FIFO, 1KX18, Synchronous, CMOS, PQCC68,
| 参数名称 | 属性值 |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) |
| 包装说明 | , |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 其他特性 | RETRANSMIT |
| 周期时间 | 25 ns |
| JESD-30 代码 | S-PQCC-J68 |
| 内存密度 | 18432 bit |
| 内存宽度 | 18 |
| 功能数量 | 1 |
| 端子数量 | 68 |
| 字数 | 1024 words |
| 字数代码 | 1000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 1KX18 |
| 输出特性 | 3-STATE |
| 可输出 | YES |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子形式 | J BEND |
| 端子位置 | QUAD |
| AP9A416-25JC | AP9A415-35JC | AP9A416-20JC | AP9A415-20JC | AP9A415-25JC | AP9A416-35JC | |
|---|---|---|---|---|---|---|
| 描述 | FIFO, 1KX18, Synchronous, CMOS, PQCC68, | FIFO, 512X18, Synchronous, CMOS, PQCC68, | FIFO, 1KX18, Synchronous, CMOS, PQCC68, | FIFO, 512X18, Synchronous, CMOS, PQCC68, | FIFO, 512X18, Synchronous, CMOS, PQCC68, | FIFO, 1KX18, Synchronous, CMOS, PQCC68, |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 其他特性 | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
| 周期时间 | 25 ns | 35 ns | 20 ns | 20 ns | 25 ns | 35 ns |
| JESD-30 代码 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 |
| 内存密度 | 18432 bit | 9216 bit | 18432 bit | 9216 bit | 9216 bit | 18432 bit |
| 内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 68 | 68 | 68 | 68 | 68 | 68 |
| 字数 | 1024 words | 512 words | 1024 words | 512 words | 512 words | 1024 words |
| 字数代码 | 1000 | 512 | 1000 | 512 | 512 | 1000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 1KX18 | 512X18 | 1KX18 | 512X18 | 512X18 | 1KX18 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | YES | YES | YES | YES | YES | YES |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 厂商名称 | Integrated Silicon Solution ( ISSI ) | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
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