Standard SRAM, 256KX16, 15ns, CMOS, PDSO44, SOJ-44
参数名称 | 属性值 |
是否Rohs认证 | 符合 |
厂商名称 | Microsemi |
包装说明 | SOJ, SOJ44,.44 |
Reach Compliance Code | compliant |
最长访问时间 | 15 ns |
其他特性 | BATTERY BACKUP |
I/O 类型 | COMMON |
JESD-30 代码 | R-PDSO-J44 |
长度 | 28.55 mm |
内存密度 | 4194304 bit |
内存集成电路类型 | STANDARD SRAM |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 44 |
字数 | 262144 words |
字数代码 | 256000 |
工作模式 | ASYNCHRONOUS |
最高工作温度 | 70 °C |
最低工作温度 | |
组织 | 256KX16 |
输出特性 | 3-STATE |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | SOJ |
封装等效代码 | SOJ44,.44 |
封装形状 | RECTANGULAR |
封装形式 | SMALL OUTLINE |
并行/串行 | PARALLEL |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 3.76 mm |
最大待机电流 | 0.015 A |
最小待机电流 | 2 V |
最大压摆率 | 0.275 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | YES |
技术 | CMOS |
温度等级 | COMMERCIAL |
端子形式 | J BEND |
端子节距 | 1.27 mm |
端子位置 | DUAL |
宽度 | 10.16 mm |
EDI816256CA-15M44CGA | EDI816256CA-17M44MGA | EDI816256CA-17M44BGA | EDI816256CA-25M44IGA | EDI816256CA-15M44BGA | EDI816256CA-25M44MGA | EDI816256CA-17M44CGA | EDI816256CA-25M44BGA | |
---|---|---|---|---|---|---|---|---|
描述 | Standard SRAM, 256KX16, 15ns, CMOS, PDSO44, SOJ-44 | Standard SRAM, 256KX16, 17ns, CMOS, PDSO44, SOJ-44 | Standard SRAM, 256KX16, 17ns, CMOS, PDSO44, SOJ-44 | Standard SRAM, 256KX16, 25ns, CMOS, PDSO44, SOJ-44 | Standard SRAM, 256KX16, 15ns, CMOS, PDSO44, SOJ-44 | Standard SRAM, 256KX16, 25ns, CMOS, PDSO44, SOJ-44 | 256KX16 STANDARD SRAM, 17ns, PDSO44, ROHS COMPLIANT, PLASTIC, SOJ-44 | Standard SRAM, 256KX16, 25ns, CMOS, PDSO44, SOJ-44 |
是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 | 符合 |
包装说明 | SOJ, SOJ44,.44 | SOJ, SOJ44,.44 | SOJ, | SOJ, SOJ44,.44 | SOJ, | SOJ, SOJ44,.44 | SOJ, | SOJ, |
Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | unknown | compli |
最长访问时间 | 15 ns | 17 ns | 17 ns | 25 ns | 15 ns | 25 ns | 17 ns | 25 ns |
JESD-30 代码 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 | R-PDSO-J44 |
长度 | 28.55 mm | 28.55 mm | 28.55 mm | 28.55 mm | 28.55 mm | 28.55 mm | 28.55 mm | 28.55 mm |
内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bi |
内存集成电路类型 | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM | STANDARD SRAM |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 44 | 44 | 44 | 44 | 44 | 44 | 44 | 44 |
字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | SYNCHRONOUS | ASYNCHRONOUS |
最高工作温度 | 70 °C | 125 °C | 125 °C | 85 °C | 125 °C | 125 °C | 70 °C | 125 °C |
最低工作温度 | - | -55 °C | -55 °C | -40 °C | -55 °C | -55 °C | - | -55 °C |
组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ | SOJ |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE | SMALL OUTLINE |
并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
座面最大高度 | 3.76 mm | 3.76 mm | 3.76 mm | 3.76 mm | 3.76 mm | 3.76 mm | 3.76 mm | 3.76 mm |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
温度等级 | COMMERCIAL | MILITARY | MILITARY | INDUSTRIAL | MILITARY | MILITARY | COMMERCIAL | MILITARY |
端子形式 | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND | J BEND |
端子节距 | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm | 10.16 mm |
厂商名称 | Microsemi | Microsemi | - | Microsemi | Microsemi | Microsemi | - | Microsemi |
其他特性 | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP | BATTERY BACKUP | - | BATTERY BACKUP |
认证状态 | Not Qualified | Not Qualified | - | Not Qualified | - | Not Qualified | Not Qualified | - |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | - | CMOS |
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