Multiplier, 12-Bit, CMOS, CPGA120, CERAMIC, PGA-120
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | LOGIC Devices |
| 零件包装代码 | PGA |
| 包装说明 | PGA, PGA120,13X13 |
| 针数 | 120 |
| Reach Compliance Code | unknown |
| ECCN代码 | 3A001.A.2.C |
| 其他特性 | 3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INP BUSES; 2 X 12 BIT AND 3 X 4 BIT DATA OUT BUSES |
| 边界扫描 | NO |
| 最大时钟频率 | 30.3 MHz |
| 外部数据总线宽度 | 12 |
| JESD-30 代码 | S-CPGA-P120 |
| JESD-609代码 | e0 |
| 长度 | 33.4899 mm |
| 低功率模式 | NO |
| 湿度敏感等级 | 3 |
| 端子数量 | 120 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -55 °C |
| 输出数据总线宽度 | 12 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
| 封装代码 | PGA |
| 封装等效代码 | PGA120,13X13 |
| 封装形状 | SQUARE |
| 封装形式 | GRID ARRAY |
| 峰值回流温度（摄氏度） | 225 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 筛选级别 | 38535Q/M;38534H;883B |
| 座面最大高度 | 4.4196 mm |
| 最大压摆率 | 160 mA |
| 最大供电电压 | 5.5 V |
| 最小供电电压 | 4.5 V |
| 标称供电电压 | 5 V |
| 表面贴装 | NO |
| 技术 | CMOS |
| 温度等级 | MILITARY |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG |
| 端子节距 | 2.54 mm |
| 端子位置 | PERPENDICULAR |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 33.4899 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER |
| LF2250GMB33 | LF2250MMB25 | LF2250QI33 | LF2250GMB25 | LF2250MMB33 | LF2250GC33 | LF2250QC33 | |
|---|---|---|---|---|---|---|---|
| 描述 | Multiplier, 12-Bit, CMOS, CPGA120, CERAMIC, PGA-120 | Multiplier, 12-Bit, CMOS, CQFP120, CERAMIC, QFP-120 | Multiplier, 12-Bit, CMOS, PQFP120, PLASTIC, QFP-120 | Multiplier, 12-Bit, CMOS, CPGA120, CERAMIC, PGA-120 | Multiplier, 12-Bit, CMOS, CQFP120, CERAMIC, QFP-120 | Multiplier, 12-Bit, CMOS, CPGA120, CERAMIC, PGA-120 | Multiplier, 12-Bit, CMOS, PQFP120, PLASTIC, QFP-120 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | PGA | QFP | QFP | PGA | QFP | PGA | QFP |
| 包装说明 | PGA, PGA120,13X13 | QFP, QFP120,1.2SQ,32 | QFP, QFP120,1.2SQ,32 | PGA, PGA120,13X13 | QFP, QFP120,1.2SQ,32 | PGA, PGA120,13X13 | QFP, QFP120,1.2SQ,32 |
| 针数 | 120 | 120 | 120 | 120 | 120 | 120 | 120 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | 3A001.A.2.C | 3A001.A.2.C | 3A991.A.2 | 3A001.A.2.C | 3A001.A.2.C | 3A991.A.2 | 3A991.A.2 |
| 其他特性 | 3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INP BUSES; 2 X 12 BIT AND 3 X 4 BIT DATA OUT BUSES | 9 X 12 DATA INPUT AND 9 X 10 COEFFICIENT | 9 X 12 DATA INPUT AND 9 X 10 COEFFICIENT | 3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INP BUSES; 2 X 12 BIT AND 3 X 4 BIT DATA OUT BUSES | 9 X 12 DATA INPUT AND 9 X 10 COEFFICIENT | 3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INP BUSES; 2 X 12 BIT AND 3 X 4 BIT DATA OUT BUSES | 3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INP BUSES; 2 X 12 BIT AND 3 X 4 BIT DATA OUT BUSES |
| 边界扫描 | NO | NO | NO | NO | NO | NO | NO |
| 最大时钟频率 | 30.3 MHz | 40 MHz | 30.333 MHz | 40 MHz | 30.333 MHz | 30.3 MHz | 30.3 MHz |
| 外部数据总线宽度 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| JESD-30 代码 | S-CPGA-P120 | S-CQFP-G120 | S-PQFP-G120 | S-CPGA-P120 | S-CQFP-G120 | S-CPGA-P120 | S-PQFP-G120 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 33.4899 mm | 28 mm | 28 mm | 33.4899 mm | 28 mm | 33.4899 mm | 28 mm |
| 低功率模式 | NO | NO | NO | NO | NO | NO | NO |
| 湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
| 端子数量 | 120 | 120 | 120 | 120 | 120 | 120 | 120 |
| 最高工作温度 | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 70 °C | 70 °C |
| 最低工作温度 | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | - | - |
| 输出数据总线宽度 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
| 封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY |
| 封装代码 | PGA | QFP | QFP | PGA | QFP | PGA | QFP |
| 封装等效代码 | PGA120,13X13 | QFP120,1.2SQ,32 | QFP120,1.2SQ,32 | PGA120,13X13 | QFP120,1.2SQ,32 | PGA120,13X13 | QFP120,1.2SQ,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | GRID ARRAY | FLATPACK | FLATPACK | GRID ARRAY | FLATPACK | GRID ARRAY | FLATPACK |
| 峰值回流温度（摄氏度） | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 4.4196 mm | 5.08 mm | 4.1 mm | 4.4196 mm | 5.08 mm | 4.4196 mm | 4.1 mm |
| 最大供电电压 | 5.5 V | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V |
| 最小供电电压 | 4.5 V | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | NO | YES | YES | NO | YES | NO | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | PIN/PEG | GULL WING | GULL WING | PIN/PEG | GULL WING | PIN/PEG | GULL WING |
| 端子节距 | 2.54 mm | 0.8 mm | 0.8 mm | 2.54 mm | 0.8 mm | 2.54 mm | 0.8 mm |
| 端子位置 | PERPENDICULAR | QUAD | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
| 宽度 | 33.4899 mm | 28 mm | 28 mm | 33.4899 mm | 28 mm | 33.4899 mm | 28 mm |
| uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER |
| 厂商名称 | LOGIC Devices | - | - | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices |
| 筛选级别 | 38535Q/M;38534H;883B | MIL-STD-883 Class B | - | 38535Q/M;38534H;883B | MIL-STD-883 Class B | - | - |
| 最大压摆率 | 160 mA | - | - | 160 mA | - | 160 mA | 160 mA |
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