d. See solder profile (www.vishay.com/ppg?73257). The PowerPAK SO-8 is a leadless package. The end of the lead terminal is exposed
copper (not plated) as a result of the singulation process in manufacturing. A solder fillet at the exposed copper tip cannot be guaranteed
and is not required to ensure adequate bottom side solder interconnection.
e. Rework conditions: manual soldering with a soldering iron is not recommended for leadless components.
f. Maximum under steady state conditions is 65 °C/W.
Document Number: 74282
S11-0212-Rev. C, 14-Feb-11
www.vishay.com
1
Symbol
R
thJA
R
thJC
Typical
Maximum
Unit
Si7430DP
Vishay Siliconix
SPECIFICATIONS
(T
J
= 25 °C, unless otherwise noted)
Parameter
Static
Drain-Source Breakdown Voltage
V
DS
Temperature Coefficient
V
GS(th)
Temperature Coefficient
Gate-Source Threshold Voltage
Gate-Source Leakage
Zero Gate Voltage Drain Current
On-State Drain Current
a
Drain-Source On-State Resistance
a
Forward Transconductance
a
Dynamic
b
Input Capacitance
Output Capacitance
Reverse Transfer Capacitance
Total Gate Charge
Gate-Source Charge
Gate-Drain Charge
Gate Resistance
Turn-on Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Turn-On Delay Time
Rise Time
Turn-Off Delay Time
Fall Time
Drain-Source Body Diode Characteristics
Continuous Source-Drain Diode Current
Pulse Diode Forward Current
a
Body Diode Voltage
Body Diode Reverse Recovery Time
Body Diode Reverse Recovery Charge
Reverse Recovery Fall Time
Reverse Recovery Rise Time
I
S
I
SM
V
SD
t
rr
Q
rr
t
a
t
b
I
F
= 5 A, dI/dt = 100 A/µs, T
J
= 25 °C
I
S
= 3 A
0.77
63
110
49
14
T
C
= 25 °C
32
50
1.2
95
165
A
V
ns
nC
ns
C
iss
C
oss
C
rss
Q
g
Q
gs
Q
gd
R
g
t
d(on)
t
r
t
d(off)
t
f
t
d(on)
t
r
t
d(off)
t
f
V
DD
= 50 V, R
L
= 10
Ω
I
D
≅
5 A, V
GEN
= 8 V, R
g
= 1
Ω
V
DD
= 50 V, R
L
= 10
Ω
I
D
≅
5 A, V
GEN
= 10 V, R
g
= 1
Ω
V
DS
= 75 V, V
GS
= 10 V, I
D
= 5 A
V
DS
= 50 V, V
GS
= 0 V, f = 1 MHz
1735
160
37
28.5
23
8
V
DS
= 75 V, V
GS
= 8 V, I
D
= 5 A
f = 1 MHz
6.5
0.85
14
12
22
6
16
12
20
7
1.3
21
18
33
10
24
18
30
12
ns
Ω
43
35
nC
pF
V
DS
ΔV
DS
/T
J
ΔV
GS(th)
/T
J
V
GS(th)
I
GSS
I
DSS
I
D(on)
R
DS(on)
g
fs
V
GS
= 0 V, I
D
= 250 µA
I
D
= 250 µA
V
DS
= V
GS
, I
D
= 250 µA
V
DS
= 0 V, V
GS
= ± 20 V
V
DS
= 150 V, V
GS
= 0 V
V
DS
= 150 V, V
GS
= 0 V, T
J
= 55 °C
V
DS
≥
10 V, V
GS
= 10 V
V
GS
=
10 V, I
D
= 5 A
V
GS
=
8 V, I
D
= 5 A
V
DS
= 15 V, I
D
= 5 A
30
0.036
0.0375
23
0.045
0.047
2.5
150
172
- 10
4.5
± 100
1
10
V
mV/°C
V
nA
µA
A
Ω
S
Symbol
Test Conditions
Min.
Typ.
Max.
Unit
Notes:
a. Pulse test; pulse width
≤
300 µs, duty cycle
≤
2 %
a. Guaranteed by design, not subject to production testing.
Stresses beyond those listed under “Absolute Maximum Ratings” may cause permanent damage to the device. These are stress ratings only, and functional operation
of the device at these or any other conditions beyond those indicated in the operational sections of the specifications is not implied. Exposure to absolute maximum
rating conditions for extended periods may affect device reliability.
www.vishay.com
2
Document Number: 74282
S11-0212-Rev. C, 14-Feb-11
Si7430DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
60
V
GS
= 10
V
thru 7
V
48
I
D
- Drain Current (A)
0.9
36
V
GS
= 6
V
I
D
- Drain Current (A)
T
C
= 125 °C
0.6
1.2
24
T
C
= 25 °C
0.3
T
C
= - 55 °C
12
V
GS
= 5
V
0
0
1
2
3
4
5
0.0
0
2
4
6
8
10
V
DS
- Drain-to-Source
Voltage
(V)
V
GS
- Gate-to-Source
Voltage
(V)
Output Characteristics
0.055
2000
Transfer Characteristics
R
DS(on)
- On-Resistance (Ω)
0.051
C - Capacitance (pF)
1600
C
iss
0.047
V
GS
=
8 V
0.043
V
GS
= 10
V
0.039
1200
800
C
rss
400
C
oss
0.035
0
10
20
30
40
50
60
0
0
20
40
60
80
100
I
D
- Drain Current (A)
V
DS
- Drain-to-Source
Voltage
(V)
On-Resistance vs. Drain Current and Gate Voltage
10
I
D
= 5 A
V
GS
- Gate-to-Source
Voltage
(V)
8
V
DS
= 75
V
6
V
DS
= 100
V
R
DS(on)
- On-Resistance
(Normalized)
V
DS
= 50
V
2.1
2.5
I
D
= 5 A
Capacitance
V
GS
= 10
V
1.7
4
1.3
V
GS
=
8 V
2
0.9
0
0
6
12
18
24
30
0.5
- 50
- 25
0
25
50
75
100
125
150
Q
g
- Total Gate Charge (nC)
T
J
- Junction Temperature (°C)
Gate Charge
On-Resistance vs. Junction Temperature
Document Number: 74282
S11-0212-Rev. C, 14-Feb-11
www.vishay.com
3
Si7430DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
100
R
DS(on)
- Drain-to-Source On-Resistance (Ω)
0.20
I
D
= 5 A
0.16
10
I
S
- Source Current (A)
T
J
= 150 °C
1
T
J
= 25 °C
0.12
T
J
= 125 °C
0.08
T
J
= 25 °C
0.1
0.01
0.04
0.001
0
0.2
0.4
0.6
0.8
1
1.2
0.00
0
2
4
6
8
10
V
GS
- Gate-to-Source
Voltage
(V)
V
SD
- Source-to-Drain
Voltage
(V)
Source-Drain Diode Forward Voltage
1.0
200
On-Resistance vs. Gate-to-Source Voltage
0.5
160
V
GS(th)
(V)
Po
w
er (
W
)
0.0
I
D
= 5 mA
120
- 0.5
80
- 1.0
40
- 1.5
- 50
- 25
0
25
50
75
100
125
150
0
0.001
0.01
0.1
Time (s)
1
10
T
J
- Temperature (°C)
Threshold Voltage
100
Limited
by
R
DS(on)
*
10
I
D
- Drain Current (A)
Single Pulse Power, Junction-to-Ambient
1 ms
1
10 ms
100 ms
0.1
T
A
= 25 °C
Single Pulse
0.01
0.01
0.1
1
10
100
1s
10 s
DC
1000
V
DS
- Drain-to-Source
Voltage
(V)
*
V
GS
> minimum
V
GS
at
which
R
DS(on)
is specified
Safe Operating Area, Junction-to-Ambient
www.vishay.com
4
Document Number: 74282
S11-0212-Rev. C, 14-Feb-11
Si7430DP
Vishay Siliconix
TYPICAL CHARACTERISTICS
(25 °C, unless otherwise noted)
30
24
I
D
- Drain Current (A)
18
12
6
0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
Current Derating*
85
2.5
68
2.0
Po
w
er (
W
)
Po
w
er (
W
)
51
1.5
34
1.0
17
0.5
0
0
25
50
75
100
125
150
0.0
0
25
50
75
100
125
150
T
C
- Case Temperature (°C)
T
A
- Ambient Temperature (°C)
Power, Junction-to-Case
Power, Junction-to-Ambient
* The power dissipation P
D
is based on T
J(max)
= 150 °C, using junction-to-case thermal resistance, and is more useful in settling the upper
dissipation limit for cases where additional heatsinking is used. It is used to determine the current rating, when this rating falls below the package
京公网安备 11010802033920号
Copyright © 2005-2026 EEWORLD.com.cn, Inc. All rights reserved
电子工程世界
