.A.2.C | EAR99 |
| 具有ADC | NO | NO | NO | NO | NO | NO | NO | - |
| 地址总线宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | - |
| 位大小 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| 最大时钟频率 | 12 MHz | 16 MHz | 12 MHz | 12 MHz | 16 MHz | 12 MHz | 16 MHz | - |
| DAC 通道 | NO | NO | NO | NO | NO | NO | NO | - |
| DMA 通道 | NO | NO | NO | NO | NO | NO | NO | - |
| 外部数据总线宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | - |
| JESD-30 代码 | S-CQCC-N44 | R-GDIP-T40 | R-GDIP-T40 | S-CQCC-N44 | S-CQCC-N44 | R-GDIP-T40 | R-GDIP-T40 | - |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | - | - |
| 长度 | 16.535 mm | 52.325 mm | 52.325 mm | 16.535 mm | 16.535 mm | 52.325 mm | 52.325 mm | - |
| I/O 线路数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | - |
| PWM 通道 | YES | YES | YES | YES | YES | YES | YES | - |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED | - |
| 封装代码 | QCCN | DIP | DIP | QCCN | QCCN | DIP | DIP | - |
| 封装形状 | SQUARE | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR | - |
| 峰值回流温度(摄氏度) | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | - | Not Qualified | - | - |
| ROM可编程性 | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | UVPROM | - |
| 座面最大高度 | 3.63 mm | 5.72 mm | 5.72 mm | 3.63 mm | 3.63 mm | 5.72 mm | 5.72 mm | - |
| 最大供电电压 | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | 6 V | - |
| 最小供电电压 | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | 4 V | - |
| 温度等级 | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | MILITARY | - |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - | MATTE TIN OVER NICKEL |
| 端子形式 | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE | - |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 2.54 mm | - |
| 端子位置 | QUAD | DUAL | DUAL | QUAD | QUAD | DUAL | DUAL | - |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | - | - |
| 宽度 | 16.535 mm | 15.24 mm | 15.24 mm | 16.535 mm | 16.535 mm | 15.24 mm | 15.24 mm | - |
| uPs/uCs/外围集成电路类型 | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | MICROCONTROLLER | - |
| Base Number Matches | - | 1 | 1 | 1 | 1 | 1 | 1 | - |
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