Inverter, AHC/VHC/H/U/V Series, 3-Func, 1-Input, CMOS, PDSO8
| 参数名称 | 属性值 |
| 是否Rohs认证 | 符合 |
| 厂商名称 | Nexperia |
| 包装说明 | VSON, |
| Reach Compliance Code | compliant |
| 系列 | AHC/VHC/H/U/V |
| JESD-30 代码 | R-PDSO-N8 |
| JESD-609代码 | e4 |
| 长度 | 3 mm |
| 逻辑集成电路类型 | INVERTER |
| 湿度敏感等级 | 1 |
| 功能数量 | 3 |
| 输入次数 | 1 |
| 端子数量 | 8 |
| 最高工作温度 | 125 °C |
| 最低工作温度 | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | 260 |
| 传播延迟（tpd） | 13.5 ns |
| 认证状态 | Not Qualified |
| 座面最大高度 | 0.5 mm |
| 最大供电电压 (Vsup) | 5.5 V |
| 最小供电电压 (Vsup) | 2 V |
| 标称供电电压 (Vsup) | 5 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | 30 |
| 宽度 | 2 mm |
| 74AHC3GU04GD | 935288572125 | 935274686125 | 74AHC3GU04DP | 74AHC3GU04DC | |
|---|---|---|---|---|---|
| 描述 | Inverter, AHC/VHC/H/U/V Series, 3-Func, 1-Input, CMOS, PDSO8 | Inverter, AHC/VHC/H/U/V Series, 3-Func, 1-Input, CMOS, PDSO8 | Inverter, AHC/VHC/H/U/V Series, 3-Func, 1-Input, CMOS, PDSO8 | Inverter, AHC/VHC/H/U/V Series, 3-Func, 1-Input, CMOS, PDSO8 | Inverter, AHC/VHC/H/U/V Series, 3-Func, 1-Input, CMOS, PDSO8 |
| 是否Rohs认证 | 符合 | 符合 | 符合 | 符合 | 符合 |
| 厂商名称 | Nexperia | Nexperia | Nexperia | Nexperia | Nexperia |
| 包装说明 | VSON, | VSON, | 3 MM WIDTH, PLASTIC, SOT505-2, TSSOP-8 | 3 MM WIDTH, PLASTIC, SOT505-2, TSSOP-8 | VSSOP, |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant |
| 系列 | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V | AHC/VHC/H/U/V |
| JESD-30 代码 | R-PDSO-N8 | R-PDSO-N8 | S-PDSO-G8 | S-PDSO-G8 | R-PDSO-G8 |
| JESD-609代码 | e4 | e4 | e4 | e4 | e4 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 2.3 mm |
| 逻辑集成电路类型 | INVERTER | INVERTER | INVERTER | INVERTER | INVERTER |
| 湿度敏感等级 | 1 | 1 | 1 | 1 | 1 |
| 功能数量 | 3 | 3 | 3 | 3 | 3 |
| 输入次数 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 8 | 8 | 8 | 8 | 8 |
| 最高工作温度 | 125 °C | 125 °C | 125 °C | 125 °C | 125 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | VSON | VSON | TSSOP | TSSOP | VSSOP |
| 封装形状 | RECTANGULAR | RECTANGULAR | SQUARE | SQUARE | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE, SHRINK PITCH |
| 传播延迟（tpd） | 13.5 ns | 13.5 ns | 13.5 ns | 13.5 ns | 13.5 ns |
| 座面最大高度 | 0.5 mm | 0.5 mm | 1.1 mm | 1.1 mm | 1 mm |
| 最大供电电压 (Vsup) | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V |
| 最小供电电压 (Vsup) | 2 V | 2 V | 2 V | 2 V | 2 V |
| 标称供电电压 (Vsup) | 5 V | 5 V | 5 V | 5 V | 5 V |
| 表面贴装 | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE | AUTOMOTIVE |
| 端子面层 | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold (Ni/Pd/Au) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag) | Nickel/Palladium/Gold (Ni/Pd/Au) |
| 端子形式 | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.65 mm | 0.65 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 2 mm | 2 mm | 3 mm | 3 mm | 2 mm |
| 峰值回流温度（摄氏度） | 260 | - | - | 260 | 260 |
| 认证状态 | Not Qualified | - | - | Not Qualified | Not Qualified |
| 处于峰值回流温度下的最长时间 | 30 | - | - | 30 | 30 |
| Base Number Matches | - | 1 | 1 | 1 | 1 |
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