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IDT7MP4036S13M: 产品描述SRAM Module, 64KX32, 13ns, CMOS, SIMM-64; 产品类别存储存储; 文件大小96KB，共9页; 制造商IDT (Integrated Device Technology)

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IDT7MP4036S13M概述

SRAM Module, 64KX32, 13ns, CMOS, SIMM-64

IDT7MP4036S13M规格参数

参数名称	属性值
厂商名称	IDT (Integrated Device Technology)
零件包装代码	SIMM
包装说明	,
针数	64
Reach Compliance Code	unknown
ECCN代码	3A991.B.2.A
最长访问时间	13 ns
JESD-30 代码	R-XSMA-N64
JESD-609代码	e0
内存密度	2097152 bit
内存集成电路类型	SRAM MODULE
内存宽度	32
功能数量	1
端子数量	64
字数	65536 words
字数代码	64000
工作模式	ASYNCHRONOUS
最高工作温度	70 °C
最低工作温度
组织	64KX32
封装主体材料	UNSPECIFIED
封装形状	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY
并行/串行	PARALLEL
认证状态	Not Qualified
最大供电电压 (Vsup)	5.5 V
最小供电电压 (Vsup)	4.5 V
标称供电电压 (Vsup)	5 V
表面贴装	NO
技术	CMOS
温度等级	COMMERCIAL
端子面层	TIN LEAD
端子形式	NO LEAD
端子位置	SINGLE

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64K x 32

CMOS Static RAM Module

Features

High-density 2MB Static RAM module

Low profile 64-pin ZIP (Zig-zag In-line vertical Package) or 64-

pin SIMM (Single In-line Memory Module)

Ultra fast access time: 12ns (max.)

Surface mounted plastic components on an epoxy laminate

(FR-4) substrate

Single 5V (±10%) power supply

Multiple GND pins and decoupling capacitors for maximum

noise immunity

Inputs/outputs directly TTL-compatible

IDT7MP4036

Description

The IDT7MP4036 is a 64K x 32 Static RAM module constructed on

an epoxy laminate (FR-4) substrate using eight 64K x 4 Static RAMs in

plastic SOJ packages. Availability of four chip select lines (one for each

group of two RAMs) provides byte access. Extremely fast speeds can be

achieved due to the use of 256K Static RAMs fabricated in IDT’s high-

performance, high-reliability CMOS technology. The IDT7MP4036 is

available with access time as fast as 12ns with minimal power consumption.

The IDT7MP4036 is packaged in a 64-pin FR-4 ZIP (Zig-zag In-line

vertical Package)or a 64-pin SIMM (Single In-line Memory Module). The

ZIP configuration allows 64 pins to be placed on a package 3.65 inches

long and 0.35 inches wide. At only 0.50 inches high, this low-profile

package is ideal for systems with minimum board spacing, while the SIMM

configuration allows use of edge mounted sockets to secure the module.

All inputs and outputs of the IDT7MP4036 are TTL-compatible and

operate from a single 5V supply. Full asynchronous circuitry requires no

clocks or refresh for operation and provides equal access and cycle times

for ease of use.

Two identification pins (PD

and PD

) are provided for applications in

which different density versions of the module are used. In this way, the

target system can read the respective levels of PD

and PD

to determine

a 64K depth.

Pin Configuration

(1)

I/O

GND

I/O

GND

I/O

GND

I/O

– OPEN

– GND

Pin Names

I/O

0-31

0-15

1-4

0-1

GND

Data Inputs/Outputs

Addresses

Chip Selects

Write Enable

Output Enable

Depth Identification

Power

Ground

No Connect

2682 tbl 01

2682 drw 02

ZIP, SIMM

Top View

NOTE:

1. Pins 2 and 3 (PD

and PD

) are read by the user to determine the density of

the module. If PD

reads Open and PD

reads GND, then the module had a

64K depth.

DECEMBER 1999

DSC-2682/6

IDT7MP4036S13M相似产品对比

	IDT7MP4036S13M	IDT7MP4036S25Z	IDT7MP4036S35Z	IDT7MP4036S35M	IDT7MP4036S15M	IDT7MP4036S15Z	IDT7MP4036S13Z	IDT7MP4036S20M	IDT7MP4036S25M
描述	SRAM Module, 64KX32, 13ns, CMOS, SIMM-64	SRAM Module, 64KX32, 25ns, CMOS, ZIP-64	SRAM Module, 64KX32, 35ns, CMOS, ZIP-64	SRAM Module, 64KX32, 35ns, CMOS, SIMM-64	SRAM Module, 64KX32, 15ns, CMOS, SIMM-64	SRAM Module, 64KX32, 15ns, CMOS, ZIP-64	SRAM Module, 64KX32, 13ns, CMOS, ZIP-64	SRAM Module, 64KX32, 20ns, CMOS, SIMM-64	SRAM Module, 64KX32, 25ns, CMOS, SIMM-64
厂商名称	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)	IDT (Integrated Device Technology)
零件包装代码	SIMM	ZIP	ZIP	SIMM	SIMM	ZIP	ZIP	SIMM	SIMM
包装说明	,	ZIP-64	ZIP-64	SIMM-64	SIMM-64	ZIP-64	ZIP-64	SIMM-64	SIMM-64
针数	64	64	64	64	64	64	64	64	64
Reach Compliance Code	unknown	not_compliant	not_compliant	not_compliant	not_compliant	not_compliant	compliant	not_compliant	not_compliant
ECCN代码	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A	3A991.B.2.A
最长访问时间	13 ns	25 ns	35 ns	35 ns	15 ns	15 ns	13 ns	20 ns	25 ns
JESD-30 代码	R-XSMA-N64	R-XZMA-T64	R-XZMA-T64	R-XSMA-N64	R-XSMA-N64	R-XZMA-T64	R-XZMA-T64	R-XSMA-N64	R-XSMA-N64
内存密度	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit	2097152 bit
内存集成电路类型	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE	SRAM MODULE
内存宽度	32	32	32	32	32	32	32	32	32
功能数量	1	1	1	1	1	1	1	1	1
端子数量	64	64	64	64	64	64	64	64	64
字数	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words	65536 words
字数代码	64000	64000	64000	64000	64000	64000	64000	64000	64000
工作模式	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS	ASYNCHRONOUS
最高工作温度	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C	70 °C
组织	64KX32	64KX32	64KX32	64KX32	64KX32	64KX32	64KX32	64KX32	64KX32
封装主体材料	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED	UNSPECIFIED
封装形状	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR	RECTANGULAR
封装形式	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY	MICROELECTRONIC ASSEMBLY
并行/串行	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL	PARALLEL
认证状态	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified	Not Qualified
最大供电电压 (Vsup)	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V	5.5 V
最小供电电压 (Vsup)	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V
标称供电电压 (Vsup)	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V	5 V
表面贴装	NO	NO	NO	NO	NO	NO	NO	NO	NO
技术	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS	CMOS
温度等级	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL	COMMERCIAL
端子形式	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD	THROUGH-HOLE	THROUGH-HOLE	NO LEAD	NO LEAD
端子位置	SINGLE	ZIG-ZAG	ZIG-ZAG	SINGLE	SINGLE	ZIG-ZAG	ZIG-ZAG	SINGLE	SINGLE
JESD-609代码	e0	e0	e0	-	-	e0	e0	-	e0
端子面层	TIN LEAD	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	-	Tin/Lead (Sn/Pb)	Tin/Lead (Sn/Pb)	-	TIN LEAD
是否Rohs认证	-	不符合	不符合	不符合	不符合	不符合	不符合	不符合	不符合
I/O 类型	-	COMMON	COMMON	COMMON	COMMON	COMMON	-	COMMON	COMMON
端口数量	-	1	1	1	1	1	-	1	1
输出特性	-	3-STATE	3-STATE	3-STATE	3-STATE	3-STATE	-	3-STATE	3-STATE
可输出	-	YES	YES	YES	YES	YES	-	YES	YES
封装代码	-	ZIP	ZIP	SIMM	SIMM	ZIP	-	SIMM	SIMM
封装等效代码	-	ZIP64/68,.1,.1	ZIP64/68,.1,.1	SSIM64	SSIM64	ZIP64/68,.1,.1	-	SSIM64	SSIM64
峰值回流温度（摄氏度）	-	225	225	225	225	NOT SPECIFIED	225	225	225
电源	-	5 V	5 V	5 V	5 V	5 V	-	5 V	5 V
座面最大高度	-	12.7 mm	12.7 mm	13.462 mm	13.462 mm	12.7 mm	-	13.462 mm	13.462 mm
最大待机电流	-	0.24 A	0.24 A	0.24 A	0.24 A	0.24 A	-	0.24 A	0.24 A
最小待机电流	-	4.5 V	4.5 V	4.5 V	4.5 V	4.5 V	-	4.5 V	4.5 V
最大压摆率	-	1.28 mA	1.28 mA	1.28 mA	1.28 mA	1.28 mA	-	1.28 mA	1.28 mA
端子节距	-	1.27 mm	1.27 mm	1.27 mm	1.27 mm	1.27 mm	-	1.27 mm	1.27 mm
处于峰值回流温度下的最长时间	-	30	30	NOT SPECIFIED	NOT SPECIFIED	NOT SPECIFIED	30	NOT SPECIFIED	30

IDT7MP4036S13M

IDT7MP4036S13M概述

IDT7MP4036S13M规格参数

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IDT7MP4036S13M相似产品对比

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