Multiplier, 12-Bit, CMOS, CQFP120, CERAMIC, QFP-120
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | QFP |
包装说明 | QFP, QFP120,1.2SQ,32 |
针数 | 120 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.2.C |
Is Samacsys | N |
其他特性 | 9 X 12 DATA INPUT AND 9 X 10 COEFFICIENT |
边界扫描 | NO |
最大时钟频率 | 40 MHz |
外部数据总线宽度 | 12 |
JESD-30 代码 | S-CQFP-G120 |
JESD-609代码 | e0 |
长度 | 28 mm |
低功率模式 | NO |
湿度敏感等级 | 3 |
端子数量 | 120 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
输出数据总线宽度 | 12 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFP |
封装等效代码 | QFP120,1.2SQ,32 |
封装形状 | SQUARE |
封装形式 | FLATPACK |
峰值回流温度(摄氏度) | 225 |
电源 | 5 V |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class B |
座面最大高度 | 5.08 mm |
最大供电电压 | 5.5 V |
最小供电电压 | 4.5 V |
标称供电电压 | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING |
端子节距 | 0.8 mm |
端子位置 | QUAD |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 28 mm |
uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER |
Base Number Matches | 1 |
LF2250MMB25 | LF2250QI33 | LF2250GMB25 | LF2250MMB33 | LF2250GC33 | LF2250QC33 | LF2250GMB33 | |
---|---|---|---|---|---|---|---|
描述 | Multiplier, 12-Bit, CMOS, CQFP120, CERAMIC, QFP-120 | Multiplier, 12-Bit, CMOS, PQFP120, PLASTIC, QFP-120 | Multiplier, 12-Bit, CMOS, CPGA120, CERAMIC, PGA-120 | Multiplier, 12-Bit, CMOS, CQFP120, CERAMIC, QFP-120 | Multiplier, 12-Bit, CMOS, CPGA120, CERAMIC, PGA-120 | Multiplier, 12-Bit, CMOS, PQFP120, PLASTIC, QFP-120 | Multiplier, 12-Bit, CMOS, CPGA120, CERAMIC, PGA-120 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | QFP | QFP | PGA | QFP | PGA | QFP | PGA |
包装说明 | QFP, QFP120,1.2SQ,32 | QFP, QFP120,1.2SQ,32 | PGA, PGA120,13X13 | QFP, QFP120,1.2SQ,32 | PGA, PGA120,13X13 | QFP, QFP120,1.2SQ,32 | PGA, PGA120,13X13 |
针数 | 120 | 120 | 120 | 120 | 120 | 120 | 120 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
ECCN代码 | 3A001.A.2.C | 3A991.A.2 | 3A001.A.2.C | 3A001.A.2.C | 3A991.A.2 | 3A991.A.2 | 3A001.A.2.C |
其他特性 | 9 X 12 DATA INPUT AND 9 X 10 COEFFICIENT | 9 X 12 DATA INPUT AND 9 X 10 COEFFICIENT | 3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INP BUSES; 2 X 12 BIT AND 3 X 4 BIT DATA OUT BUSES | 9 X 12 DATA INPUT AND 9 X 10 COEFFICIENT | 3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INP BUSES; 2 X 12 BIT AND 3 X 4 BIT DATA OUT BUSES | 3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INP BUSES; 2 X 12 BIT AND 3 X 4 BIT DATA OUT BUSES | 3 X 12 BIT DATA INPUT AND 3 X 10 BIT COEFFICIENT INP BUSES; 2 X 12 BIT AND 3 X 4 BIT DATA OUT BUSES |
边界扫描 | NO | NO | NO | NO | NO | NO | NO |
最大时钟频率 | 40 MHz | 30.333 MHz | 40 MHz | 30.333 MHz | 30.3 MHz | 30.3 MHz | 30.3 MHz |
外部数据总线宽度 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
JESD-30 代码 | S-CQFP-G120 | S-PQFP-G120 | S-CPGA-P120 | S-CQFP-G120 | S-CPGA-P120 | S-PQFP-G120 | S-CPGA-P120 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 28 mm | 28 mm | 33.4899 mm | 28 mm | 33.4899 mm | 28 mm | 33.4899 mm |
低功率模式 | NO | NO | NO | NO | NO | NO | NO |
湿度敏感等级 | 3 | 3 | 3 | 3 | 3 | 3 | 3 |
端子数量 | 120 | 120 | 120 | 120 | 120 | 120 | 120 |
最高工作温度 | 125 °C | 85 °C | 125 °C | 125 °C | 70 °C | 70 °C | 125 °C |
最低工作温度 | -55 °C | -40 °C | -55 °C | -55 °C | - | - | -55 °C |
输出数据总线宽度 | 12 | 12 | 12 | 12 | 12 | 12 | 12 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED |
封装代码 | QFP | QFP | PGA | QFP | PGA | QFP | PGA |
封装等效代码 | QFP120,1.2SQ,32 | QFP120,1.2SQ,32 | PGA120,13X13 | QFP120,1.2SQ,32 | PGA120,13X13 | QFP120,1.2SQ,32 | PGA120,13X13 |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | FLATPACK | FLATPACK | GRID ARRAY | FLATPACK | GRID ARRAY | FLATPACK | GRID ARRAY |
峰值回流温度(摄氏度) | 225 | 225 | 225 | 225 | 225 | 225 | 225 |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.08 mm | 4.1 mm | 4.4196 mm | 5.08 mm | 4.4196 mm | 4.1 mm | 4.4196 mm |
最大供电电压 | 5.5 V | 5.25 V | 5.5 V | 5.5 V | 5.25 V | 5.25 V | 5.5 V |
最小供电电压 | 4.5 V | 4.75 V | 4.5 V | 4.5 V | 4.75 V | 4.75 V | 4.5 V |
标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | NO | YES | NO | YES | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | MILITARY | INDUSTRIAL | MILITARY | MILITARY | COMMERCIAL | COMMERCIAL | MILITARY |
端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
端子形式 | GULL WING | GULL WING | PIN/PEG | GULL WING | PIN/PEG | GULL WING | PIN/PEG |
端子节距 | 0.8 mm | 0.8 mm | 2.54 mm | 0.8 mm | 2.54 mm | 0.8 mm | 2.54 mm |
端子位置 | QUAD | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR | QUAD | PERPENDICULAR |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 28 mm | 28 mm | 33.4899 mm | 28 mm | 33.4899 mm | 28 mm | 33.4899 mm |
uPs/uCs/外围集成电路类型 | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER | DSP PERIPHERAL, MULTIPLIER |
筛选级别 | MIL-STD-883 Class B | - | 38535Q/M;38534H;883B | MIL-STD-883 Class B | - | - | 38535Q/M;38534H;883B |
厂商名称 | - | - | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices | LOGIC Devices |
最大压摆率 | - | - | 160 mA | - | 160 mA | 160 mA | 160 mA |
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