Flash, 4MX8, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8
| 参数名称 | 属性值 |
| 是否无铅 | 不含铅 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Micron Technology |
| 零件包装代码 | SOIC |
| 包装说明 | 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 |
| 针数 | 8 |
| Reach Compliance Code | compliant |
| ECCN代码 | 3A991.B.1.A |
| 最大时钟频率 (fCLK) | 50 MHz |
| 数据保留时间-最小值 | 20 |
| 耐久性 | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 |
| 长度 | 5.62 mm |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 8 |
| 功能数量 | 1 |
| 端子数量 | 8 |
| 字数 | 4194304 words |
| 字数代码 | 4000000 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4MX8 |
| 输出特性 | TOTEM POLE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP8,.31 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 峰值回流温度（摄氏度） | 260 |
| 电源 | 3/3.3 V |
| 编程电压 | 2.7 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 2.5 mm |
| 串行总线类型 | SPI |
| 最大待机电流 | 0.00005 A |
| 最大压摆率 | 0.015 mA |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V |
| 标称供电电压 (Vsup) | 3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 类型 | NOR TYPE |
| 写保护 | HARDWARE/SOFTWARE |
| M25P32-VMW6TG | M25P32-VMP6TG | M25P32-VMF6TP | M25P32-VME6TG | M25P32-VMW6G | M25P32-VMW6GBA | M25P32-VMF3TPB | |
|---|---|---|---|---|---|---|---|
| 描述 | Flash, 4MX8, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 | Flash, 4MX8, 6 X 5 MM, ROHS COMPLIANT, MLP-8 | Flash, 4MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP-16 | Flash, 4MX8, 8 X 6 MM, ROHS COMPLIANT, MLP-8 | Flash, 4MX8, PDSO8, 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 | Flash, 4MX8, PDSO8, 0.208 INCH, ROHS COMPLIANT, SOP-8 | Flash, 4MX8, PDSO16, 0.300 INCH, ROHS COMPLIANT, SOP-16 |
| 是否无铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 | 不含铅 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 零件包装代码 | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC | SOIC |
| 包装说明 | 0.208 INCH, ROHS COMPLIANT, PLASTIC, SOP-8 | HVSON, SOLCC8,.25 | 0.300 INCH, ROHS COMPLIANT, SOP-16 | 8 X 6 MM, ROHS COMPLIANT, MLP-8 | SOP, SOP8,.3 | SOP-8 | SOP-16 |
| 针数 | 8 | 8 | 16 | 8 | 8 | 8 | 16 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A | 3A991.B.1.A |
| 最大时钟频率 (fCLK) | 50 MHz | 50 MHz | 75 MHz | 50 MHz | 50 MHz | 75 MHz | 75 MHz |
| 数据保留时间-最小值 | 20 | 20 | 20 | 20 | 20 | 20 | 20 |
| 耐久性 | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles | 100000 Write/Erase Cycles |
| JESD-30 代码 | R-PDSO-G8 | R-XDSO-N8 | R-PDSO-G16 | R-XDSO-N8 | R-PDSO-G8 | R-PDSO-G8 | R-PDSO-G16 |
| 内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 16 | 8 | 8 | 8 | 16 |
| 字数 | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words | 4194304 words |
| 字数代码 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 | 4000000 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 4MX8 | 4MX8 | 4MX8 | 4MX8 | 4MX8 | 4MX8 | 4MX8 |
| 封装主体材料 | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | UNSPECIFIED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | HVSON | SOP | HVSON | SOP | SOP | SOP |
| 封装等效代码 | SOP8,.31 | SOLCC8,.25 | SOP16,.4 | SOLCC8,.24 | SOP8,.3 | SOP8,.3 | SOP16,.4 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 峰值回流温度（摄氏度） | 260 | 260 | 260 | 260 | 260 | 260 | NOT SPECIFIED |
| 电源 | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V | 3/3.3 V |
| 编程电压 | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 2.5 mm | 1 mm | 2.65 mm | 1 mm | 2.5 mm | 2.5 mm | 2.65 mm |
| 串行总线类型 | SPI | SPI | SPI | SPI | SPI | SPI | SPI |
| 最大待机电流 | 0.00005 A | 0.00001 A | 0.00001 A | 0.00005 A | 0.00001 A | 0.00001 A | 0.00005 A |
| 最大压摆率 | 0.015 mA | 0.015 mA | 0.015 mA | 0.02 mA | 0.015 mA | 0.015 mA | 0.02 mA |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V | 2.7 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | AUTOMOTIVE |
| 端子形式 | GULL WING | NO LEAD | GULL WING | NO LEAD | GULL WING | GULL WING | GULL WING |
| 端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 30 | 30 | 30 | 30 | 30 | 30 | NOT SPECIFIED |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 写保护 | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE | HARDWARE/SOFTWARE |
| 厂商名称 | Micron Technology | - | Micron Technology | Micron Technology | Micron Technology | Micron Technology | Micron Technology |
| 长度 | 5.62 mm | 6 mm | 10.3 mm | 8 mm | 5.62 mm | - | 10.3 mm |
| 标称供电电压 (Vsup) | 3 V | 3 V | 3 V | 3 V | 3 V | - | - |
| 宽度 | - | 5 mm | 7.5 mm | 6 mm | - | 5.62 mm | 7.5 mm |
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