OTP ROM, 512X8, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24
参数名称 | 属性值 |
厂商名称 | Rochester Electronics |
零件包装代码 | DIP |
包装说明 | DIP, |
针数 | 24 |
Reach Compliance Code | unknown |
ECCN代码 | EAR99 |
JESD-30 代码 | R-GDIP-T24 |
长度 | 31.9405 mm |
内存密度 | 4096 bit |
内存集成电路类型 | OTP ROM |
内存宽度 | 8 |
功能数量 | 1 |
端子数量 | 24 |
字数 | 512 words |
字数代码 | 512 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
组织 | 512X8 |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | PARALLEL |
认证状态 | Not Qualified |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | BIPOLAR |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
AM27S25/BLA | AM27S25APC | AM27S25A/B3A | AM27S25SAJC | AM27S25A/BLA | AM27S25A/BUA | |
---|---|---|---|---|---|---|
描述 | OTP ROM, 512X8, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | OTP ROM, 512X8, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | OTP ROM, 512X8, Bipolar, CQCC28, CERAMIC, LCC-28 | 512 X 8 OTPROM, PQCC28, PLASTIC, LCC-28 | 512X8 OTPROM, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | OTP ROM, 512X8, Bipolar, CQCC32, CERAMIC, LCC-32 |
零件包装代码 | DIP | DIP | QLCC | QLCC | DIP | QFJ |
包装说明 | DIP, | DIP, | QCCN, | QCCJ, | DIP, | QCCN, |
针数 | 24 | 24 | 28 | 28 | 24 | 32 |
Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
JESD-30 代码 | R-GDIP-T24 | R-PDIP-T24 | S-CQCC-N28 | S-PQCC-J28 | R-GDIP-T24 | R-CQCC-N32 |
长度 | 31.9405 mm | 31.242 mm | 11.43 mm | 11.5062 mm | 31.9405 mm | 13.97 mm |
内存密度 | 4096 bit | 4096 bi | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 24 | 24 | 28 | 28 | 24 | 32 |
字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
字数代码 | 512 | 512 | 512 | 512 | 512 | 512 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 125 °C | 75 °C | 125 °C | 75 °C | 125 °C | 125 °C |
最低工作温度 | -55 °C | - | -55 °C | - | -55 °C | -55 °C |
组织 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | DIP | QCCN | QCCJ | DIP | QCCN |
封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | CHIP CARRIER | CHIP CARRIER | IN-LINE | CHIP CARRIER |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
认证状态 | Not Qualified | Not Qualified | Not Qualified | COMMERCIAL | COMMERCIAL | Not Qualified |
座面最大高度 | 5.08 mm | 5.715 mm | 1.905 mm | 4.57 mm | 5.08 mm | 2.54 mm |
最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | YES | YES | NO | YES |
技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
温度等级 | MILITARY | COMMERCIAL EXTENDED | MILITARY | COMMERCIAL EXTENDED | MILITARY | MILITARY |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | J BEND | THROUGH-HOLE | NO LEAD |
端子节距 | 2.54 mm | 2.54 mm | 1.27 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | QUAD | QUAD | DUAL | QUAD |
宽度 | 7.62 mm | 7.62 mm | 11.43 mm | 11.5062 mm | 7.62 mm | 11.43 mm |
厂商名称 | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
ECCN代码 | EAR99 | EAR99 | EAR99 | - | - | EAR99 |
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