FIFO, 512X18, Synchronous, CMOS, PQCC68,
参数名称 | 属性值 |
包装说明 | , |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
其他特性 | RETRANSMIT |
周期时间 | 35 ns |
JESD-30 代码 | S-PQCC-J68 |
内存密度 | 9216 bit |
内存宽度 | 18 |
功能数量 | 1 |
端子数量 | 68 |
字数 | 512 words |
字数代码 | 512 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 512X18 |
输出特性 | 3-STATE |
可输出 | YES |
封装主体材料 | PLASTIC/EPOXY |
封装形状 | SQUARE |
封装形式 | CHIP CARRIER |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | J BEND |
端子位置 | QUAD |
Base Number Matches | 1 |
AP9A415-35JC | AP9A416-20JC | AP9A415-20JC | AP9A415-25JC | AP9A416-25JC | AP9A416-35JC | |
---|---|---|---|---|---|---|
描述 | FIFO, 512X18, Synchronous, CMOS, PQCC68, | FIFO, 1KX18, Synchronous, CMOS, PQCC68, | FIFO, 512X18, Synchronous, CMOS, PQCC68, | FIFO, 512X18, Synchronous, CMOS, PQCC68, | FIFO, 1KX18, Synchronous, CMOS, PQCC68, | FIFO, 1KX18, Synchronous, CMOS, PQCC68, |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
其他特性 | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT | RETRANSMIT |
周期时间 | 35 ns | 20 ns | 20 ns | 25 ns | 25 ns | 35 ns |
JESD-30 代码 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 | S-PQCC-J68 |
内存密度 | 9216 bit | 18432 bit | 9216 bit | 9216 bit | 18432 bit | 18432 bit |
内存宽度 | 18 | 18 | 18 | 18 | 18 | 18 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 68 | 68 | 68 | 68 | 68 | 68 |
字数 | 512 words | 1024 words | 512 words | 512 words | 1024 words | 1024 words |
字数代码 | 512 | 1000 | 512 | 512 | 1000 | 1000 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 512X18 | 1KX18 | 512X18 | 512X18 | 1KX18 | 1KX18 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | YES | YES | YES | YES | YES | YES |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
厂商名称 | - | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) | Integrated Silicon Solution ( ISSI ) |
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