OTP ROM, 512X8, Bipolar, CQCC28, CERAMIC, LCC-28
| 参数名称 | 属性值 |
| 厂商名称 | Rochester Electronics |
| 零件包装代码 | QLCC |
| 包装说明 | QCCN, |
| 针数 | 28 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| JESD-30 代码 | S-CQCC-N28 |
| 长度 | 11.43 mm |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | OTP ROM |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 512 words |
| 字数代码 | 512 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 组织 | 512X8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | QCCN |
| 封装形状 | SQUARE |
| 封装形式 | CHIP CARRIER |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.905 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | BIPOLAR |
| 温度等级 | MILITARY |
| 端子形式 | NO LEAD |
| 端子节距 | 1.27 mm |
| 端子位置 | QUAD |
| 宽度 | 11.43 mm |
| Base Number Matches | 1 |
| AM27S25A/B3A | AM27S25APC | AM27S25SAJC | AM27S25A/BLA | AM27S25A/BUA | AM27S25/BLA | |
|---|---|---|---|---|---|---|
| 描述 | OTP ROM, 512X8, Bipolar, CQCC28, CERAMIC, LCC-28 | OTP ROM, 512X8, Bipolar, PDIP24, 0.300 INCH, PLASTIC, DIP-24 | 512 X 8 OTPROM, PQCC28, PLASTIC, LCC-28 | 512X8 OTPROM, CDIP24, 0.300 INCH, CERAMIC, DIP-24 | OTP ROM, 512X8, Bipolar, CQCC32, CERAMIC, LCC-32 | OTP ROM, 512X8, Bipolar, CDIP24, 0.300 INCH, CERAMIC, DIP-24 |
| 零件包装代码 | QLCC | DIP | QLCC | DIP | QFJ | DIP |
| 包装说明 | QCCN, | DIP, | QCCJ, | DIP, | QCCN, | DIP, |
| 针数 | 28 | 24 | 28 | 24 | 32 | 24 |
| Reach Compliance Code | unknown | unknow | unknown | unknown | unknown | unknown |
| JESD-30 代码 | S-CQCC-N28 | R-PDIP-T24 | S-PQCC-J28 | R-GDIP-T24 | R-CQCC-N32 | R-GDIP-T24 |
| 长度 | 11.43 mm | 31.242 mm | 11.5062 mm | 31.9405 mm | 13.97 mm | 31.9405 mm |
| 内存密度 | 4096 bit | 4096 bi | 4096 bit | 4096 bit | 4096 bit | 4096 bit |
| 内存集成电路类型 | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM | OTP ROM |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 24 | 28 | 24 | 32 | 24 |
| 字数 | 512 words | 512 words | 512 words | 512 words | 512 words | 512 words |
| 字数代码 | 512 | 512 | 512 | 512 | 512 | 512 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 125 °C | 75 °C | 75 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -55 °C | - | - | -55 °C | -55 °C | -55 °C |
| 组织 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 | 512X8 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, GLASS-SEALED |
| 封装代码 | QCCN | DIP | QCCJ | DIP | QCCN | DIP |
| 封装形状 | SQUARE | RECTANGULAR | SQUARE | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE | CHIP CARRIER | IN-LINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | COMMERCIAL | COMMERCIAL | Not Qualified | Not Qualified |
| 座面最大高度 | 1.905 mm | 5.715 mm | 4.57 mm | 5.08 mm | 2.54 mm | 5.08 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.25 V | 5.25 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.75 V | 4.75 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | YES | NO | YES | NO |
| 技术 | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR | BIPOLAR |
| 温度等级 | MILITARY | COMMERCIAL EXTENDED | COMMERCIAL EXTENDED | MILITARY | MILITARY | MILITARY |
| 端子形式 | NO LEAD | THROUGH-HOLE | J BEND | THROUGH-HOLE | NO LEAD | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | QUAD | DUAL | QUAD | DUAL | QUAD | DUAL |
| 宽度 | 11.43 mm | 7.62 mm | 11.5062 mm | 7.62 mm | 11.43 mm | 7.62 mm |
| 厂商名称 | Rochester Electronics | - | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
| ECCN代码 | EAR99 | EAR99 | - | - | EAR99 | EAR99 |
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