5-CHANNEL POWER SUPPLY SUPPORT CKT, CDIP14, CERAMIC, DIP-14
参数名称 | 属性值 |
是否无铅 | 含铅 |
是否Rohs认证 | 不符合 |
厂商名称 | Rochester Electronics |
零件包装代码 | DIP |
包装说明 | CERAMIC, DIP-14 |
针数 | 14 |
Reach Compliance Code | unknown |
可调阈值 | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-GDIP-T14 |
JESD-609代码 | e0 |
湿度敏感等级 | 1 |
信道数量 | 5 |
功能数量 | 1 |
端子数量 | 14 |
最高工作温度 | 85 °C |
最低工作温度 | -40 °C |
封装主体材料 | CERAMIC, GLASS-SEALED |
封装代码 | DIP |
封装形状 | RECTANGULAR |
封装形式 | IN-LINE |
峰值回流温度(摄氏度) | 245 |
座面最大高度 | 5.08 mm |
最大供电电压 (Vsup) | 11 V |
最小供电电压 (Vsup) | 2.85 V |
标称供电电压 (Vsup) | 5 V |
表面贴装 | NO |
技术 | CMOS |
温度等级 | INDUSTRIAL |
端子面层 | TIN LEAD |
端子形式 | THROUGH-HOLE |
端子节距 | 2.54 mm |
端子位置 | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED |
宽度 | 7.62 mm |
MAX8215EJD | MAX8215CPD | MAX8215EPD | MAX8216CPD | MAX8216EPD | MAX8216EJD | MAX8215MJD | |
---|---|---|---|---|---|---|---|
描述 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, CDIP14, CERAMIC, DIP-14 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, PDIP14, PLASTIC, DIP-14 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, PDIP14, PLASTIC, DIP-14 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, PDIP14, PLASTIC, DIP-14 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, PDIP14, PLASTIC, DIP-14 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, CDIP14, CERAMIC, DIP-14 | 5-CHANNEL POWER SUPPLY SUPPORT CKT, CDIP14, CERAMIC, DIP-14 |
是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
厂商名称 | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics | Rochester Electronics |
零件包装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
包装说明 | CERAMIC, DIP-14 | DIP, | DIP, | DIP, | DIP, | CERAMIC, DIP-14 | CERAMIC, DIP-14 |
针数 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
可调阈值 | NO | NO | NO | NO | NO | NO | NO |
模拟集成电路 - 其他类型 | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT | POWER SUPPLY SUPPORT CIRCUIT |
JESD-30 代码 | R-GDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-PDIP-T14 | R-GDIP-T14 | R-GDIP-T14 |
JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
湿度敏感等级 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
信道数量 | 5 | 5 | 5 | 5 | 5 | 5 | 5 |
功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
端子数量 | 14 | 14 | 14 | 14 | 14 | 14 | 14 |
最高工作温度 | 85 °C | 70 °C | 85 °C | 70 °C | 85 °C | 85 °C | 125 °C |
最低工作温度 | -40 °C | - | -40 °C | - | -40 °C | -40 °C | -55 °C |
封装主体材料 | CERAMIC, GLASS-SEALED | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | CERAMIC, GLASS-SEALED | CERAMIC, GLASS-SEALED |
封装代码 | DIP | DIP | DIP | DIP | DIP | DIP | DIP |
封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
封装形式 | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE | IN-LINE |
峰值回流温度(摄氏度) | 245 | 245 | 245 | 245 | 245 | 245 | 245 |
座面最大高度 | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm | 5.08 mm |
最大供电电压 (Vsup) | 11 V | 11 V | 11 V | 11 V | 11 V | 11 V | 11 V |
最小供电电压 (Vsup) | 2.85 V | 2.7 V | 2.85 V | 2.7 V | 2.85 V | 2.85 V | 2.85 V |
标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
表面贴装 | NO | NO | NO | NO | NO | NO | NO |
技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | MILITARY |
端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD |
端子形式 | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE | THROUGH-HOLE |
端子节距 | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm | 2.54 mm |
端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
处于峰值回流温度下的最长时间 | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED | NOT SPECIFIED |
宽度 | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm | 7.62 mm |
长度 | - | 19.05 mm | 19.05 mm | 19.05 mm | 19.05 mm | - | - |
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