Cache Tag SRAM Module, 512KX8, 7ns, CMOS, 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | DMA |
| 包装说明 | 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178 |
| 针数 | 178 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.2.A |
| 最长访问时间 | 7 ns |
| JESD-30 代码 | R-XDMA-N178 |
| JESD-609代码 | e0 |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | CACHE TAG SRAM MODULE |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 178 |
| 字数 | 524288 words |
| 字数代码 | 512000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 512KX8 |
| 封装主体材料 | UNSPECIFIED |
| 封装代码 | DIMM |
| 封装形状 | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 225 |
| 认证状态 | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3.14 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | NO LEAD |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| IDT7MPV6256SA83M | IDT7MPV6256SA66M | IDT7MPV6255SA66M | IDT7MPV6255SA83M | IDT7MPV6266SA66M | IDT7MPV6266S66M | IDT7MPV6266SA83M | IDT7MPV6266S83M | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Cache Tag SRAM Module, 512KX8, 7ns, CMOS, 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178 | Cache Tag SRAM Module, 512KX8, 7ns, CMOS, 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178 | Cache Tag SRAM Module, 256KX8, 7ns, CMOS, 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178 | Cache Tag SRAM Module, 256KX8, 7ns, CMOS, 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178 | Cache Tag SRAM Module, 64KX32, 7ns, CMOS, ELF, DMA-178 | Cache Tag SRAM Module, 1MX8, 7ns, CMOS, 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178 | Cache Tag SRAM Module, 64KX32, 7ns, CMOS, ELF, DMA-178 | Cache Tag SRAM Module, 1MX8, 7ns, CMOS, 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178 |
| 零件包装代码 | DMA | DMA | DMA | DMA | DIMM | DMA | DIMM | DMA |
| 包装说明 | 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178 | DIMM, | DIMM, | 5.06MM X 0.250 INCH, 1.08MM HEIGHT,LOW PROFILE, MODULE-178 | , | DIMM, | , | DIMM, |
| 针数 | 178 | 178 | 178 | 178 | 178 | 178 | 178 | 178 |
| Reach Compliance Code | compliant | unknown | compliant | compliant | unknown | unknown | unknown | unknow |
| ECCN代码 | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A | 3A991.B.2.A |
| 最长访问时间 | 7 ns | 7 ns | 7 ns | 7 ns | 7 ns | 7 ns | 7 ns | 7 ns |
| JESD-30 代码 | R-XDMA-N178 | R-XDMA-N178 | R-XDMA-N178 | R-XDMA-N178 | R-XDMA-N178 | R-XDMA-N178 | R-XDMA-N178 | R-XDMA-N178 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 内存密度 | 4194304 bit | 4194304 bit | 2097152 bit | 2097152 bit | 2097152 bit | 8388608 bit | 2097152 bit | 8388608 bi |
| 内存集成电路类型 | CACHE TAG SRAM MODULE | CACHE TAG SRAM MODULE | CACHE TAG SRAM MODULE | CACHE TAG SRAM MODULE | CACHE TAG SRAM MODULE | CACHE TAG SRAM MODULE | CACHE TAG SRAM MODULE | CACHE TAG SRAM MODULE |
| 内存宽度 | 8 | 8 | 8 | 8 | 32 | 8 | 32 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 178 | 178 | 178 | 178 | 178 | 178 | 178 | 178 |
| 字数 | 524288 words | 524288 words | 262144 words | 262144 words | 65536 words | 1048576 words | 65536 words | 1048576 words |
| 字数代码 | 512000 | 512000 | 256000 | 256000 | 64000 | 1000000 | 64000 | 1000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 512KX8 | 512KX8 | 256KX8 | 256KX8 | 64KX32 | 1MX8 | 64KX32 | 1MX8 |
| 封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V | 3.14 V |
| 标称供电电压 (Vsup) | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V | 3.3 V |
| 表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD | NO LEAD |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 厂商名称 | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
| 封装代码 | DIMM | DIMM | DIMM | DIMM | - | DIMM | - | DIMM |
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