RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255
参数名称 | 属性值 |
厂商名称 | IBM |
零件包装代码 | BGA |
包装说明 | BGA, |
针数 | 255 |
Reach Compliance Code | unknown |
ECCN代码 | 3A001.A.3 |
地址总线宽度 | 32 |
位大小 | 32 |
边界扫描 | YES |
最大时钟频率 | 100 MHz |
外部数据总线宽度 | 64 |
格式 | FLOATING POINT |
集成缓存 | YES |
JESD-30 代码 | S-CBGA-B255 |
长度 | 21 mm |
低功率模式 | YES |
端子数量 | 255 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | BGA |
封装形状 | SQUARE |
封装形式 | GRID ARRAY |
认证状态 | Not Qualified |
座面最大高度 | 3.3 mm |
速度 | 300 MHz |
最大供电电压 | 2 V |
最小供电电压 | 1.8 V |
标称供电电压 | 1.9 V |
表面贴装 | YES |
技术 | CMOS |
端子形式 | BALL |
端子节距 | 1.27 mm |
端子位置 | BOTTOM |
宽度 | 21 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC |
IBM25PPC604E3DB--300E | IBM25PPC604E3DB--333E | IBM25PPC604E3BB--300E | IBM25PPC604E3BB--333E | IBM25PPC604E3BB--350E | IBM25PPC604E3BB--250E | IBM25PPC604E3DB--250E | IBM25PPC604E3DB--350E | |
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描述 | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | RISC Microprocessor, 32-Bit, 300MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | RISC Microprocessor, 32-Bit, 333MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | RISC Microprocessor, 32-Bit, 250MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | RISC Microprocessor, 32-Bit, 250MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 | RISC Microprocessor, 32-Bit, 350MHz, CMOS, CBGA255, 21 X 21 MM, 1.27 MM PITCH, CERAMIC, BGA-255 |
厂商名称 | IBM | IBM | IBM | IBM | IBM | IBM | IBM | IBM |
零件包装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
包装说明 | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, | BGA, |
针数 | 255 | 255 | 255 | 255 | 255 | 255 | 255 | 255 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknow | unknow | unknow | unknow |
ECCN代码 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 | 3A001.A.3 |
地址总线宽度 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
位大小 | 32 | 32 | 32 | 32 | 32 | 32 | 32 | 32 |
边界扫描 | YES | YES | YES | YES | YES | YES | YES | YES |
最大时钟频率 | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz | 100 MHz |
外部数据总线宽度 | 64 | 64 | 64 | 64 | 64 | 64 | 64 | 64 |
格式 | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT | FLOATING POINT |
集成缓存 | YES | YES | YES | YES | YES | YES | YES | YES |
JESD-30 代码 | S-CBGA-B255 | S-CBGA-B255 | S-CBGA-B255 | S-CBGA-B255 | S-CBGA-B255 | S-CBGA-B255 | S-CBGA-B255 | S-CBGA-B255 |
长度 | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm |
低功率模式 | YES | YES | YES | YES | YES | YES | YES | YES |
端子数量 | 255 | 255 | 255 | 255 | 255 | 255 | 255 | 255 |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | BGA | BGA | BGA | BGA | BGA | BGA | BGA | BGA |
封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
封装形式 | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY | GRID ARRAY |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm | 3.3 mm |
速度 | 300 MHz | 333 MHz | 300 MHz | 333 MHz | 350 MHz | 250 MHz | 250 MHz | 350 MHz |
最大供电电压 | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V | 2 V |
最小供电电压 | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V | 1.8 V |
标称供电电压 | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V | 1.9 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
端子形式 | BALL | BALL | BALL | BALL | BALL | BALL | BALL | BALL |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
宽度 | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm | 21 mm |
uPs/uCs/外围集成电路类型 | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC | MICROPROCESSOR, RISC |
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