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MRF187R3

产品描述RF POWER FIELD EFFECT TRANSISTORS
产品类别分立半导体    晶体管   
文件大小357KB,共8页
制造商Motorola ( NXP )
官网地址https://www.nxp.com
下载文档 详细参数 选型对比 全文预览

MRF187R3概述

RF POWER FIELD EFFECT TRANSISTORS

MRF187R3规格参数

参数名称属性值
是否Rohs认证不符合
厂商名称Motorola ( NXP )
包装说明FLANGE MOUNT, R-CDFM-F2
Reach Compliance Codeunknow
ECCN代码EAR99
外壳连接SOURCE
配置SINGLE
最小漏源击穿电压65 V
最大漏极电流 (Abs) (ID)15 A
最大漏极电流 (ID)15 A
FET 技术METAL-OXIDE SEMICONDUCTOR
最高频带ULTRA HIGH FREQUENCY BAND
JESD-30 代码R-CDFM-F2
JESD-609代码e0
元件数量1
端子数量2
工作模式ENHANCEMENT MODE
最高工作温度200 °C
封装主体材料CERAMIC, METAL-SEALED COFIRED
封装形状RECTANGULAR
封装形式FLANGE MOUNT
峰值回流温度(摄氏度)NOT SPECIFIED
极性/信道类型N-CHANNEL
最大功率耗散 (Abs)250 W
认证状态Not Qualified
表面贴装YES
端子面层Tin/Lead (Sn/Pb)
端子形式FLAT
端子位置DUAL
处于峰值回流温度下的最长时间NOT SPECIFIED
晶体管应用AMPLIFIER
晶体管元件材料SILICON

文档预览

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MOTOROLA
SEMICONDUCTOR TECHNICAL DATA
Order this document
by MRF187/D
The RF MOSFET Line
N–Channel Enhancement–Mode Lateral MOSFETs
Designed for broadband commercial and industrial applications with
frequencies up to 1.0 GHz. The high gain and broadband performance of
these devices make them ideal for large–signal, common source amplifier
applications in 26 volt base station equipment.
Guaranteed Performance @ 880 MHz, 26 Volts
Output Power — 85 Watts PEP
Power Gain — 12 dB
Efficiency — 30%
Intermodulation Distortion — –28 dBc
100% Tested for Load Mismatch Stress at all Phase Angles with 5:1 VSWR
@ 26 Vdc, 880 MHz, 85 Watts CW
Excellent Thermal Stability
Characterized with Series Equivalent Large–Signal Impedance Parameters
Available in Tape and Reel. R3 Suffix = 250 Units per 56 mm, 13 Inch
Reel.
1.0 GHz, 85 W, 26 V
LATERAL N–CHANNEL
BROADBAND
RF POWER MOSFETs
LIFETIME BUY
CASE 465–06, STYLE 1
NI–780
MRF187
CASE 465A–06, STYLE 1
NI–780S
MRF187SR3
MAXIMUM RATINGS
Rating
Drain–Source Voltage
Drain–Gate Voltage (R
GS
= 1 MΩ)
Gate–Source Voltage
Drain Current — Continuous
Total Device Dissipation @ T
C
25°C
Derate above 25°C
Storage Temperature Range
Operating Junction Temperature
Symbol
V
DSS
V
DGR
V
GS
I
D
P
D
T
stg
T
J
Value
65
65
±20
15
250
1.43
–65 to +200
200
Unit
Vdc
Vdc
Vdc
Adc
Watts
W/°C
°C
°C
THERMAL CHARACTERISTICS
Characteristic
Thermal Resistance, Junction to Case
Symbol
R
θJC
Max
0.70
Unit
°C/W
NOTE –
CAUTION
– MOS devices are susceptible to damage from electrostatic charge. Reasonable precautions in handling and
packaging MOS devices should be observed.
REV 4
MOTOROLA RF
Motorola, Inc. 2002
DEVICE DATA
MRF187 MRF187R3 MRF187SR3
1
LAST ORDER 31JUL04
LAST SHIP 31JAN05
RF Power Field Effect Transistors
MRF187
MRF187R3
MRF187SR3

MRF187R3相似产品对比

MRF187R3 MRF187 MRF187SR3
描述 RF POWER FIELD EFFECT TRANSISTORS RF POWER FIELD EFFECT TRANSISTORS RF POWER FIELD EFFECT TRANSISTORS
厂商名称 Motorola ( NXP ) Motorola ( NXP ) Motorola ( NXP )
包装说明 FLANGE MOUNT, R-CDFM-F2 FLANGE MOUNT, R-CDFM-F2 FLATPACK, R-CDFP-F2
Reach Compliance Code unknow unknow unknow
ECCN代码 EAR99 EAR99 EAR99
外壳连接 SOURCE SOURCE SOURCE
配置 SINGLE SINGLE SINGLE
最小漏源击穿电压 65 V 65 V 65 V
最大漏极电流 (Abs) (ID) 15 A 15 A 15 A
最大漏极电流 (ID) 15 A 15 A 15 A
FET 技术 METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR METAL-OXIDE SEMICONDUCTOR
最高频带 ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND ULTRA HIGH FREQUENCY BAND
JESD-30 代码 R-CDFM-F2 R-CDFM-F2 R-CDFP-F2
JESD-609代码 e0 e0 e0
元件数量 1 1 1
端子数量 2 2 2
工作模式 ENHANCEMENT MODE ENHANCEMENT MODE ENHANCEMENT MODE
最高工作温度 200 °C 200 °C 200 °C
封装主体材料 CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED CERAMIC, METAL-SEALED COFIRED
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 FLANGE MOUNT FLANGE MOUNT FLATPACK
极性/信道类型 N-CHANNEL N-CHANNEL N-CHANNEL
认证状态 Not Qualified Not Qualified Not Qualified
表面贴装 YES YES YES
端子面层 Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb) Tin/Lead (Sn/Pb)
端子形式 FLAT FLAT FLAT
端子位置 DUAL DUAL DUAL
晶体管应用 AMPLIFIER AMPLIFIER AMPLIFIER
晶体管元件材料 SILICON SILICON SILICON
是否Rohs认证 不符合 - 不符合
峰值回流温度(摄氏度) NOT SPECIFIED - NOT SPECIFIED
最大功率耗散 (Abs) 250 W - 250 W
处于峰值回流温度下的最长时间 NOT SPECIFIED - NOT SPECIFIED

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