FIFO, 256X16, 25ns, Synchronous, CMOS, PDSO28, SOIC-28
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | SOIC |
| 包装说明 | SOIC-28 |
| 针数 | 28 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 25 ns |
| 其他特性 | PORTA/PORTB:PARALLEL/SERIAL |
| 最大时钟频率 (fCLK) | 28.6 MHz |
| 周期时间 | 20 ns |
| JESD-30 代码 | R-PDSO-G28 |
| JESD-609代码 | e0 |
| 长度 | 18.3642 mm |
| 内存密度 | 4096 bit |
| 内存集成电路类型 | OTHER FIFO |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 28 |
| 字数 | 256 words |
| 字数代码 | 256 |
| 工作模式 | SYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 256X16 |
| 输出特性 | 3-STATE |
| 可输出 | NO |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | SOP |
| 封装等效代码 | SOP28,.5 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE |
| 并行/串行 | SERIAL |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 3.048 mm |
| 最大待机电流 | 0.006 A |
| 最大压摆率 | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING |
| 端子节距 | 1.27 mm |
| 端子位置 | DUAL |
| 宽度 | 8.763 mm |
| IDT72105L25SO | IDT72125L25TP | IDT72105L50TP | IDT72115L50TP | IDT72115L25SO | IDT72115L25TP | |
|---|---|---|---|---|---|---|
| 描述 | FIFO, 256X16, 25ns, Synchronous, CMOS, PDSO28, SOIC-28 | FIFO, 1KX16, 25ns, Synchronous, CMOS, PDIP28, 0.300 INCH, THIN, PLASTIC, DIP-28 | FIFO, 256X16, 50ns, Synchronous, CMOS, PDIP28, 0.300 INCH, THIN, PLASTIC, DIP-28 | FIFO, 512X16, 50ns, Synchronous, CMOS, PDIP28, 0.300 INCH, THIN, PLASTIC, DIP-28 | FIFO, 512X16, 25ns, Synchronous, CMOS, PDSO28, SOIC-28 | FIFO, 512X16, 25ns, Synchronous, CMOS, PDIP28, 0.300 INCH, THIN, PLASTIC, DIP-28 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | SOIC | DIP | DIP | DIP | SOIC | DIP |
| 包装说明 | SOIC-28 | 0.300 INCH, THIN, PLASTIC, DIP-28 | 0.300 INCH, THIN, PLASTIC, DIP-28 | 0.300 INCH, THIN, PLASTIC, DIP-28 | SOIC-28 | 0.300 INCH, THIN, PLASTIC, DIP-28 |
| 针数 | 28 | 28 | 28 | 28 | 28 | 28 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 25 ns | 25 ns | 50 ns | 50 ns | 25 ns | 25 ns |
| 其他特性 | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL |
| 最大时钟频率 (fCLK) | 28.6 MHz | 28.6 MHz | 15.4 MHz | 15.4 MHz | 28.6 MHz | 28.6 MHz |
| 周期时间 | 20 ns | 20 ns | 25 ns | 25 ns | 20 ns | 20 ns |
| JESD-30 代码 | R-PDSO-G28 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 18.3642 mm | 34.544 mm | 34.544 mm | 34.544 mm | 18.3642 mm | 34.544 mm |
| 内存密度 | 4096 bit | 16384 bit | 4096 bit | 8192 bit | 8192 bit | 8192 bit |
| 内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
| 字数 | 256 words | 1024 words | 256 words | 512 words | 512 words | 512 words |
| 字数代码 | 256 | 1000 | 256 | 512 | 512 | 512 |
| 工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 组织 | 256X16 | 1KX16 | 256X16 | 512X16 | 512X16 | 512X16 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 可输出 | NO | NO | NO | NO | NO | NO |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | SOP | DIP | DIP | DIP | SOP | DIP |
| 封装等效代码 | SOP28,.5 | DIP28,.3 | DIP28,.3 | DIP28,.3 | SOP28,.5 | DIP28,.3 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE |
| 并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 3.048 mm | 4.57 mm | 4.57 mm | 4.57 mm | 3.048 mm | 4.57 mm |
| 最大待机电流 | 0.006 A | 0.006 A | 0.006 A | 0.008 A | 0.006 A | 0.006 A |
| 最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | NO | NO | NO | YES | NO |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE |
| 端子节距 | 1.27 mm | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 8.763 mm | 7.62 mm | 7.62 mm | 7.62 mm | 8.763 mm | 7.62 mm |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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