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AC1808CG151M251SB: 产品描述Ceramic Capacitor, Multilayer, Ceramic, 250V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP; 产品类别无源元件电容器; 文件大小203KB，共2页; 制造商Fenghua (HK) Electronics Ltd

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AC1808CG151M251SB概述

Ceramic Capacitor, Multilayer, Ceramic, 250V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP

AC1808CG151M251SB规格参数

参数名称	属性值
厂商名称	Fenghua (HK) Electronics Ltd
包装说明	, 1808
Reach Compliance Code	unknown
ECCN代码	EAR99
电容	0.00015 µF
电容器类型	CERAMIC CAPACITOR
介电材料	CERAMIC
JESD-609代码	e4
安装特点	SURFACE MOUNT
多层	Yes
负容差	20%
端子数量	2
最高工作温度	125 °C
最低工作温度	-55 °C
封装形状	RECTANGULAR PACKAGE
包装方法	BULK
正容差	20%
额定（AC）电压（URac）	250 V
额定（直流）电压（URdc）	250 V
尺寸代码	1808
表面贴装	YES
温度特性代码	C0G
温度系数	-/+30ppm/Cel ppm/°C
端子面层	SILVER
端子形状	WRAPAROUND

AC1808CG151M251SB相似产品对比

	AC1808CG151M251SB	AC1808CG151K251CB	AC1808CG151K251SB	AC1808CG151K251NB	AC1808CG151M251NB	AC1808CG151J251CB	AC1808CG151J251NB	AC1808CG151J251SB	AC1808CG151M251CB	AC1808CG221J251N
描述	Ceramic Capacitor, Multilayer, Ceramic, 250V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP	Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP	Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP	Ceramic Capacitor, Multilayer, Ceramic, 250V, 10% +Tol, 10% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP	Ceramic Capacitor, Multilayer, Ceramic, 250V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP	Ceramic Capacitor, Multilayer, Ceramic, 250V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP	Ceramic Capacitor, Multilayer, Ceramic, 250V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP	Ceramic Capacitor, Multilayer, Ceramic, 250V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP	Ceramic Capacitor, Multilayer, Ceramic, 250V, 20% +Tol, 20% -Tol, C0G, 30ppm/Cel TC, 0.00015uF, Surface Mount, 1808, CHIP	Ceramic Capacitor, Multilayer, Ceramic, 250V, 5% +Tol, 5% -Tol, C0G, 30ppm/Cel TC, 0.00022uF, Surface Mount, 1808, CHIP
厂商名称	Fenghua (HK) Electronics Ltd	Fenghua (HK) Electronics Ltd	Fenghua (HK) Electronics Ltd	Fenghua (HK) Electronics Ltd	Fenghua (HK) Electronics Ltd	Fenghua (HK) Electronics Ltd	Fenghua (HK) Electronics Ltd	Fenghua (HK) Electronics Ltd	Fenghua (HK) Electronics Ltd	Fenghua (HK) Electronics Ltd
包装说明	, 1808	, 1808	, 1808	, 1808	, 1808	, 1808	, 1808	, 1808	, 1808	, 1808
Reach Compliance Code	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknown	unknow
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
电容	0.00015 µF	0.00015 µF	0.00015 µF	0.00015 µF	0.00015 µF	0.00015 µF	0.00015 µF	0.00015 µF	0.00015 µF	0.00022 µF
电容器类型	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR	CERAMIC CAPACITOR
介电材料	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC	CERAMIC
安装特点	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT	SURFACE MOUNT
多层	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes	Yes
负容差	20%	10%	10%	10%	20%	5%	5%	5%	20%	5%
端子数量	2	2	2	2	2	2	2	2	2	2
最高工作温度	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C	125 °C
最低工作温度	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C	-55 °C
封装形状	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE	RECTANGULAR PACKAGE
包装方法	BULK	BULK	BULK	BULK	BULK	BULK	BULK	BULK	BULK	BULK
正容差	20%	10%	10%	10%	20%	5%	5%	5%	20%	5%
额定（AC）电压（URac）	250 V	250 V	250 V	250 V	250 V	250 V	250 V	250 V	250 V	250 V
额定（直流）电压（URdc）	250 V	250 V	250 V	250 V	250 V	250 V	250 V	250 V	250 V	250 V
尺寸代码	1808	1808	1808	1808	1808	1808	1808	1808	1808	1808
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES	YES	YES
温度特性代码	C0G	C0G	C0G	C0G	C0G	C0G	C0G	C0G	C0G	C0G
温度系数	-/+30ppm/Cel ppm/°C	-/+30ppm/Cel ppm/°C	-/+30ppm/Cel ppm/°C	-/+30ppm/Cel ppm/°C	-/+30ppm/Cel ppm/°C	-/+30ppm/Cel ppm/°C	-/+30ppm/Cel ppm/°C	-/+30ppm/Cel ppm/°C	-/+30ppm/Cel ppm/°C	-/+30ppm/Cel ppm/°C
端子面层	SILVER	COPPER	SILVER	TIN	TIN	COPPER	TIN	SILVER	COPPER	TIN
端子形状	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND	WRAPAROUND
JESD-609代码	e4	-	e4	e3	e3	-	e3	e4	-	e3

AC1808CG151M251SB

AC1808CG151M251SB概述

AC1808CG151M251SB规格参数

AC1808CG151M251SB相似产品对比

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