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MT48LC2M32B2P-5

产品描述Synchronous DRAM, 2MX32, 4.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-86
产品类别存储    存储   
文件大小2MB,共69页
制造商Micron Technology
官网地址http://www.mdtic.com.tw/
标准
下载文档 详细参数 选型对比 全文预览

MT48LC2M32B2P-5概述

Synchronous DRAM, 2MX32, 4.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-86

MT48LC2M32B2P-5规格参数

参数名称属性值
是否Rohs认证符合
厂商名称Micron Technology
零件包装代码TSOP
包装说明TSOP2, TSSOP86,.46,20
针数86
Reach Compliance Codecompliant
ECCN代码EAR99
访问模式FOUR BANK PAGE BURST
最长访问时间4.5 ns
其他特性AUTO/SELF REFRESH
最大时钟频率 (fCLK)200 MHz
I/O 类型COMMON
交错的突发长度1,2,4,8
JESD-30 代码R-PDSO-G86
JESD-609代码e3
长度22.22 mm
内存密度67108864 bit
内存集成电路类型SYNCHRONOUS DRAM
内存宽度32
功能数量1
端口数量1
端子数量86
字数2097152 words
字数代码2000000
工作模式SYNCHRONOUS
最高工作温度70 °C
最低工作温度
组织2MX32
输出特性3-STATE
封装主体材料PLASTIC/EPOXY
封装代码TSOP2
封装等效代码TSSOP86,.46,20
封装形状RECTANGULAR
封装形式SMALL OUTLINE, THIN PROFILE
峰值回流温度(摄氏度)260
电源3.3 V
认证状态Not Qualified
刷新周期4096
座面最大高度1.2 mm
自我刷新YES
连续突发长度1,2,4,8,FP
最大待机电流0.002 A
最大压摆率0.28 mA
最大供电电压 (Vsup)3.6 V
最小供电电压 (Vsup)3 V
标称供电电压 (Vsup)3.3 V
表面贴装YES
技术CMOS
温度等级COMMERCIAL
端子面层Matte Tin (Sn)
端子形式GULL WING
端子节距0.5 mm
端子位置DUAL
处于峰值回流温度下的最长时间30
宽度10.16 mm

文档预览

下载PDF文档
64Mb: x32 SDRAM
Features
Synchronous DRAM
MT48LC2M32B2 – 512K x 32 x 4 banks
For the latest data sheet, refer to Micron’s Web site
Features
• PC100 functionality
• Fully synchronous; all signals registered on positive
edge of system clock
• Internal pipelined operation; column address can be
changed every clock cycle
• Internal banks for hiding row access/precharge
• Programmable burst lengths: 1, 2, 4, 8, or full page
• Auto precharge, includes concurrent auto precharge,
and auto refresh modes
• Self refresh mode (not available on AT devices)
• Refresh
64ms, 4,096-cycle refresh (15.6µs/row)
(commercial, industrial)
16ms, 4,096-cycle refresh (3.9µs/row)
(automotive)
• LVTTL-compatible inputs and outputs
• Single +3.3V ±0.3V power supply
• Supports CAS latency (CL) of 1, 2, and 3
Table 1:
Address Table
2 Meg x 32
Configuration
Refresh count
Row addressing
Bank addressing
Column addressing
512K x 32 x 4 banks
4K
2K (A0–A10)
4 (BA0, BA1)
256 (A0–A7)
Table 2:
Key Timing Parameters
CL = CAS (READ) latency
Access
Time
CL = 3
4.5ns
5ns
5.5ns
5.5ns
Speed
Grade
-5
-55
-6
-7
Clock
Frequency
200 MHz
183 MHz
166 MHz
143 MHz
Setup
Time
1.5ns
1.5ns
1.5ns
2ns
Hold
Time
1ns
1ns
1ns
1ns
Options
Marking
Table 3:
64Mb (x32) SDRAM Part Number
Architecture
2 Meg x 32
2 Meg x 32
2 Meg x 32
Part Number
MT48LC2M32B2TG
MT48LC2M32B2P
MT48LC2M32B2B5
1
• Configuration
2 Meg x 32 (512K x 32 x 4 banks)
2M32B2
1
• Plastic package – OCPL
86-pin TSOP II (400 mil)
TG
86-pin TSOP II (400 mil) Pb-free
P
90-ball VFBGA (8mm x 13mm) Pb-free
B5
• Timing (cycle time)
5ns (200 MHz)
-5
5.5ns (183 MHz)
-55
6ns (166 MHz)
-6
7ns (143 MHz)
-7
• Die revision
:G
• Operating temperature range
Commercial (0° to +70°C)
None
Industrial (–40°C to +85°C)
IT
2
Automotive (–40°C to +105°C)
AT
3
Notes: 1. Off-center parting line.
2. Available on -6 and -7.
3. Contact Micron for product availability.
Notes: 1. FBGA Device Decode: http://
www.micron.com/support/FBGA/FBGA.asp
Part Number Example:
MT48LC2M32B2P-7:G
PDF: 09005aef811ce1fe/Source: 09005aef811ce1d5
64MSDRAMx32_1.fm - Rev. J 12/08 EN
1
Micron Technology, Inc., reserves the right to change products or specifications without notice.
©2001 Micron Technology, Inc. All rights reserved.
Products and specifications discussed herein are subject to change by Micron without notice.

MT48LC2M32B2P-5相似产品对比

MT48LC2M32B2P-5 MT48LC2M32B2B5-6 MT48LC2M32B2P-7 MT48LC2M32B2P-6 MT48LC2M32B2P-55 MT48LC2M32B2TG-6
描述 Synchronous DRAM, 2MX32, 4.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-86 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PBGA90 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-86 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-86 Synchronous DRAM, 2MX32, 5ns, CMOS, PDSO86, 0.400 INCH, LEAD FREE, PLASTIC, TSOP-86 Synchronous DRAM, 2MX32, 5.5ns, CMOS, PDSO86, 0.400 INCH, PLASTIC, TSOP-86
是否Rohs认证 符合 符合 符合 符合 符合 不符合
包装说明 TSOP2, TSSOP86,.46,20 FBGA, BGA90,9X15,32 TSOP2, TSSOP86,.46,20 TSOP2, TSSOP86,.46,20 TSOP2, TSSOP86,.46,20 0.400 INCH, PLASTIC, TSOP-86
Reach Compliance Code compliant compliant compliant unknown compliant not_compliant
最长访问时间 4.5 ns 5.5 ns 5.5 ns 5.5 ns 5 ns 5.5 ns
最大时钟频率 (fCLK) 200 MHz 166 MHz 143 MHz 166 MHz 182 MHz 166 MHz
I/O 类型 COMMON COMMON COMMON COMMON COMMON COMMON
交错的突发长度 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8 1,2,4,8
JESD-30 代码 R-PDSO-G86 R-PBGA-B90 R-PDSO-G86 R-PDSO-G86 R-PDSO-G86 R-PDSO-G86
内存密度 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit 67108864 bit
内存集成电路类型 SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM SYNCHRONOUS DRAM
内存宽度 32 32 32 32 32 32
端子数量 86 90 86 86 86 86
字数 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words 2097152 words
字数代码 2000000 2000000 2000000 2000000 2000000 2000000
最高工作温度 70 °C 70 °C 70 °C 70 °C 70 °C 70 °C
组织 2MX32 2MX32 2MX32 2MX32 2MX32 2MX32
输出特性 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE 3-STATE
封装主体材料 PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY PLASTIC/EPOXY
封装代码 TSOP2 FBGA TSOP2 TSOP2 TSOP2 TSOP2
封装等效代码 TSSOP86,.46,20 BGA90,9X15,32 TSSOP86,.46,20 TSSOP86,.46,20 TSSOP86,.46,20 TSSOP86,.46,20
封装形状 RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR RECTANGULAR
封装形式 SMALL OUTLINE, THIN PROFILE GRID ARRAY, FINE PITCH SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE SMALL OUTLINE, THIN PROFILE
电源 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
认证状态 Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified Not Qualified
刷新周期 4096 4096 4096 4096 4096 4096
连续突发长度 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP 1,2,4,8,FP
最大待机电流 0.002 A 0.002 A 0.002 A 0.002 A 0.002 A 0.002 A
最大压摆率 0.28 mA 0.225 mA 0.225 mA 0.225 mA 0.26 mA 0.225 mA
标称供电电压 (Vsup) 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V 3.3 V
表面贴装 YES YES YES YES YES YES
技术 CMOS CMOS CMOS CMOS CMOS CMOS
温度等级 COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL COMMERCIAL
端子形式 GULL WING BALL GULL WING GULL WING GULL WING GULL WING
端子节距 0.5 mm 0.8 mm 0.5 mm 0.5 mm 0.5 mm 0.5 mm
端子位置 DUAL BOTTOM DUAL DUAL DUAL DUAL
厂商名称 Micron Technology - Micron Technology Micron Technology Micron Technology Micron Technology
零件包装代码 TSOP - TSOP TSOP TSOP TSOP
针数 86 - 86 86 86 86
ECCN代码 EAR99 - EAR99 EAR99 EAR99 EAR99
访问模式 FOUR BANK PAGE BURST - FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST FOUR BANK PAGE BURST
其他特性 AUTO/SELF REFRESH - AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-609代码 e3 - e3 e3 e3 e0
长度 22.22 mm - 22.22 mm 22.22 mm 22.22 mm 22.22 mm
功能数量 1 - 1 1 1 1
端口数量 1 - 1 1 1 1
工作模式 SYNCHRONOUS - SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS SYNCHRONOUS
峰值回流温度(摄氏度) 260 - 260 260 260 235
座面最大高度 1.2 mm - 1.2 mm 1.2 mm 1.2 mm 1.2 mm
自我刷新 YES - YES YES YES YES
最大供电电压 (Vsup) 3.6 V - 3.6 V 3.6 V 3.6 V 3.6 V
最小供电电压 (Vsup) 3 V - 3 V 3 V 3 V 3 V
端子面层 Matte Tin (Sn) - Matte Tin (Sn) Matte Tin (Sn) Matte Tin (Sn) Tin/Lead (Sn/Pb)
处于峰值回流温度下的最长时间 30 - 30 30 30 30
宽度 10.16 mm - 10.16 mm 10.16 mm 10.16 mm 10.16 mm

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