Flash, 256KX16, 70ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Atmel (Microchip) |
| 零件包装代码 | TSOP1 |
| 包装说明 | 12 X 20 MM, PLASTIC, TSOP1-48 |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 70 ns |
| 备用内存宽度 | 8 |
| 启动块 | BOTTOM |
| JESD-30 代码 | R-PDSO-G48 |
| JESD-609代码 | e3 |
| 长度 | 18.4 mm |
| 内存密度 | 4194304 bit |
| 内存集成电路类型 | FLASH |
| 内存宽度 | 16 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 262144 words |
| 字数代码 | 256000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 70 °C |
| 最低工作温度 | |
| 组织 | 256KX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度（摄氏度） | 260 |
| 编程电压 | 3 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | COMMERCIAL |
| 端子面层 | MATTE TIN |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 40 |
| 类型 | NOR TYPE |
| 宽度 | 12 mm |
| AT49LV4096A-70TL | AT49BV4096A-12TJ | AT49LV4096A-70C5C | AT49LV4096A-70TC | AT49BV4096A-11C1I | AT49LV4096A-70C1C | AT49BV4096A-12TL | AT49LV4096A-70RC | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Flash, 256KX16, 70ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | Flash, 256KX16, 120ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | Flash, 256KX16, 70ns, PBGA48, 6 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, CSBGA-48 | Flash, 256KX16, 70ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | Flash, 256KX16, 110ns, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, 0.75 MM PITCH, CSBGA-48 | Flash, 256KX16, 70ns, PBGA48, 7 X 7 MM, 1.20 MM HEIGHT, 0.75 MM PITCH, CSBGA-48 | Flash, 256KX16, 120ns, PDSO48, 12 X 20 MM, PLASTIC, TSOP1-48 | Flash, 256KX16, 70ns, PDSO44, 0.525 INCH, PLASTIC, SOIC-44 |
| 是否Rohs认证 | 符合 | 符合 | 不符合 | 不符合 | 不符合 | 不符合 | 符合 | 不符合 |
| 零件包装代码 | TSOP1 | TSOP1 | BGA | TSOP1 | BGA | BGA | TSOP1 | SOIC |
| 包装说明 | 12 X 20 MM, PLASTIC, TSOP1-48 | 12 X 20 MM, PLASTIC, TSOP1-48 | 6 X 8 MM, 1.20 MM HEIGHT, 0.80 MM PITCH, CSBGA-48 | TSOP1, TSSOP48,.8,20 | 7 X 7 MM, 1.20 MM HEIGHT, 0.75 MM PITCH, CSBGA-48 | TFBGA, BGA48,6X8,30 | 12 X 20 MM, PLASTIC, TSOP1-48 | 0.525 INCH, PLASTIC, SOIC-44 |
| 针数 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 44 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant | compliant | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 70 ns | 120 ns | 70 ns | 70 ns | 110 ns | 70 ns | 120 ns | 70 ns |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 | 8 | 8 |
| 启动块 | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM | BOTTOM |
| JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PBGA-B48 | R-PDSO-G48 | S-PBGA-B48 | S-PBGA-B48 | R-PDSO-G48 | R-PDSO-G44 |
| JESD-609代码 | e3 | e3 | e0 | e0 | e0 | e0 | e3 | e0 |
| 长度 | 18.4 mm | 18.4 mm | 8 mm | 18.4 mm | 7 mm | 7 mm | 18.4 mm | 28.195 mm |
| 内存密度 | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit | 4194304 bit |
| 内存集成电路类型 | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH | FLASH |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 | 48 | 44 |
| 字数 | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words | 262144 words |
| 字数代码 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 | 256000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 70 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 70 °C | 70 °C |
| 组织 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 | 256KX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | TSOP1 | TFBGA | TSOP1 | TFBGA | TFBGA | TSOP1 | SOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | GRID ARRAY, THIN PROFILE, FINE PITCH | GRID ARRAY, THIN PROFILE, FINE PITCH | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度（摄氏度） | 260 | 260 | NOT SPECIFIED | 240 | 240 | NOT SPECIFIED | 260 | NOT SPECIFIED |
| 编程电压 | 3 V | 2.7 V | 3 V | 3 V | 2.7 V | 3 V | 2.7 V | 3 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 2.67 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V | 3.6 V |
| 最小供电电压 (Vsup) | 3 V | 2.7 V | 3 V | 3 V | 2.7 V | 3 V | 2.7 V | 3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3 V | 3.3 V | 3.3 V | 3 V | 3.3 V | 3 V | 3.3 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | COMMERCIAL |
| 端子面层 | MATTE TIN | MATTE TIN | Tin/Lead (Sn/Pb) | Tin/Lead (Sn/Pb) | TIN LEAD | Tin/Lead (Sn/Pb) | MATTE TIN | Tin/Lead (Sn/Pb) |
| 端子形式 | GULL WING | GULL WING | BALL | GULL WING | BALL | BALL | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.8 mm | 0.5 mm | 0.75 mm | 0.75 mm | 0.5 mm | 1.27 mm |
| 端子位置 | DUAL | DUAL | BOTTOM | DUAL | BOTTOM | BOTTOM | DUAL | DUAL |
| 处于峰值回流温度下的最长时间 | 40 | 40 | NOT SPECIFIED | 30 | 30 | NOT SPECIFIED | 40 | NOT SPECIFIED |
| 类型 | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE | NOR TYPE |
| 宽度 | 12 mm | 12 mm | 6 mm | 12 mm | 7 mm | 7 mm | 12 mm | 13.34 mm |
| 厂商名称 | Atmel (Microchip) | - | - | - | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) | Atmel (Microchip) |
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