Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, SOJ-32
参数名称 | 属性值 |
厂商名称 | Winbond(华邦电子) |
零件包装代码 | SOJ |
包装说明 | 0.400 INCH, SOJ-32 |
针数 | 32 |
Reach Compliance Code | unknown |
ECCN代码 | 3A991.B.2.B |
最长访问时间 | 15 ns |
JESD-30 代码 | R-PDSO-J32 |
长度 | 20.96 mm |
内存密度 | 1048576 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 32 |
字数 | 131072 words |
字数代码 | 128000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 3.68 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 10.16 mm |
W24010ACI-15 | W24010ACI-12 | W24010ACJ-15 | W24010ACK-15 | W24010ACJ-12 | W24010ACK-12 | W24010ACT-15 | W24010ACT-12 | |
---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.400 INCH, SOJ-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.400 INCH, SOJ-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 0.300 INCH, SOJ-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 0.300 INCH, SOJ-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDIP32, 0.300 INCH, SKINNY, PLASTIC, DIP-32 | Standard SRAM, 128KX8, 15ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 | Standard SRAM, 128KX8, 12ns, CMOS, PDSO32, 8 X 20 MM, TSOP1-32 |
零件包装代码 | SOJ | SOJ | SOJ | DIP | SOJ | DIP | TSOP1 | TSOP1 |
包装说明 | 0.400 INCH, SOJ-32 | SOJ, | SOJ, | DIP, | SOJ, | DIP, | TSOP1, | TSOP1, |
针数 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B | 3A991.B.2.B |
最长访问时间 | 15 ns | 12 ns | 15 ns | 15 ns | 12 ns | 12 ns | 15 ns | 12 ns |
JESD-30 代码 | R-PDSO-J32 | R-PDSO-J32 | R-PDSO-J32 | R-PDIP-T32 | R-PDSO-J32 | R-PDIP-T32 | R-PDSO-G32 | R-PDSO-G32 |
长度 | 20.96 mm | 20.96 mm | 20.955 mm | 40.64 mm | 20.955 mm | 40.64 mm | 18.4 mm | 18.4 mm |
内存密度 | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit | 1048576 bit |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
字数 | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words | 131072 words |
字数代码 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 | 128000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 | 128KX8 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | SOJ | SOJ | DIP | SOJ | DIP | TSOP1 | TSOP1 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.68 mm | 3.68 mm | 3.556 mm | 5.08 mm | 3.556 mm | 5.08 mm | 1.2 mm | 1.2 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | NO | YES | NO | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | J BEND | J BEND | THROUGH-HOLE | J BEND | THROUGH-HOLE | GULL WING | GULL WING |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 0.5 mm | 0.5 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 10.16 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8 mm | 8 mm |
厂商名称 | Winbond(华邦电子) | - | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) | Winbond(华邦电子) |
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