MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48
| 参数名称 | 属性值 |
| 厂商名称 | SAMSUNG(三星) |
| 零件包装代码 | TSOP1 |
| 包装说明 | TSOP1, |
| 针数 | 48 |
| Reach Compliance Code | compliant |
| ECCN代码 | EAR99 |
| 最长访问时间 | 100 ns |
| 备用内存宽度 | 8 |
| JESD-30 代码 | R-PDSO-G48 |
| 长度 | 16.4 mm |
| 内存密度 | 33554432 bit |
| 内存集成电路类型 | MASK ROM |
| 内存宽度 | 16 |
| 功能数量 | 1 |
| 端子数量 | 48 |
| 字数 | 2097152 words |
| 字数代码 | 2000000 |
| 工作模式 | ASYNCHRONOUS |
| 最高工作温度 | 85 °C |
| 最低工作温度 | -20 °C |
| 组织 | 2MX16 |
| 封装主体材料 | PLASTIC/EPOXY |
| 封装代码 | TSOP1 |
| 封装形状 | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL |
| 认证状态 | Not Qualified |
| 座面最大高度 | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V |
| 最小供电电压 (Vsup) | 3 V |
| 标称供电电压 (Vsup) | 3.3 V |
| 表面贴装 | YES |
| 技术 | CMOS |
| 温度等级 | OTHER |
| 端子形式 | GULL WING |
| 端子节距 | 0.5 mm |
| 端子位置 | DUAL |
| 宽度 | 12 mm |
| K3P6V1000D-YE | K3P6U1000D-YC | K3P6S1000D-YC | K3P6U1000D-YE | K3P6V1000D-YC | K3P6S1000D-YE | |
|---|---|---|---|---|---|---|
| 描述 | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 100ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 | MASK ROM, 2MX16, 150ns, CMOS, PDSO48, 12 X 18 MM, TSOP1-48 |
| 厂商名称 | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) | SAMSUNG(三星) |
| 零件包装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
| 包装说明 | TSOP1, | TSOP1, | 12 X 18 MM, TSOP1-48 | TSOP1, | TSOP1, | TSOP1, |
| 针数 | 48 | 48 | 48 | 48 | 48 | 48 |
| Reach Compliance Code | compliant | compliant | compliant | compliant | compliant | compliant |
| ECCN代码 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 | EAR99 |
| 最长访问时间 | 100 ns | 100 ns | 150 ns | 100 ns | 100 ns | 150 ns |
| 备用内存宽度 | 8 | 8 | 8 | 8 | 8 | 8 |
| JESD-30 代码 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 | R-PDSO-G48 |
| 长度 | 16.4 mm | 16.4 mm | 16.4 mm | 16.4 mm | 16.4 mm | 16.4 mm |
| 内存密度 | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit | 33554432 bit |
| 内存集成电路类型 | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM | MASK ROM |
| 内存宽度 | 16 | 16 | 16 | 16 | 16 | 16 |
| 功能数量 | 1 | 1 | 1 | 1 | 1 | 1 |
| 端子数量 | 48 | 48 | 48 | 48 | 48 | 48 |
| 字数 | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words | 2097152 words |
| 字数代码 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 | 2000000 |
| 工作模式 | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS | ASYNCHRONOUS |
| 最高工作温度 | 85 °C | 70 °C | 70 °C | 85 °C | 70 °C | 85 °C |
| 组织 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 | 2MX16 |
| 封装主体材料 | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY | PLASTIC/EPOXY |
| 封装代码 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 | TSOP1 |
| 封装形状 | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR | RECTANGULAR |
| 封装形式 | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE | SMALL OUTLINE, THIN PROFILE |
| 并行/串行 | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL | PARALLEL |
| 认证状态 | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified | Not Qualified |
| 座面最大高度 | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm | 1.2 mm |
| 最大供电电压 (Vsup) | 3.6 V | 3.3 V | 2.7 V | 3.3 V | 3.6 V | 2.7 V |
| 最小供电电压 (Vsup) | 3 V | 2.7 V | 2.3 V | 2.7 V | 3 V | 2.3 V |
| 标称供电电压 (Vsup) | 3.3 V | 3 V | 2.5 V | 3 V | 3.3 V | 2.5 V |
| 表面贴装 | YES | YES | YES | YES | YES | YES |
| 技术 | CMOS | CMOS | CMOS | CMOS | CMOS | CMOS |
| 温度等级 | OTHER | COMMERCIAL | COMMERCIAL | OTHER | COMMERCIAL | OTHER |
| 端子形式 | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING | GULL WING |
| 端子节距 | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm | 0.5 mm |
| 端子位置 | DUAL | DUAL | DUAL | DUAL | DUAL | DUAL |
| 宽度 | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm | 12 mm |
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