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IDT7014S25PF: 产品描述Dual-Port SRAM, 4KX9, 25ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64; 产品类别存储存储; 文件大小76KB，共9页; 制造商IDT (Integrated Device Technology)

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IDT7014S25PF概述

Dual-Port SRAM, 4KX9, 25ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64

IDT7014S25PF规格参数

参数名称	属性值
是否无铅	含铅
是否Rohs认证	不符合
厂商名称	IDT (Integrated Device Technology)
零件包装代码	QFP
包装说明	14 X 14 MM, 1.40 MM HEIGHT, TQFP-64
针数	64
Reach Compliance Code	not_compliant
ECCN代码	EAR99
最长访问时间	25 ns
I/O 类型	COMMON
JESD-30 代码	S-PQFP-G64
JESD-609代码	e0
长度	14 mm
内存密度	36864 bit
内存集成电路类型	DUAL-PORT SRAM
内存宽度	9
湿度敏感等级	3
功能数量	1
端口数量	2
端子数量	64
字数	4096 words
字数代码	4000
工作模式	SYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	4KX9
输出特性	3-STATE
可输出	YES
封装主体材料	PLASTIC/EPOXY
封装代码	LQFP
封装等效代码	QFP64,.66SQ,32
封装形状	SQUARE
封装形式	FLATPACK, LOW PROFILE
并行/串行	PARALLEL
峰值回流温度（摄氏度）	240
电源	5 V
认证状态	Not Qualified
座面最大高度	1.6 mm
最大压摆率	0.24 mA
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	YES
技术	CMOS
温度等级	COMMERCIAL
端子面层	Tin/Lead (Sn85Pb15)
端子形式	GULL WING
端子节距	0.8 mm
端子位置	QUAD
处于峰值回流温度下的最长时间	20
宽度	14 mm

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HIGH-SPEED

4K x 9DUAL-PORT

STATIC RAM

Features:

IDT7014S

Description:

The IDT7014 is a high-speed 4K x 9 Dual-Port Static RAM designed

to be used in systems where on-chip hardware port arbitration is not

needed. This part lends itself to high-speed applications which do not rely

on BUSY signals to manage simultaneous access.

The IDT7014 provides two independent ports with separate control,

address, and I/O pins that permit independent, asynchronous access for

reads or writes to any location in memory. See functional description.

The IDT7014 utilitizes a 9-bit wide data path to allow for parity at the

user's option. This feature is especially useful in data communication

applications where it is necessary to use a parity bit for transmission/

reception error checking.

Fabricated using IDT’s high-performance technology, these Dual-

Ports typically operate on only 750mW of power at maximum access times

as fast as 12ns.

The IDT7014 is packaged in a 52-pin PLCC and a 64-pin thin quad

flatpack, (TQFP).

True Dual-Ported memory cells which allow simultaneous

reads of the same memory location

High-speed access

– Commercial: 12/15/20/25ns (max.)

– Industrial: 15/20/25ns (max.)

Standard-power operation

– IDT7014S

Active: 750mW (typ.)

Fully asynchronous operation from either port

TTL-compatible; single 5V (±10%) power supply

Available in 52-pin PLCC and a 64-pin TQFP

Industrial temperature range (–40°C to +85°C) is available

for selected speeds

Functional Block Diagram

I/O

- I/O

I/O

CONTROL

I/O

CONTROL

I/O

- I/O

- A

11L

ADDRESS

DECODER

MEMORY

ARRAY

ADDRESS

DECODER

- A

11R

2528 drw 01

MARCH 2000

DSC 2528/13

IDT7014S25PF相似产品对比

	IDT7014S25PF	IDT7014S25J	IDT7014S25JI	IDT7014S25PFI	IDT7014S20J	IDT7014S15PFI	IDT7014S15J	IDT7014S15JI
描述	Dual-Port SRAM, 4KX9, 25ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64	Dual-Port SRAM, 4KX9, 25ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 4KX9, 25ns, PQCC52, PLASTIC, LCC-52	Dual-Port SRAM, 4KX9, 25ns, PQFP64, TQFP-64	Dual-Port SRAM, 4KX9, 20ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 4KX9, 15ns, PQFP64, TQFP-64	Dual-Port SRAM, 4KX9, 15ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	Dual-Port SRAM, 4KX9, 15ns, PQCC52, PLASTIC, LCC-52
是否无铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅	含铅
是否Rohs认证	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
零件包装代码	QFP	LCC	LCC	QFP	LCC	QFP	LCC	LCC
包装说明	14 X 14 MM, 1.40 MM HEIGHT, TQFP-64	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	QCCJ, LDCC52,.8SQ	LQFP, QFP64,.66SQ,32	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	LQFP, QFP64,.66SQ,32	0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52	QCCJ, LDCC52,.8SQ
针数	64	52	52	64	52	64	52	52
Reach Compliance Code	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant
ECCN代码	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99	EAR99
最长访问时间	25 ns	25 ns	25 ns	25 ns	20 ns	15 ns	15 ns	15 ns
I/O 类型	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON	COMMON
JESD-30 代码	S-PQFP-G64	S-PQCC-J52	S-PQCC-J52	S-PQFP-G64	S-PQCC-J52	S-PQFP-G64	S-PQCC-J52	S-PQCC-J52
JESD-609代码	e0	e0	e0	e0	e0	e0	e0	e0
长度	14 mm	19.1262 mm	19.1262 mm	14 mm	19.1262 mm	14 mm	19.1262 mm	19.1262 mm
内存密度	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit	36864 bit
内存集成电路类型	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM	DUAL-PORT SRAM
内存宽度	9	9	9	9	9	9	9	9
湿度敏感等级	3	3	1	3	3	3	3	1
功能数量	1	1	1	1	1	1	1	1
端口数量	2	2	2	2	2	2	2	2
端子数量	64	52	52	64	52	64	52	52
字数	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words	4096 words
字数代码	4000	4000	4000	4000	4000	4000	4000	4000
工作模式	SYNCHRONOUS	SYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	SYNCHRONOUS	ASYNCHRONOUS	SYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	85 °C	85 °C	70 °C	85 °C	70 °C	85 °C
组织	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9	4KX9
输出特性	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE
封装主体材料	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY	PLASTIC/EPOXY
封装代码	LQFP	QCCJ	QCCJ	LQFP	QCCJ	LQFP	QCCJ	QCCJ
封装等效代码	QFP64,.66SQ,32	LDCC52,.8SQ	LDCC52,.8SQ	QFP64,.66SQ,32	LDCC52,.8SQ	QFP64,.66SQ,32	LDCC52,.8SQ	LDCC52,.8SQ
封装形状	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE	SQUARE
封装形式	FLATPACK, LOW PROFILE	CHIP CARRIER	CHIP CARRIER	FLATPACK, LOW PROFILE	CHIP CARRIER	FLATPACK, LOW PROFILE	CHIP CARRIER	CHIP CARRIER
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
峰值回流温度（摄氏度）	240	225	225	240	225	240	225	225
电源	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
座面最大高度	1.6 mm	4.572 mm	4.57 mm	1.6 mm	4.572 mm	1.6 mm	4.572 mm	4.57 mm
最大压摆率	0.24 mA	0.24 mA	0.255 mA	0.255 mA	0.245 mA	0.26 mA	0.25 mA	0.26 mA
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	YES	YES	YES	YES	YES	YES	YES	YES
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	INDUSTRIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL	COMMERCIAL	INDUSTRIAL
端子面层	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)	TIN LEAD	Tin/Lead (Sn85Pb15)	TIN LEAD	Tin/Lead (Sn85Pb15)	Tin/Lead (Sn85Pb15)
端子形式	GULL WING	J BEND	J BEND	GULL WING	J BEND	GULL WING	J BEND	J BEND
端子节距	0.8 mm	1.27 mm	1.27 mm	0.8 mm	1.27 mm	0.8 mm	1.27 mm	1.27 mm
端子位置	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD	QUAD
处于峰值回流温度下的最长时间	20	30	30	20	30	20	30	30
宽度	14 mm	19.1262 mm	19.1262 mm	14 mm	19.1262 mm	14 mm	19.1262 mm	19.1262 mm
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	-	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)

IDT7014S25PF

IDT7014S25PF概述

IDT7014S25PF规格参数

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IDT7014S25PF相似产品对比

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