Dual-Port SRAM, 4KX9, 15ns, PQFP64, TQFP-64
| 参数名称 | 属性值 |
| 是否无铅 | 含铅 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | IDT (Integrated Device Technology) |
| 零件包装代码 | QFP |
| 包装说明 | LQFP, QFP64,.66SQ,32 |
| 针数 | 64 |
| Reach Compliance Code | not_compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 15 ns |
| I/O 类型 | COMMON |
| JESD-30 代码 | S-PQFP-G64 |
| JESD-609代码 | e0 |
| 长度 | 14 mm |
| 内存密度 | 36864 bit |
| 内存集成电路类型 | DUAL-PORT SRAM |
| 内存宽度 | 9 |
| 湿度敏感等级 | 3 |
| 功能数量 | 1 |
| 端口数量 | 2 |
| 端子数量 | 64 |
| 字数 | 4096 words |
| 字数代码 | 4000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 组织 | 4KX9 |
| 输出特性 | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | LQFP |
| 封装等效代码 | QFP64,.66SQ,32 |
| 封装形状 | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL |
| 峰值回流温度(摄氏度) | 240 |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.6 mm |
| 最大压摆率 | 0.26 mA |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | GULL WING |
| 端子节距 | 0.8 mm |
| 端子位置 | QUAD |
| 处于峰值回流温度下的最长时间 | 20 |
| 宽度 | 14 mm |

| IDT7014S15PFI | IDT7014S25J | IDT7014S25JI | IDT7014S25PFI | IDT7014S20J | IDT7014S15J | IDT7014S15JI | IDT7014S25PF | |
|---|---|---|---|---|---|---|---|---|
| 描述 | Dual-Port SRAM, 4KX9, 15ns, PQFP64, TQFP-64 | Dual-Port SRAM, 4KX9, 25ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 | Dual-Port SRAM, 4KX9, 25ns, PQCC52, PLASTIC, LCC-52 | Dual-Port SRAM, 4KX9, 25ns, PQFP64, TQFP-64 | Dual-Port SRAM, 4KX9, 20ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 | Dual-Port SRAM, 4KX9, 15ns, CMOS, PQCC52, 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 | Dual-Port SRAM, 4KX9, 15ns, PQCC52, PLASTIC, LCC-52 | Dual-Port SRAM, 4KX9, 25ns, CMOS, PQFP64, 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 |
| 是否无铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 | 含铅 |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 | 不符合 |
| 零件包装代码 | QFP | LCC | LCC | QFP | LCC | LCC | LCC | QFP |
| 包装说明 | LQFP, QFP64,.66SQ,32 | 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 | QCCJ, LDCC52,.8SQ | LQFP, QFP64,.66SQ,32 | 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 | 0.750 X 0.750 INCH, 0.170 INCH HEIGHT, PLASTIC, LCC-52 | QCCJ, LDCC52,.8SQ | 14 X 14 MM, 1.40 MM HEIGHT, TQFP-64 |
| 针数 | 64 | 52 | 52 | 64 | 52 | 52 | 52 | 64 |
| Reach Compliance Code | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant | not_compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 15 ns | 25 ns | 25 ns | 25 ns | 20 ns | 15 ns | 15 ns | 25 ns |
| I/O 类型 | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON | COMMON |
| JESD-30 代码 | S-PQFP-G64 | S-PQCC-J52 | S-PQCC-J52 | S-PQFP-G64 | S-PQCC-J52 | S-PQCC-J52 | S-PQCC-J52 | S-PQFP-G64 |
| JESD-609代码 | e0 | e0 | e0 | e0 | e0 | e0 | e0 | e0 |
| 长度 | 14 mm | 19.1262 mm | 19.1262 mm | 14 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 14 mm |
| 内存密度 | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bit | 36864 bit |
| 内存集成电路类型 | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM | DUAL-PORT SRAM |
| 内存宽度 | 9 | 9 | 9 | 9 | 9 | 9 | 9 | 9 |
| 湿度敏感等级 | 3 | 3 | 1 | 3 | 3 | 3 | 1 | 3 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端口数量 | 2 | 2 | 2 | 2 | 2 | 2 | 2 | 2 |
| 端子数量 | 64 | 52 | 52 | 64 | 52 | 52 | 52 | 64 |
| 字数 | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words | 4096 words |
| 字数代码 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 | 4000 |
| 工作模式 | ASYNCHRONOUS | SYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | SYNCHRONOUS | SYNCHRONOUS | ASYNCHRONOUS | SYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 85 °C | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C |
| 组织 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 | 4KX9 |
| 输出特性 | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE | 3-STATE |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | LQFP | QCCJ | QCCJ | LQFP | QCCJ | QCCJ | QCCJ | LQFP |
| 封装等效代码 | QFP64,.66SQ,32 | LDCC52,.8SQ | LDCC52,.8SQ | QFP64,.66SQ,32 | LDCC52,.8SQ | LDCC52,.8SQ | LDCC52,.8SQ | QFP64,.66SQ,32 |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | FLATPACK, LOW PROFILE | CHIP CARRIER | CHIP CARRIER | FLATPACK, LOW PROFILE | CHIP CARRIER | CHIP CARRIER | CHIP CARRIER | FLATPACK, LOW PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 峰值回流温度(摄氏度) | 240 | 225 | 225 | 240 | 225 | 225 | 225 | 240 |
| 电源 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.6 mm | 4.572 mm | 4.57 mm | 1.6 mm | 4.572 mm | 4.572 mm | 4.57 mm | 1.6 mm |
| 最大压摆率 | 0.26 mA | 0.24 mA | 0.255 mA | 0.255 mA | 0.245 mA | 0.25 mA | 0.26 mA | 0.24 mA |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V | 4.5 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | INDUSTRIAL | COMMERCIAL | INDUSTRIAL | INDUSTRIAL | COMMERCIAL | COMMERCIAL | INDUSTRIAL | COMMERCIAL |
| 端子面层 | TIN LEAD | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | TIN LEAD | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) | Tin/Lead (Sn85Pb15) |
| 端子形式 | GULL WING | J BEND | J BEND | GULL WING | J BEND | J BEND | J BEND | GULL WING |
| 端子节距 | 0.8 mm | 1.27 mm | 1.27 mm | 0.8 mm | 1.27 mm | 1.27 mm | 1.27 mm | 0.8 mm |
| 端子位置 | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD | QUAD |
| 处于峰值回流温度下的最长时间 | 20 | 30 | 30 | 20 | 30 | 30 | 30 | 20 |
| 宽度 | 14 mm | 19.1262 mm | 19.1262 mm | 14 mm | 19.1262 mm | 19.1262 mm | 19.1262 mm | 14 mm |
| 厂商名称 | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | - | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) | IDT (Integrated Device Technology) |
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