FIFO, 256X16, 50ns, Synchronous, CMOS, PDIP28, 0.300 INCH, THIN, PLASTIC, DIP-28
参数名称 | 属性值 |
是否Rohs认证 | 不符合 |
零件包装代码 | DIP |
包装说明 | 0.300 INCH, THIN, PLASTIC, DIP-28 |
针数 | 28 |
Reach Compliance Code | not_compliant |
ECCN代码 | EAR99 |
最长访问时间 | 50 ns |
其他特性 | PORTA/PORTB:PARALLEL/SERIAL |
最大时钟频率 (fCLK) | 15.4 MHz |
周期时间 | 25 ns |
JESD-30 代码 | R-PDIP-T28 |
JESD-609代码 | e0 |
长度 | 34.544 mm |
内存密度 | 4096 bit |
内存集成电路类型 | OTHER FIFO |
内存宽度 | 16 |
功能数量 | 1 |
端子数量 | 28 |
字数 | 256 words |
字数代码 | 256 |
工作模式 | SYNCHRONOUS |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
组织 | 256X16 |
输出特性 | 3-STATE |
可输出 | NO |
封装主体材料 | PLASTIC/EPOXY |
封装代码 | DIP |
封装等效代码 | DIP28,.3 |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
并行/串行 | SERIAL |
电源 | 5 V |
认证状态 | Not Qualified |
座面最大高度 | 4.57 mm |
最大待机电流 | 0.006 A |
最大压摆率 | 0.1 mA |
最大供电电压 (Vsup) | 5.5 V |
最小供电电压 (Vsup) | 4.5 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
宽度 | 7.62 mm |
Base Number Matches | 1 |
IDT72105L50TP | IDT72125L25TP | IDT72115L50TP | IDT72115L25SO | IDT72115L25TP | IDT72105L25SO | |
---|---|---|---|---|---|---|
描述 | FIFO, 256X16, 50ns, Synchronous, CMOS, PDIP28, 0.300 INCH, THIN, PLASTIC, DIP-28 | FIFO, 1KX16, 25ns, Synchronous, CMOS, PDIP28, 0.300 INCH, THIN, PLASTIC, DIP-28 | FIFO, 512X16, 50ns, Synchronous, CMOS, PDIP28, 0.300 INCH, THIN, PLASTIC, DIP-28 | FIFO, 512X16, 25ns, Synchronous, CMOS, PDSO28, SOIC-28 | FIFO, 512X16, 25ns, Synchronous, CMOS, PDIP28, 0.300 INCH, THIN, PLASTIC, DIP-28 | FIFO, 256X16, 25ns, Synchronous, CMOS, PDSO28, SOIC-28 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
零件包装代码 | DIP | DIP | DIP | SOIC | DIP | SOIC |
包装说明 | 0.300 INCH, THIN, PLASTIC, DIP-28 | 0.300 INCH, THIN, PLASTIC, DIP-28 | 0.300 INCH, THIN, PLASTIC, DIP-28 | SOIC-28 | 0.300 INCH, THIN, PLASTIC, DIP-28 | SOIC-28 |
针数 | 28 | 28 | 28 | 28 | 28 | 28 |
Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
最长访问时间 | 50 ns | 25 ns | 50 ns | 25 ns | 25 ns | 25 ns |
其他特性 | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL | PORTA/PORTB:PARALLEL/SERIAL |
最大时钟频率 (fCLK) | 15.4 MHz | 28.6 MHz | 15.4 MHz | 28.6 MHz | 28.6 MHz | 28.6 MHz |
周期时间 | 25 ns | 20 ns | 25 ns | 20 ns | 20 ns | 20 ns |
JESD-30 代码 | R-PDIP-T28 | R-PDIP-T28 | R-PDIP-T28 | R-PDSO-G28 | R-PDIP-T28 | R-PDSO-G28 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 |
长度 | 34.544 mm | 34.544 mm | 34.544 mm | 18.3642 mm | 34.544 mm | 18.3642 mm |
内存密度 | 4096 bit | 16384 bit | 8192 bit | 8192 bit | 8192 bit | 4096 bit |
内存集成电路类型 | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO | OTHER FIFO |
内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 28 | 28 | 28 | 28 | 28 | 28 |
字数 | 256 words | 1024 words | 512 words | 512 words | 512 words | 256 words |
字数代码 | 256 | 1000 | 512 | 512 | 512 | 256 |
工作模式 | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS |
最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
组织 | 256X16 | 1KX16 | 512X16 | 512X16 | 512X16 | 256X16 |
输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
可输出 | NO | NO | NO | NO | NO | NO |
封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
封装代码 | DIP | DIP | DIP | SOP | DIP | SOP |
封装等效代码 | DIP28,.3 | DIP28,.3 | DIP28,.3 | SOP28,.5 | DIP28,.3 | SOP28,.5 |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | SMALL OUTLINE | IN-LINE | SMALL OUTLINE |
并行/串行 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
座面最大高度 | 4.57 mm | 4.57 mm | 4.57 mm | 3.048 mm | 4.57 mm | 3.048 mm |
最大待机电流 | 0.006 A | 0.006 A | 0.008 A | 0.006 A | 0.006 A | 0.006 A |
最大压摆率 | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA | 0.1 mA |
最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | YES | NO | YES |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
端子面层 | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | GULL WING | THROUGH-HOLE | GULL WING |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 1.27 mm | 2.54 mm | 1.27 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 8.763 mm | 7.62 mm | 8.763 mm |
厂商名称 | - | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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