IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, QFN-10, Analog to Digital Converter
| 参数名称 | 属性值 |
| 是否Rohs认证 | 不符合 |
| 厂商名称 | ADI(亚德诺半导体) |
| 零件包装代码 | QFN |
| 包装说明 | QFN-10 |
| 针数 | 10 |
| Reach Compliance Code | unknown |
| ECCN代码 | EAR99 |
| 最大模拟输入电压 | 5.5 V |
| 最小模拟输入电压 | |
| 最长转换时间 | 1.6 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-PDSO-N10 |
| JESD-609代码 | e0 |
| 长度 | 3 mm |
| 最大线性误差 (EL) | 0.0031% |
| 模拟输入通道数量 | 1 |
| 位数 | 16 |
| 功能数量 | 1 |
| 端子数量 | 10 |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -40 °C |
| 输出位码 | BINARY |
| 输出格式 | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | VSON |
| 封装等效代码 | SOLCC10,.11,20 |
| 封装形状 | SQUARE |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE |
| 峰值回流温度（摄氏度） | NOT SPECIFIED |
| 电源 | 5 V |
| 认证状态 | Not Qualified |
| 采样速率 | 0.5 MHz |
| 采样并保持/跟踪并保持 | TRACK |
| 座面最大高度 | 0.8 mm |
| 标称供电电压 | 5 V |
| 表面贴装 | YES |
| 温度等级 | INDUSTRIAL |
| 端子面层 | TIN LEAD |
| 端子形式 | NO LEAD |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED |
| 宽度 | 3 mm |
| AD7686CCPWP | AD7686BCPRL7 | AD7686BCPWP | AD7686CCPRL7 | AD7686CRMRL2 | AD7686BRMRL2 | AD7686ARM-REEL7 | AD7686BCP | |
|---|---|---|---|---|---|---|---|---|
| 描述 | IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, QFN-10, Analog to Digital Converter | IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, QFN-10, Analog to Digital Converter | IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, QFN-10, Analog to Digital Converter | IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, QFN-10, Analog to Digital Converter | IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, MO-187BA, MSOP-10, Analog to Digital Converter | IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, MO-187BA, MSOP-10, Analog to Digital Converter | IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, PDSO10, MICRO, SOIC-10, Analog to Digital Converter | IC 1-CH 16-BIT SUCCESSIVE APPROXIMATION ADC, SERIAL ACCESS, DSO10, 3 X 3 MM, MICRO CSP-10, Analog to Digital Converter |
| 厂商名称 | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) | ADI(亚德诺半导体) |
| 零件包装代码 | QFN | QFN | QFN | QFN | TSSOP | TSSOP | SOIC | SOIC |
| 包装说明 | QFN-10 | QFN-10 | QFN-10 | QFN-10 | TSSOP, | TSSOP, | MICRO, SOIC-10 | 3 X 3 MM, MICRO CSP-10 |
| 针数 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| Reach Compliance Code | unknown | unknown | unknown | unknown | unknown | unknown | unknown | unknown |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最大模拟输入电压 | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5.5 V | 5 V | 5.8 V |
| 最长转换时间 | 1.6 µs | 1.6 µs | 1.6 µs | 1.6 µs | 1.6 µs | 1.6 µs | 2.2 µs | 2.2 µs |
| 转换器类型 | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION | ADC, SUCCESSIVE APPROXIMATION |
| JESD-30 代码 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-N10 | S-PDSO-G10 | S-PDSO-G10 | S-PDSO-G10 | S-XDSO-N10 |
| 长度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 2.995 mm | 3 mm |
| 最大线性误差 (EL) | 0.0031% | 0.0046% | 0.0046% | 0.0031% | 0.0031% | 0.0046% | 0.0046% | 0.0046% |
| 模拟输入通道数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 位数 | 16 | 16 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 10 | 10 | 10 | 10 | 10 | 10 | 10 | 10 |
| 最高工作温度 | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C | 85 °C |
| 最低工作温度 | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C | -40 °C |
| 输出位码 | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY | BINARY |
| 输出格式 | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL | SERIAL |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | UNSPECIFIED |
| 封装代码 | VSON | VSON | VSON | VSON | TSSOP | TSSOP | TSSOP | VSON |
| 封装形状 | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE | SQUARE |
| 封装形式 | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, VERY THIN PROFILE | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, THIN PROFILE, SHRINK PITCH | SMALL OUTLINE, VERY THIN PROFILE |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 采样速率 | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.5 MHz | 0.55 MHz | 0.5 MHz |
| 采样并保持/跟踪并保持 | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK | TRACK |
| 座面最大高度 | 0.8 mm | 0.8 mm | 0.8 mm | 0.8 mm | 1.1 mm | 1.1 mm | 1.09 mm | 1 mm |
| 标称供电电压 | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 5 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES | YES | YES |
| 温度等级 | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL | INDUSTRIAL |
| 端子形式 | NO LEAD | NO LEAD | NO LEAD | NO LEAD | GULL WING | GULL WING | GULL WING | NO LEAD |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 3 mm | 2.995 mm | 3 mm |
| 是否Rohs认证 | 不符合 | 不符合 | 不符合 | 不符合 | - | - | 不符合 | 不符合 |
| JESD-609代码 | e0 | e0 | e0 | e0 | - | - | e0 | e0 |
| 封装等效代码 | SOLCC10,.11,20 | SOLCC10,.11,20 | SOLCC10,.11,20 | SOLCC10,.11,20 | - | - | TSSOP10,.19,20 | SOLCC10,.11,20 |
| 峰值回流温度（摄氏度） | NOT SPECIFIED | 220 | NOT SPECIFIED | NOT SPECIFIED | - | - | 220 | 220 |
| 电源 | 5 V | 5 V | 5 V | 5 V | - | - | 3/5 V | 2.5/5 V |
| 端子面层 | TIN LEAD | TIN LEAD | TIN LEAD | TIN LEAD | - | - | Tin/Lead (Sn/Pb) | TIN LEAD |
| 处于峰值回流温度下的最长时间 | NOT SPECIFIED | 30 | NOT SPECIFIED | NOT SPECIFIED | - | - | 30 | 30 |
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