FIFO, 16KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | BGA |
| 包装说明 | BGA, |
| 针数 | 256 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 周期时间 | 7.5 ns |
| JESD-30 代码 | S-PBGA-B256 |
| JESD-609代码 | e0 |
| 长度 | 17 mm |
| 内存密度 | 589824 bit |
| 内存宽度 | 36 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 256 |
| 字数 | 16384 words |
| 字数代码 | 16000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 16KX36 |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | BGA |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 225 |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.5 mm |
| 标称供电电压 (Vsup) | 2.5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL |
| 端子节距 | 1 mm |
| 端子位置 | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 17 mm |
| IDT72T51436L7-5BBI | 2SC4375 | 2SC4460 | IDT72T51456L7-5BBI | IDT72T51456L7-5BB | IDT72T51436L7-5BB | |
|---|---|---|---|---|---|---|
| 描述 | FIFO, 16KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 | SOT-89-3L Plastic-Encapsulate Transistors | Silicon NPN transistor in a TO-3P Plastic Package. | FIFO, 64KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 | FIFO, 64KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 | FIFO, 16KX36, Synchronous, CMOS, PBGA256, 17 X 17 MM, 1 MM PITCH, PLASTIC, BGA-256 |
| 是否无铅 | 含铅 | - | - | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | - | - | 不符合 | 不符合 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 零件包装代码 | BGA | - | - | BGA | BGA | BGA |
| 包装说明 | BGA, | - | - | BGA, | BGA, | BGA, |
| 针数 | 256 | - | - | 256 | 256 | 256 |
| Reach Compliance Code | not_compliant | - | - | not_compliant | not_compliant | _compli |
| ECCN代码 | EAR99 | - | - | EAR99 | EAR99 | EAR99 |
| 周期时间 | 7.5 ns | - | - | 7.5 ns | 7.5 ns | 7.5 ns |
| JESD-30 代码 | S-PBGA-B256 | - | - | S-PBGA-B256 | S-PBGA-B256 | S-PBGA-B256 |
| JESD-609代码 | e0 | - | - | e0 | e0 | e0 |
| 长度 | 17 mm | - | - | 17 mm | 17 mm | 17 mm |
| 内存密度 | 589824 bit | - | - | 2359296 bit | 2359296 bit | 589824 bi |
| 内存宽度 | 36 | - | - | 36 | 36 | 36 |
| 湿度敏感等级 | 3 | - | - | 3 | 3 | 3 |
| 功能数量 | 1 | - | - | 1 | 1 | 1 |
| 端子数量 | 256 | - | - | 256 | 256 | 256 |
| 字数 | 16384 words | - | - | 65536 words | 65536 words | 16384 words |
| 字数代码 | 16000 | - | - | 64000 | 64000 | 16000 |
| 工作模式 | SYNCHRONOUS | - | - | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | - | - | 85 °C | 70 °C | 70 °C |
| 组织 | 16KX36 | - | - | 64KX36 | 64KX36 | 16KX36 |
| 可输出 | YES | - | - | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | - | - | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | BGA | - | - | BGA | BGA | BGA |
| 封装形状 | SQUARE | - | - | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | - | - | GRID ARRAY | GRID ARRAY | GRID ARRAY |
| 并行/串行 | PARALLEL | - | - | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 225 | - | - | 225 | 225 | 225 |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.5 mm | - | - | 3.5 mm | 3.5 mm | 3.5 mm |
| 标称供电电压 (Vsup) | 2.5 V | - | - | 2.5 V | 2.5 V | 2.5 V |
| 表面贴装 | YES | - | - | YES | YES | YES |
| 技术 | CMOS | - | - | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | - | - | INDUSTRIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | - | - | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | BALL | - | - | BALL | BALL | BALL |
| 端子节距 | 1 mm | - | - | 1 mm | 1 mm | 1 mm |
| 端子位置 | BOTTOM | - | - | BOTTOM | BOTTOM | BOTTOM |
| 处于峰值回流温度下的最长时间 | 20 | - | - | 20 | 20 | 20 |
| 宽度 | 17 mm | - | - | 17 mm | 17 mm | 17 mm |
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