LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, BGA8, DSBGA-8
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | BGA |
包装说明 | DSBGA-8 |
针数 | 8 |
Reach Compliance Code | unknown |
系列 | LVC/LCX/Z |
JESD-30 代码 | R-XBGA-B8 |
JESD-609代码 | e0 |
长度 | 1.9 mm |
逻辑集成电路类型 | INVERTER |
湿度敏感等级 | 1 |
功能数量 | 3 |
输入次数 | 1 |
端子数量 | 8 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | UNSPECIFIED |
封装代码 | VFBGA |
封装形状 | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 |
传播延迟(tpd) | 9.2 ns |
座面最大高度 | 0.5 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 1.65 V |
标称供电电压 (Vsup) | 1.8 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | BALL |
端子节距 | 0.5 mm |
端子位置 | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 0.9 mm |
SN74LVC3G14YEPR | SN74LVC3G14DCTR | SN74LVC3G14DCUR | SN74LVC3G14DCUT | SN74LVC3G14YZPR | SN74LVC3G14YEAR | |
---|---|---|---|---|---|---|
描述 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, BGA8, DSBGA-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8, GREEN, PLASTIC, SSOP-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8, GREEN, PLASTIC, VSSOP-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, PDSO8, GREEN, PLASTIC, VSSOP-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, BGA8, GREEN, DSBGA-8 | LVC/LCX/Z SERIES, TRIPLE 1-INPUT INVERT GATE, BGA8, MO-211EB, DSBGA-8 |
是否无铅 | 含铅 | 不含铅 | 含铅 | 不含铅 | 含铅 | 不含铅 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | BGA | SOIC | SOIC | SOIC | BGA | DSBGA |
包装说明 | DSBGA-8 | LSSOP, | VSSOP, | GREEN, PLASTIC, VSSOP-8 | GREEN, DSBGA-8 | MO-211EB, DSBGA-8 |
针数 | 8 | 8 | 8 | 8 | 8 | 8 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
系列 | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z | LVC/LCX/Z |
JESD-30 代码 | R-XBGA-B8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G8 | R-XBGA-B8 | R-XBGA-B8 |
JESD-609代码 | e0 | e4 | e0 | e4 | e1 | e0 |
长度 | 1.9 mm | 2.95 mm | 2.3 mm | 2.3 mm | 1.9 mm | 1.9 mm |
逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 |
功能数量 | 3 | 3 | 3 | 3 | 3 | 3 |
输入次数 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 8 | 8 | 8 | 8 | 8 | 8 |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
封装主体材料 | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED | UNSPECIFIED |
封装代码 | VFBGA | LSSOP | VSSOP | VSSOP | VFBGA | VFBGA |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | SMALL OUTLINE, LOW PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH | GRID ARRAY, VERY THIN PROFILE, FINE PITCH |
峰值回流温度(摄氏度) | 260 | 260 | 260 | 260 | 260 | 260 |
传播延迟(tpd) | 9.2 ns | 9.2 ns | 9.2 ns | 9.2 ns | 9.2 ns | 9.2 ns |
座面最大高度 | 0.5 mm | 1.3 mm | 0.9 mm | 0.9 mm | 0.5 mm | 0.5 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V | 1.65 V |
标称供电电压 (Vsup) | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | TIN LEAD | NICKEL PALLADIUM GOLD | TIN LEAD | NICKEL PALLADIUM GOLD | TIN SILVER COPPER | TIN LEAD |
端子形式 | BALL | GULL WING | GULL WING | GULL WING | BALL | BALL |
端子节距 | 0.5 mm | 0.65 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
端子位置 | BOTTOM | DUAL | DUAL | DUAL | BOTTOM | BOTTOM |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 0.9 mm | 2.8 mm | 2 mm | 2 mm | 0.9 mm | 0.9 mm |
是否Rohs认证 | 不符合 | 符合 | - | 符合 | 符合 | 不符合 |
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