|
OPA1S2384IDRCT |
OPA1S2384IDRCR |
OPA1S2385IDRCR |
OPA1S2385IDRCT |
描述 |
250-MHz, CMOS Transimpedance Amplifier (TIA) with Integrated Switch and Buffer 10-VSON -40 to 85 |
250-MHz, CMOS Transimpedance Amplifier (TIA) with Integrated Switch and Buffer 10-VSON -40 to 85 |
250-MHz, CMOS Transimpedance Amplifier (TIA) with Integrated Switch and Buffer 10-VSON -40 to 85 |
250-MHz, CMOS Transimpedance Amplifier (TIA) with Integrated Switch and Buffer 10-VSON -40 to 85 |
Brand Name |
Texas Instruments |
Texas Instruments |
Texas Instruments |
Texas Instruments |
是否无铅 |
不含铅 |
不含铅 |
不含铅 |
不含铅 |
是否Rohs认证 |
符合 |
符合 |
符合 |
符合 |
零件包装代码 |
SON |
SON |
SON |
SON |
包装说明 |
HVSON, |
SON-10 |
SON-10 |
VSON, SOLCC10,.11,20 |
针数 |
10 |
10 |
10 |
10 |
Reach Compliance Code |
compli |
compliant |
compliant |
compli |
ECCN代码 |
EAR99 |
EAR99 |
EAR99 |
EAR99 |
Factory Lead Time |
6 weeks |
12 weeks |
12 weeks |
6 weeks |
放大器类型 |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
OPERATIONAL AMPLIFIER |
架构 |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
VOLTAGE-FEEDBACK |
最大平均偏置电流 (IIB) |
0.00005 µA |
0.00005 µA |
0.00005 µA |
0.00005 µA |
25C 时的最大偏置电流 (IIB) |
0.00005 µA |
0.00005 µA |
0.00005 µA |
0.00005 µA |
最小共模抑制比 |
50 dB |
50 dB |
50 dB |
50 dB |
标称共模抑制比 |
68 dB |
68 dB |
68 dB |
68 dB |
频率补偿 |
YES |
YES |
YES |
YES |
最大输入失调电流 (IIO) |
0.00005 µA |
0.00005 µA |
0.00005 µA |
0.00005 µA |
最大输入失调电压 |
8000 µV |
8000 µV |
8000 µV |
8000 µV |
JESD-30 代码 |
S-PDSO-N10 |
S-PDSO-N10 |
S-PDSO-N10 |
S-PDSO-N10 |
JESD-609代码 |
e4 |
e4 |
e4 |
e4 |
长度 |
3 mm |
3 mm |
3 mm |
3 mm |
低-偏置 |
YES |
YES |
YES |
YES |
低-失调 |
NO |
NO |
NO |
NO |
微功率 |
NO |
NO |
NO |
NO |
湿度敏感等级 |
2 |
2 |
2 |
2 |
功能数量 |
2 |
2 |
2 |
2 |
端子数量 |
10 |
10 |
10 |
10 |
最高工作温度 |
85 °C |
85 °C |
85 °C |
85 °C |
最低工作温度 |
-40 °C |
-40 °C |
-40 °C |
-40 °C |
封装主体材料 |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
PLASTIC/EPOXY |
封装代码 |
HVSON |
HVSON |
HVSON |
VSON |
封装形状 |
SQUARE |
SQUARE |
SQUARE |
SQUARE |
封装形式 |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, HEAT SINK/SLUG, VERY THIN PROFILE |
SMALL OUTLINE, VERY THIN PROFILE |
包装方法 |
TR |
TR |
TR |
TR |
峰值回流温度(摄氏度) |
260 |
260 |
260 |
260 |
功率 |
NO |
NO |
NO |
NO |
可编程功率 |
NO |
NO |
NO |
NO |
座面最大高度 |
1 mm |
1 mm |
1 mm |
1 mm |
标称压摆率 |
110 V/us |
110 V/us |
110 V/us |
110 V/us |
最大压摆率 |
24 mA |
24 mA |
24 mA |
24 mA |
供电电压上限 |
6 V |
6 V |
6 V |
6 V |
标称供电电压 (Vsup) |
3.3 V |
3.3 V |
3.3 V |
3.3 V |
表面贴装 |
YES |
YES |
YES |
YES |
技术 |
CMOS |
CMOS |
CMOS |
CMOS |
温度等级 |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
INDUSTRIAL |
端子面层 |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
Nickel/Palladium/Gold (Ni/Pd/Au) |
端子形式 |
NO LEAD |
NO LEAD |
NO LEAD |
NO LEAD |
端子节距 |
0.5 mm |
0.5 mm |
0.5 mm |
0.5 mm |
端子位置 |
DUAL |
DUAL |
DUAL |
DUAL |
处于峰值回流温度下的最长时间 |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
NOT SPECIFIED |
标称均一增益带宽 |
100000 kHz |
100000 kHz |
100000 kHz |
100000 kHz |
最小电压增益 |
15848.931 |
15848.931 |
15848.931 |
15848.931 |
宽带 |
YES |
YES |
YES |
YES |
宽度 |
3 mm |
3 mm |
3 mm |
3 mm |
Base Number Matches |
1 |
1 |
1 |
- |
厂商名称 |
- |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |
Texas Instruments(德州仪器) |