DRAM Module, 1MX32, 60ns, CMOS
参数名称 | 属性值 |
厂商名称 | ACCUTEK |
Reach Compliance Code | compliant |
ECCN代码 | EAR99 |
访问模式 | PAGE |
最长访问时间 | 60 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-XZMA-T72 |
内存密度 | 33554432 bit |
内存集成电路类型 | DRAM MODULE |
内存宽度 | 32 |
功能数量 | 1 |
端口数量 | 1 |
端子数量 | 72 |
字数 | 1048576 words |
字数代码 | 1000000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 1MX32 |
封装主体材料 | UNSPECIFIED |
封装形状 | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | THROUGH-HOLE |
端子位置 | ZIG-ZAG |
AK5321024ZP-60 | AK5321024ZK-70 | AK5321024WK-70 | AK5321024WK-60 | AK5321024WP-60 | AK5321024WP-70 | AK5321024ZK-60 | AK5321024ZP-70 | |
---|---|---|---|---|---|---|---|---|
描述 | DRAM Module, 1MX32, 60ns, CMOS | DRAM Module, 1MX32, 70ns, CMOS | DRAM Module, 1MX32, 70ns, CMOS, SIMM-72 | DRAM Module, 1MX32, 60ns, CMOS, SIMM-72 | DRAM Module, 1MX32, 60ns, CMOS, SIMM-72 | DRAM Module, 1MX32, 70ns, CMOS, SIMM-72 | DRAM Module, 1MX32, 60ns, CMOS | DRAM Module, 1MX32, 70ns, CMOS |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
访问模式 | PAGE | STATIC COLUMN | STATIC COLUMN | STATIC COLUMN | PAGE | PAGE | STATIC COLUMN | PAGE |
最长访问时间 | 60 ns | 70 ns | 70 ns | 60 ns | 60 ns | 70 ns | 60 ns | 70 ns |
其他特性 | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH | RAS ONLY/CAS BEFORE RAS/HIDDEN REFRESH |
JESD-30 代码 | R-XZMA-T72 | R-XZMA-T72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XSMA-N72 | R-XZMA-T72 | R-XZMA-T72 |
内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
内存集成电路类型 | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE | DRAM MODULE |
内存宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端口数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 72 | 72 | 72 | 72 | 72 | 72 | 72 | 72 |
字数 | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words | 1048576 words |
字数代码 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 | 1000000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C | 70 °C |
组织 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 | 1MX32 |
封装主体材料 | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED | UNSPECIFIED |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY | MICROELECTRONIC ASSEMBLY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | NO LEAD | NO LEAD | NO LEAD | NO LEAD | THROUGH-HOLE | THROUGH-HOLE |
端子位置 | ZIG-ZAG | ZIG-ZAG | SINGLE | SINGLE | SINGLE | SINGLE | ZIG-ZAG | ZIG-ZAG |
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