IC,MICROCONTROLLER,16-BIT,6816 CPU,CMOS,TPAK,144PIN,PLASTIC
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | NXP(恩智浦) |
| 包装说明 | GQFF, TPAK144(UNSPEC) |
| Reach Compliance Code | unknown |
| 位大小 | 16 |
| CPU系列 | 6816 |
| JESD-609代码 | e0 |
| 端子数量 | 144 |
| 最高工作温度 | 105 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | GQFF |
| 封装等效代码 | TPAK144(UNSPEC) |
| 封装形式 | FLATPACK, GUARD RING |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| RAM（字节） | 1024 |
| ROM（单词） | 0 |
| 速度 | 25 MHz |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT |
| 端子位置 | QUAD |
| XC16Z1VFM25 | XC16Z1VFV16 | XC16Z1CFM16 | XC16Z1VFC25 | XC16Z1MFC20 | XC16Z1CFM20 | XC16Z1CFC20 | XC16Z1CFV25 | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC,MICROCONTROLLER,16-BIT,6816 CPU,CMOS,TPAK,144PIN,PLASTIC | IC,MICROCONTROLLER,16-BIT,6816 CPU,CMOS,QFP,144PIN,PLASTIC | IC,MICROCONTROLLER,16-BIT,6816 CPU,CMOS,TPAK,144PIN,PLASTIC | IC,MICROCONTROLLER,16-BIT,6816 CPU,CMOS,QFP,132PIN,PLASTIC | IC,MICROCONTROLLER,16-BIT,6816 CPU,CMOS,QFP,132PIN,PLASTIC | IC,MICROCONTROLLER,16-BIT,6816 CPU,CMOS,TPAK,144PIN,PLASTIC | IC,MICROCONTROLLER,16-BIT,6816 CPU,CMOS,QFP,132PIN,PLASTIC | IC,MICROCONTROLLER,16-BIT,6816 CPU,CMOS,QFP,144PIN,PLASTIC |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 厂商名称 | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) | NXP(恩智浦) |
| 包装说明 | GQFF, TPAK144(UNSPEC) | QFP, QFP144(UNSPEC) | GQFF, TPAK144(UNSPEC) | QFP, QFP132(UNSPEC) | QFP, QFP132(UNSPEC) | GQFF, TPAK144(UNSPEC) | QFP, QFP132(UNSPEC) | QFP, QFP144(UNSPEC) |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknow | unknow |
| 位大小 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| CPU系列 | 6816 | 6816 | 6816 | 6816 | 6816 | 6816 | 6816 | 6816 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 端子数量 | 144 | 144 | 144 | 132 | 132 | 144 | 132 | 144 |
| 最高工作温度 | 105 °C | 105 °C | 85 °C | 105 °C | 125 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | GQFF | QFP | GQFF | QFP | QFP | GQFF | QFP | QFP |
| 封装等效代码 | TPAK144(UNSPEC) | QFP144(UNSPEC) | TPAK144(UNSPEC) | QFP132(UNSPEC) | QFP132(UNSPEC) | TPAK144(UNSPEC) | QFP132(UNSPEC) | QFP144(UNSPEC) |
| 封装形式 | FLATPACK, GUARD RING | FLATPACK | FLATPACK, GUARD RING | FLATPACK | FLATPACK | FLATPACK, GUARD RING | FLATPACK | FLATPACK |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| RAM（字节） | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 | 1024 |
| 速度 | 25 MHz | 16.78 MHz | 16.78 MHz | 25 MHz | 20 MHz | 20 MHz | 20 MHz | 25 MHz |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) |
| 端子形式 | FLAT | GULL WING | FLAT | GULL WING | GULL WING | FLAT | GULL WING | GULL WING |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
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