Double Buffered 12-Bit MDAC
参数名称 | 属性值 |
包装说明 | DIP, |
Reach Compliance Code | compli |
ECCN代码 | 3A001.A.2.C |
Is Samacsys | N |
转换器类型 | D/A CONVERTER |
输入位码 | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY |
输入格式 | PARALLEL, WORD |
JESD-30 代码 | R-CDIP-T28 |
长度 | 35.56 mm |
最大线性误差 (EL) | 0.015% |
位数 | 12 |
功能数量 | 1 |
端子数量 | 28 |
最高工作温度 | 125 °C |
最低工作温度 | -55 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
认证状态 | Not Qualified |
筛选级别 | MIL-STD-883 Class C |
座面最大高度 | 5.722 mm |
标称安定时间 (tstl) | 2 µs |
标称供电电压 | 15 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | MILITARY |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 15.24 mm |
Base Number Matches | 1 |
HS3120B-2 | HS3120 | HS3120-0 | HS3120-2 | HS312000 | HS3120B-0 | HS3120C-2 | |
---|---|---|---|---|---|---|---|
描述 | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC | Double Buffered 12-Bit MDAC |
包装说明 | DIP, | - | - | - | DIP, | DIP, | DIP, |
Reach Compliance Code | compli | - | - | - | compli | compliant | compliant |
转换器类型 | D/A CONVERTER | - | - | - | D/A CONVERTER | D/A CONVERTER | D/A CONVERTER |
输入位码 | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | - | - | - | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY | BINARY, OFFSET BINARY, COMPLEMENTARY BINARY |
输入格式 | PARALLEL, WORD | - | - | - | PARALLEL, WORD | PARALLEL, WORD | PARALLEL, WORD |
JESD-30 代码 | R-CDIP-T28 | - | - | - | R-PDIP-T28 | R-CDIP-T28 | R-CDIP-T28 |
长度 | 35.56 mm | - | - | - | 35.56 mm | 35.56 mm | 35.56 mm |
最大线性误差 (EL) | 0.015% | - | - | - | 0.05% | 0.05% | 0.015% |
位数 | 12 | - | - | - | 12 | 12 | 12 |
功能数量 | 1 | - | - | - | 1 | 1 | 1 |
端子数量 | 28 | - | - | - | 28 | 28 | 28 |
最高工作温度 | 125 °C | - | - | - | 70 °C | 125 °C | 70 °C |
封装主体材料 | CERAMIC, METAL-SEALED COFIRED | - | - | - | PLASTIC/EPOXY | CERAMIC, METAL-SEALED COFIRED | CERAMIC, METAL-SEALED COFIRED |
封装代码 | DIP | - | - | - | DIP | DIP | DIP |
封装形状 | RECTANGULAR | - | - | - | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | - | - | - | IN-LINE | IN-LINE | IN-LINE |
认证状态 | Not Qualified | - | - | - | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 5.722 mm | - | - | - | 5.722 mm | 5.722 mm | 5.722 mm |
标称安定时间 (tstl) | 2 µs | - | - | - | 2 µs | 2 µs | 2 µs |
标称供电电压 | 15 V | - | - | - | 15 V | 15 V | 15 V |
表面贴装 | NO | - | - | - | NO | NO | NO |
技术 | CMOS | - | - | - | CMOS | CMOS | CMOS |
温度等级 | MILITARY | - | - | - | COMMERCIAL | MILITARY | COMMERCIAL |
端子形式 | THROUGH-HOLE | - | - | - | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | - | - | - | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | - | - | - | DUAL | DUAL | DUAL |
宽度 | 15.24 mm | - | - | - | 15.24 mm | 15.24 mm | 15.24 mm |
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