IC 1-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO10, PLASTIC, MSOP-10, Analog to Digital Converter
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | Linear ( ADI ) |
| 零件包装代码 | MSOP |
| 包装说明 | HTSSOP, TSSOP10,.19,20 |
| 针数 | 10 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 2.5 V |
| 最小模拟输入电压 | |
| 最长转换时间 | 0.285 µs |
| 转换器类型 | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PDSO-G10 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 最大线性误差 (EL) | 0.0488% |
| 湿度敏感等级 | 1 |
| 模拟输入通道数量 | 1 |
| 位数 | 12 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 输出位码 | BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | HTSSOP |
| 封装等效代码 | TSSOP10,.19,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 |
| 电源 | 3.3 V |
| 认证状态 | Not Qualified |
| 采样速率 | 3.5 MHz |
| 采样并保持/跟踪并保持 | SAMPLE |
| 座面最大高度 | 1.1 mm |
| 标称供电电压 | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 3 mm |
| LTC2355CMSE-12#TR | LTC2355CMSE-14#TR | LTC2355IMSE-12#TR | LTC2355IMSE-14#TR | |
|---|---|---|---|---|
| 描述 | IC 1-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO10, PLASTIC, MSOP-10, Analog to Digital Converter | IC 1-CH 14-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO10, PLASTIC, MSOP-10, Analog to Digital Converter | IC 1-CH 12-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO10, PLASTIC, MSOP-10, Analog to Digital Converter | IC 1-CH 14-BIT PROPRIETARY METHOD ADC, SERIAL ACCESS, PDSO10, PLASTIC, MSOP-10, Analog to Digital Converter |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | MSOP | MSOP | MSOP | MSOP |
| 包装说明 | HTSSOP, TSSOP10,.19,20 | HTSSOP, TSSOP10,.19,20 | HTSSOP, TSSOP10,.19,20 | HTSSOP, TSSOP10,.19,20 |
| 针数 | 10 | 10 | 10 | 10 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 2.5 V | 2.5 V | 2.5 V | 2.5 V |
| 最长转换时间 | 0.285 µs | 0.285 µs | 0.285 µs | 0.285 µs |
| 转换器类型 | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD | ADC, PROPRIETARY METHOD |
| JESD-30 代码 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 |
| JESD-609代码 | e0 | e0 | e0 | e0 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm |
| 最大线性误差 (EL) | 0.0488% | 0.0244% | 0.0488% | 0.0244% |
| 湿度敏感等级 | 1 | 1 | 1 | 1 |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 |
| 位数 | 12 | 14 | 12 | 14 |
| 功能数量 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 70 °C | 70 °C | 85 °C | 85 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | HTSSOP | HTSSOP | HTSSOP | HTSSOP |
| 封装等效代码 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 | TSSOP10,.19,20 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, HEAT SINK/SLUG, THIN PROFILE, SHRINK PITCH |
| 峰值回流温度（摄氏度） | 235 | 235 | 235 | 235 |
| 电源 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 3.5 MHz | 3.5 MHz | 3.5 MHz | 3.5 MHz |
| 采样并保持/跟踪并保持 | SAMPLE | SAMPLE | SAMPLE | SAMPLE |
| 座面最大高度 | 1.1 mm | 1.1 mm | 1.1 mm | 1.1 mm |
| 标称供电电压 | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 20 | 20 | 20 | 20 |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm |
| 厂商名称 | Linear ( ADI ) | - | Linear ( ADI ) | Linear ( ADI ) |
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